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公开(公告)号：US20190006612A1
公开(公告)日：2019-01-03
申请号：US15500300
申请日：2017-01-22
Inventor： Yunan Zhang , Yawei Liu
Abstract: Disclosed is an organic light-emitting diode structure which includes a substrate, an optically-modified layer, a planarization layer, a pixel definition layer, and an organic light-emitting layer. The optically-modified layer can improve non-uniform luminance of OLEDs manufactured based on the ink-jet printing technology.
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公开(公告)号：US10038042B2
公开(公告)日：2018-07-31
申请号：US14655720
申请日：2015-04-01
Inventor： Yawei Liu , Yifan Wang
CPC classification number: H01L27/3262 , H01L27/1214 , H01L27/322 , H01L27/3248 , H01L51/0003 , H01L51/001 , H01L51/0035 , H01L51/0061 , H01L51/0067 , H01L51/007 , H01L51/0072 , H01L51/0073 , H01L51/0085 , H01L51/5012 , H01L51/5016 , H01L51/5024 , H01L51/504 , H01L51/5056 , H01L51/5072 , H01L51/524 , H01L2051/0063 , H01L2251/5338 , H01L2251/5376
Abstract: The present invention provides an OLED color display device, comprising a substrate (1), an anode (11), a thin film transistor array (21), a Hole Injection Layer (22), a Hole Transport Layer (23), a light emitting layer (3), an Electron Transport Layer (24), a cathode (12), a package cover plate (2), a color conversion layer (4) and a seal frame (5); the light emitting layer (3) comprises a first light emitting layer (31) and the second light emitting layer (32), and both the first light emitting layer (31) and the second light emitting layer (32) are manufactured by host material doped with guest material, and the guest material comprises luminescent material and electron transport material; the first light emitting layer (31) is a blue light emitting layer, and the second light emitting layer (32) is a red, green lights commonly emitting layer, a yellow light emitting layer or a green light emitting layer; lights emitted by the first light emitting layer (31) and the second light emitting layer (32) synthesize white light or blue, green light possessing higher energy efficiency and luminescence efficiency. The power consumption is low.
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公开(公告)号：US20180105924A1
公开(公告)日：2018-04-19
申请号：US15112426
申请日：2016-04-25
IPC: C23C14/24
CPC classification number: C23C14/243
Abstract: The present invention provides a vapor deposition crucible, comprising a metal bar with material cut by mechanical processing, during the mechanical processing of the metal bar, retaining a portion of thermal conduction structure to transfer heat to center of the crucible, like increasing an inner surface area of the sidewall of the crucible, or arrange a thermal conduction structure like a thermal conduction bar or a thermal conduction plate, to increase contact surface area between evaporation material and the vapor deposition crucible, result in evaporation material to be evenly heated, stabilize the evaporation speed, and then improve the effect of the vapor deposition.
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公开(公告)号：US20180044776A1
公开(公告)日：2018-02-15
申请号：US15032046
申请日：2016-02-26
CPC classification number: C23C14/26 , C23C14/12 , C23C14/243 , C23C14/54 , H01L51/001 , H01L51/56
Abstract: The present invention provides a vacuum deposition heating device, which includes a heating device outer wall (3), a crucible (1) disposed inside the heating device outer wall (3), and a crucible cover (2) positioned on the crucible (1). A primary heating coil (11) is arranged between the crucible (1) and the heating device outer wall (3) and corresponds to outer circumferences of the crucible (1) and the crucible cover (2). The crucible cover (2) has a center in which a jet opening (20) that extends through top and bottom surfaces of the crucible cover (2) is formed. The crucible cover (2) is provided thereon with a secondary heating coil (21) corresponding to an outer circumference of the jet opening (20). The primary heating coil (11) and the secondary heating coil (21) are electrically connected to a power supply and can be controlled individually and independently for heating, so as to effectively reduce a temperature difference in the crucible in a horizontal radial direction to prevent opening jamming and allow for expansion of diameter to thereby increase the amount of material applied, reduce the times of chamber opening, increase manufacturing efficiency. In addition, the structure is simple and the manufacture thereof is easy.
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公开(公告)号：US09660210B2
公开(公告)日：2017-05-23
申请号：US14424009
申请日：2014-10-31
Inventor： Yawei Liu , Yifan Wang
CPC classification number: H01L51/5036 , C09K11/025 , H01L27/1214 , H01L27/3213 , H01L27/3262 , H01L51/0003 , H01L51/001 , H01L51/0035 , H01L51/0037 , H01L51/0061 , H01L51/0067 , H01L51/0072 , H01L51/0081 , H01L51/502 , H01L51/5056 , H01L51/5072 , H01L51/5246 , H01L51/56 , H01L2227/323
Abstract: The present invention provides a method for manufacturing an OLED device and an OLED device manufactured therewith. The method for manufacturing an OLED device includes: (1) providing a substrate and forming, in sequence, an anode and a hole transporting layer on the substrate; (2) forming an emissive layer on the hole transporting layer through a solution film casting process, wherein the emissive layer comprises a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel, of which at least one sub-pixel is formed of a quantum dot and at least one sub-pixel is formed of an organic light-emitting material; (3) forming, in sequence, an electron transporting layer and a cathode on the emissive layer; and (4) providing a package cover plate, which is set above the cathode, wherein the substrate and the package cover plate are bonded together by sealing enclosing resin to complete packaging of the OLED device. Since each sub-pixel of the emissive layer is formed through a solution film casting process, the manufacture of the OLED device requires no use of a fine metal mask so that the manufacturing cost is low, the utilization rate of material is high, and the yield rate is good.
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Patent Agency Ranking
公开(公告)号：US09614177B2
公开(公告)日：2017-04-04
申请号：US14426986
申请日：2014-09-19
Inventor： Jiajia Qian , Yawei Liu , Chihche Liu , Taipi Wu
CPC classification number: H01L51/5246 , H01L27/3244 , H01L51/001 , H01L51/5259 , H01L51/56 , H01L2227/323 , H01L2251/303
Abstract: The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: providing a substrate (1) to be packaged, and a package cover plate (2); forming an inorganic protective frame (11) in a round at the edges of the substrate (1); manufacturing an OLED element (12) on the substrate (1) inside the inorganic protective frame (11); pasting a solid glue film (21) on the package cover plate (2); forming an adhesive (22) in a round on the package cover plate (2) corresponding to a location of the inorganic protective frame (11); oppositely attaching the substrate (1) and the package cover plate (2), and the substrate (1) and the package cover plate (2) are affixed together by the solid glue film (21) and the adhesive (22) to accomplish the package to the substrate (1) with the package cover plate (2).
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公开(公告)号：US09276225B2
公开(公告)日：2016-03-01
申请号：US14241395
申请日：2014-01-21
Inventor： Yawei Liu
CPC classification number: H01L51/0097 , C09K11/06 , C09K2211/1011 , C09K2211/1029 , H01L51/0035 , H01L51/004 , H01L51/005 , H01L51/0072 , H01L51/5012 , H01L51/5056 , H01L51/5072 , H01L51/5096 , H01L51/5206 , H01L51/5221 , H01L51/5246 , H01L51/5256 , H01L51/5275 , H01L2251/301 , H01L2251/303 , H01L2251/5338
Abstract: The present disclosure relates to an electroluminescent diode device, comprising a transparent flexible substrate which is successively disposed with a first protective layer, an anode, a hole transport layer, a UV light emitting layer, a hole blocking layer, an electron transport layer, and a cathode, wherein the UV light emitting layer comprises a UV light emitting material which is at least one selected from the group consisting of fluorenes, triphenylamines, and quinquephenyls.
Abstract translation: 本发明涉及一种电致发光二极管器件，其包括依次配置有第一保护层，阳极，空穴传输层，UV发光层，空穴阻挡层，电子传输层和 阴极，其中所述UV发光层包括UV发光材料，所述UV发光材料是选自由芴，三苯胺和五氟苯基组成的组中的至少一种。
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公开(公告)号：US20150129843A1
公开(公告)日：2015-05-14
申请号：US14240337
申请日：2014-01-22
Inventor： Yawei Liu
CPC classification number: H01L51/5243 , H01L27/3202 , H01L27/3204 , H01L51/0097 , H01L51/5246 , H01L51/5253 , H01L51/56 , H01L2251/5338
Abstract: The present disclosure relates to an organic light-emitting diode (OLED) device and the method for manufacturing the same. The OLED device includes an OLED substrate, on the inner surface of which a plurality of OLEDs are arranged; and a package substrate arranged opposite to the inner surface of the OLED substrate, wherein the OLED substrate and the package substrate are welded and hermetically connected together through a metal solder located therebetween, so that the OLEDs are hermetically packaged between the OLED substrate and the package substrate. In this OLED device, the OLED substrate and the package substrate are hermetically connected together by using the metal solder, so that water and the oxygen can be prevented from entering a sealed area from the exterior, thus prolonging the service life of the OLED device.
Abstract translation: 本公开涉及一种有机发光二极管（OLED）装置及其制造方法。 OLED器件包括OLED衬底，其内表面上布置有多个OLED; 以及与OLED衬底的内表面相对布置的封装衬底，其中OLED衬底和封装衬底通过位于其间的金属焊料焊接并气密连接在一起，使得OLED被气密地封装在OLED衬底和封装之间 基质。 在该OLED器件中，通过使用金属焊料将OLED基板和封装基板气密地连接在一起，从而可以防止水和氧气进入外部的密封区域，从而延长OLED器件的使用寿命。
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9.发明授权公开(公告)号：US10319910B2
公开(公告)日：2019-06-11
申请号：US15324507
申请日：2016-10-24
Inventor： Yunan Zhang , Yawei Liu
Abstract: Provided is a multilayer-structured organic electroluminescent diode, and a method of manufacturing a hole transporting layer thereof. The hole transporting layer included in the organic electroluminescent diode is a thin film formed through electrochemical polymerization. The method of manufacturing the hole transporting layer includes the steps of: preparing an electrolyte; electro-polymerizing the electrolyte; controlling thickness of an electropolymerized film; and washing and drying the electropolymerized film as obtained. Specific electropolymerization parameters are set to finely regulate a crosslinking degree and reactivity of the electropolymerized film, thereby solving a prior-art problem that the crosslinking degree and reactivity of a polymer or small molecule hole transporting material in a film state cannot be effectively controlled.
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公开(公告)号：US20180033964A1
公开(公告)日：2018-02-01
申请号：US14912928
申请日：2016-01-29
Inventor： Yawei Liu , Tsungyuan Wu
CPC classification number: H01L51/0004 , H01L21/042 , H01L27/32 , H01L51/0005 , H01L51/5056 , H01L51/5072 , H01L51/52 , H01L51/56
Abstract: The invention provides a recess structure for print deposition process and manufacturing method thereof. By disposing the dam (2) enclosing the recess (3) as comprising at least two stacked branch dam layers, and increasing the contact angle between the inclined inner circumferential surface of recess (3) enclosed by the branch dam layers and ink in a layer-by-layer manner, to limit height the ink able to climb on the inclined inner circumferential surface of the recess (3), the invention can improve the thickness uniformity of the organic functional layers printed in the recess and the photoelectric properties of organic functional layers. The recess (3) fabricated by the manufacturing method can limit height the ink able to climb on inclined inner circumferential surface of the recess (3) to improve the thickness uniformity of the organic functional layers printed in the recess and the photoelectric properties of organic functional layers.
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