摘要:
Embodiments in accordance with the present invention allow a second end-point determination (EPD) system to actively control the end-pointing of a semiconductor process chamber, by leveraging a legacy EPD system that is already integrated with the chamber. In one embodiment, the second EPD system controls a shutter that regulates the amount of light transmitted between a plasma light source and an optical emission spectroscopy (OES) sensor of the legacy OES EPD system. In this embodiment, the legacy OES EPD system is pre-configured to call end-point when an artificial end-point condition occurs, i.e. the intensity of light falls below a pre-set threshold. When the second EPD system determines an actual end-point condition has been reached, it closes the shutter which, causes the light intensity being read by the OES sensor to fall below the pre-set threshold. This in turn triggers an end-point command to the chamber from the legacy OES EPD system.
摘要:
Embodiments in accordance with the present invention allow a second end-point determination (EPD) system to actively control the end-pointing of a semiconductor process chamber, by leveraging a legacy EPD system that is already integrated with the chamber. In one embodiment, the second EPD system controls a shutter that regulates the amount of light transmitted between a plasma light source and an optical emission spectroscopy (OES) sensor of the legacy OES EPD system. In this embodiment, the legacy OES EPD system is pre-configured to call end-point when an artificial end-point condition occurs, i.e. the intensity of light falls below a pre-set threshold. When the second EPD system determines an actual end-point condition has been reached, it closes the shutter which, causes the light intensity being read by the OES sensor to fall below the pre-set threshold. This in turn triggers an end-point command to the chamber from the legacy OES EPD system.
摘要:
Leaks in a processing chamber, including “virtual leaks” resulting from outgassing of material present within the chamber, may be detected utilizing an optical emission spectroscopy (OES) sensor configured to monitor light emitted from plasma of a sample from the chamber. According to certain embodiments, gas introduced into the chamber by the leak may be detected directly on the basis of its optical spectrum. Alternatively, gas introduced by the leak may be detected indirectly, based upon an optical spectrum of a material resulting from reaction of the gas attributable to the leak. According to one embodiment, data from the OES sensor is received by a processor that is configured to compute a leak detection index. The value of the leak detection index is compared against a threshold to determine if a leak is detected. If the value of the index crosses the threshold, a notification of the existence of a leak is sent.