PROTECTED POLYMERIC FILM
    4.
    发明申请
    PROTECTED POLYMERIC FILM 有权
    保护聚合物膜

    公开(公告)号:US20080241506A1

    公开(公告)日:2008-10-02

    申请号:US12136835

    申请日:2008-06-11

    IPC分类号: B32B33/00 B32B5/22

    摘要: A protected polymeric film comprises a polymeric film substrate having a first major surface and a second major surface opposite the first major surface, and a protective structure provided on at least the first major surface of the substrate, wherein the protective structure comprises a layer of boron oxide and an inorganic barrier layer. A protective structure may also be provided on the second major surface of the substrate. Organic electronic components may be formed on or attached to the protected polymeric films.

    摘要翻译: 受保护的聚合物膜包括具有第一主表面和与第一主表面相对的第二主表面的聚合物膜基材和在基材的至少第一主表面上提供的保护结构,其中保护结构包含一层硼 氧化物和无机阻挡层。 还可以在衬底的第二主表面上提供保护结构。 有机电子部件可以形成在受保护的聚合物膜上或附着于被保护的聚合物膜上。

    MOISTURE BARRIER COATINGS FOR ORGANIC LIGHT EMITTING DIODE DEVICES
    5.
    发明申请
    MOISTURE BARRIER COATINGS FOR ORGANIC LIGHT EMITTING DIODE DEVICES 审中-公开
    用于有机发光二极管装置的水分阻挡涂层

    公开(公告)号:US20090252894A1

    公开(公告)日:2009-10-08

    申请号:US12482474

    申请日:2009-06-11

    IPC分类号: C23C16/513

    CPC分类号: H01L51/5237 H01L51/5256

    摘要: A barrier assembly having a flexible or rigid substrate, an organic electronic device, and one or more layers of diamond-like film. The diamond-like film layers can be used to mount, cover, encapsulate or form composite assemblies for protection of moisture or oxygen sensitive articles such as organic light emitting diode devices, photovoltaic devices, organic transistors, and inorganic thin film transistors. The diamond-like film layers can also provide for edge sealing of adhesive bond lines in the assemblies.

    摘要翻译: 具有柔性或刚性基底,有机电子器件和一层或多层类金刚石膜的屏障组件。 类金刚石膜层可用于安装,覆盖,封装或形成复合组件,以保护湿气或氧气敏感物品如有机发光二极管器件,光伏器件,有机晶体管和无机薄膜晶体管。 类金刚石膜层还可以提供组件中粘合剂粘合线的边缘密封。

    MOISTURE BARRIER COATINGS FOR ORGANIC LIGHT EMITTING DIODE DEVICES
    7.
    发明申请
    MOISTURE BARRIER COATINGS FOR ORGANIC LIGHT EMITTING DIODE DEVICES 审中-公开
    用于有机发光二极管装置的水分阻挡涂层

    公开(公告)号:US20080006819A1

    公开(公告)日:2008-01-10

    申请号:US11424997

    申请日:2006-06-19

    IPC分类号: H01L29/08 H01L35/24 H01L51/00

    CPC分类号: H01L51/5237 H01L51/5256

    摘要: A barrier assembly having a flexible or rigid substrate, an organic electronic device, and one or more layers of diamond-like film. The diamond-like film layers can be used to mount, cover, encapsulate or form composite assemblies for protection of moisture or oxygen sensitive articles such as organic light emitting diode devices, photovoltaic devices, organic transistors, and inorganic thin film transistors. The diamond-like film layers can also provide for edge sealing of adhesive bond lines in the assemblies.

    摘要翻译: 具有柔性或刚性基底,有机电子器件和一层或多层类金刚石膜的屏障组件。 类金刚石膜层可用于安装,覆盖,封装或形成复合组件,以保护湿气或氧气敏感物品如有机发光二极管器件,光伏器件,有机晶体管和无机薄膜晶体管。 类金刚石膜层还可以提供组件中粘合剂粘合线的边缘密封。

    Protected polymeric film
    8.
    发明授权
    Protected polymeric film 有权
    受保护的聚合物膜

    公开(公告)号:US07468211B2

    公开(公告)日:2008-12-23

    申请号:US12136835

    申请日:2008-06-11

    IPC分类号: B32B9/00

    摘要: A protected polymeric film comprises a polymeric film substrate having a first major surface and a second major surface opposite the first major surface, and a protective structure provided on at least the first major surface of the substrate, wherein the protective structure comprises a layer of boron oxide and an inorganic barrier layer. A protective structure may also be provided on the second major surface of the substrate. Organic electronic components may be formed on or attached to the protected polymeric films.

    摘要翻译: 受保护的聚合物膜包括具有第一主表面和与第一主表面相对的第二主表面的聚合物膜基材和在基材的至少第一主表面上提供的保护结构,其中保护结构包含一层硼 氧化物和无机阻挡层。 还可以在衬底的第二主表面上提供保护结构。 有机电子部件可以形成在受保护的聚合物膜上或附着于被保护的聚合物膜上。