Proton conducting membrane, method for producing the same and fuel cell using the same
    1.
    发明申请
    Proton conducting membrane, method for producing the same and fuel cell using the same 审中-公开
    质子导电膜,其制造方法和使用其的燃料电池

    公开(公告)号:US20060035129A1

    公开(公告)日:2006-02-16

    申请号:US10540564

    申请日:2004-02-05

    IPC分类号: C08J5/22

    摘要: A proton conducting membrane having a high ionic conductivity and an excellent high temperature dimensional stability which can perform stably even at high temperatures, a method for producing the same and a solid polymer-based fuel cell comprising same are provided. In other words, the present invention concerns a method for producing a proton conducting membrane having a crosslinked structure formed by a silicon-oxygen covalent bond and having a sulfonic acid-containing crosslinked structure represented by the following formula (1) therein, which comprises a first step of preparing a mixture containing a mercapto group-containing oligomer (A) having a plurality of mercapto groups and a reactive group which can form a Si—O—Si bond by condensation reaction, a second step of forming said mixture into a membrane, a third step of subjecting said membrane-like material to condensation reaction in the presence of a catalyst to obtain a crosslinked gel and a fourth step of oxidizing the mercapto group in the membrane so that it is converted to a sulfonic acid group, a proton conducting membrane obtained by same and a fuel cell comprising same:

    摘要翻译: 提供了具有高离子导电性和优异的高温尺寸稳定性的质子传导膜,即使在高温下也能稳定地进行,其制造方法以及包含该固体聚合物的燃料电池。 换句话说,本发明涉及一种制造具有由硅 - 氧共价键形成的交联结构并具有由下式(1)表示的含磺酸交联结构的质子传导膜的方法,该方法包括: 制备含有具有多个巯基的含巯基低聚物(A)和通过缩合反应形成Si-O-Si键的反应性基团的混合物的混合物的第一步骤,将所述混合物形成膜 第三步,在催化剂存在下对所述膜状材料进行缩合反应,得到交联凝胶,第四步是将膜中的巯基氧化成磺酸基,质子 由其获得的导电膜和包含该膜的燃料电池:

    Method For Processing Outer Periphery Of Substrate And Apparatus Thereof
    2.
    发明申请
    Method For Processing Outer Periphery Of Substrate And Apparatus Thereof 审中-公开
    用于处理基板外围的方法及其设备

    公开(公告)号:US20080073324A1

    公开(公告)日:2008-03-27

    申请号:US11631795

    申请日:2005-07-08

    IPC分类号: H01L21/306

    摘要: To make an arrangement so as not to give any damage to the central part of a substrate during the operation for removing unnecessary film coated on the outer peripheral part of the substrate. The stage is provided therein with a refrigerant chamber 41 as a heat absorber and a refrigerant such as water is filled in the chamber. A wafer 90 is contacted with and supported on the support surface 10a of the stage 10. A reactive gas for removing unnecessary film is supplied the outer periphery of the wafer 90 through a reactive gas jet port 30b while heating the outer periphery of the wafer 90. On the other hand, the area inside the outer peripheral part of the wafer 90 is heat-absorbed by the heat absorber.

    摘要翻译: 为了在用于去除涂布在基板的外周部分上的不必要的膜的操作期间不对基板的中心部分造成任何损坏的布置。 在其中设置有作为吸热器的制冷剂室41,并且诸如水的制冷剂填充在室中。 晶片90与载物台10的支撑表面10a相接触并被支撑。 用于除去不需要的膜的反应性气体通过反应性气体喷射口30b供给到晶片90的外周,同时加热晶片90的外周。 另一方面,晶片90的外周部分内的区域被吸热体热吸收。

    METHOD FOR PROCESSING OUTER PERIPHERY OF SUBSTRATE AND APPARATUS THEREOF
    3.
    发明申请
    METHOD FOR PROCESSING OUTER PERIPHERY OF SUBSTRATE AND APPARATUS THEREOF 审中-公开
    用于处理基板的外部外围设备及其设备的方法

    公开(公告)号:US20080017613A1

    公开(公告)日:2008-01-24

    申请号:US11779142

    申请日:2007-07-17

    IPC分类号: C23C16/00

    CPC分类号: H01L21/6708 H01L21/67069

    摘要: To enhance a removing efficiency of unnecessary matters on a peripheral part of a substrate (90) such as wafer and to prevent particles from adhering to the substrate (90). A reactive gas is jetted out from a jet nozzle (75) toward a target spot (P) of the peripheral part of the substrate (90) in such a way that the reactive gas is made to flow approximately along a circumferential direction at the target spot (P) of the substrate (90) as viewed from a direction orthogonal to the substrate (90). Gases near the target spot (P) are sucked by a suction nozzle (76) along approximately the circumferential direction at a downstream side of the target spot (P).

    摘要翻译: 为了提高在诸如晶片的基板(90)的周边部分上的不必要的物质的去除效率,并且防止颗粒粘附到基板(90)上。 从喷嘴(75)向基板(90)的周边部分的目标点(P)喷射反应气体,使得反应性气体大致沿着圆周方向流过靶 从与基板(90)正交的方向观察时,基板(90)的点(P)。 目标点(P)附近的气体在目标点(P)的下游侧沿着大致圆周方向被吸嘴76吸引。