Exposure apparatus and device fabrication method
    1.
    发明授权
    Exposure apparatus and device fabrication method 有权
    曝光装置和装置制造方法

    公开(公告)号:US08319942B2

    公开(公告)日:2012-11-27

    申请号:US12553703

    申请日:2009-09-03

    IPC分类号: G03B27/42 G03B27/58

    摘要: The present invention provides an apparatus including a calculating unit which calculates a first time serving as a time required to drive a stage in a non-scanning direction perpendicular to a scanning direction, and a second time serving as a time required to drive the stage in the scanning direction, both of which range from when exposure of one of the plurality of shot regions ends until exposure of the next shot region starts, and an adjusting unit which adjusts, when the first time is longer than the second time, one of a time for which an acceleration of the stage nonlinearly changes in the process of reversing the scanning direction, and a settling time taken for the stage to settle from when acceleration of the stage ends until exposure starts, so that the second time becomes longer than the first time in driving the stage in the scanning direction.

    摘要翻译: 本发明提供了一种装置,包括:计算单元,其计算第一次作为在垂直于扫描方向的非扫描方向上驱动载物台所需的时间,以及第二时间作为驱动载物台所需的时间 所述扫描方向从所述多个拍摄区域中的一个的曝光结束直到所述下一个拍摄区域的曝光开始的范围为止;以及调整单元,当所述第一时间比所述第二时间长时, 在反转扫描方向的过程中舞台的加速度非线性地变化的时间,以及当舞台的加速结束直到曝光开始时阶段结束所需的建立时间,使得第二时间变得比第一次 在扫描方向驱动舞台的时间。

    EXPOSURE APPARATUS AND DEVICE FABRICATION METHOD
    2.
    发明申请
    EXPOSURE APPARATUS AND DEVICE FABRICATION METHOD 有权
    曝光装置和装置制造方法

    公开(公告)号:US20100060872A1

    公开(公告)日:2010-03-11

    申请号:US12553703

    申请日:2009-09-03

    IPC分类号: G03B27/42 G03B27/54

    摘要: The present invention provides an apparatus including a calculating unit which calculates a first time serving as a time required to drive a stage in a non-scanning direction perpendicular to a scanning direction, and a second time serving as a time required to drive the stage in the scanning direction, both of which range from when exposure of one of the plurality of shot regions ends until exposure of the next shot region starts, and an adjusting unit which adjusts, when the first time is longer than the second time, one of a time for which an acceleration of the stage nonlinearly changes in the process of reversing the scanning direction, and a settling time taken for the stage to settle from when acceleration of the stage ends until exposure starts, so that the second time becomes longer than the first time in driving the stage in the scanning direction.

    摘要翻译: 本发明提供了一种装置,包括:计算单元,其计算第一次作为在垂直于扫描方向的非扫描方向上驱动载物台所需的时间,以及第二时间作为驱动载物台所需的时间 所述扫描方向从所述多个拍摄区域中的一个的曝光结束直到所述下一个拍摄区域的曝光开始的范围为止;以及调整单元,当所述第一时间比所述第二时间长时, 在反转扫描方向的过程中舞台的加速度非线性地变化的时间,以及当舞台的加速结束直到曝光开始时阶段结束所需的建立时间,使得第二时间变得比第一次 在扫描方向驱动舞台的时间。

    Exposure system, device production method, semiconductor production factory, and exposure apparatus maintenance method
    3.
    发明授权
    Exposure system, device production method, semiconductor production factory, and exposure apparatus maintenance method 失效
    曝光系统,装置生产方法,半导体生产工厂和曝光装置维修方法

    公开(公告)号:US06889014B2

    公开(公告)日:2005-05-03

    申请号:US10187282

    申请日:2002-07-02

    申请人: Shin Takano

    发明人: Shin Takano

    IPC分类号: G03F7/20 H01L21/027 G03G15/00

    摘要: An exposure system includes a wafer processing apparatus for performing a preparation-for-exposure process on a wafer before an exposure process is performed, an exposure apparatus for performing the exposure process on the wafer subjected to the preparation-for-exposure process performed by the wafer processing apparatus, wherein the exposure apparatus also performs a calibration process to correct an error caused by a time-varying environmental parameter and/or caused by the exposure apparatus itself, and a host computer connected to the wafer processing apparatus and the exposure apparatus via communication means. Depending on the time needed for the wafer processing apparatus to perform the preparation-for-exposure process, the host computer outputs a calibration execution command for performing the calibration process to the exposure apparatus. Thereby, the total time from the start of processing a lot to the end thereof is minimized and thus, the total throughput is improved.

    摘要翻译: 曝光系统包括:晶片处理装置,用于在执行曝光处理之前对晶片进行曝光准备处理;曝光装置,用于对经过由曝光处理执行的曝光准备处理的晶片进行曝光处理; 晶片处理装置,其中曝光装置还执行校正处理以校正由时变环境参数引起的误差和/或由曝光装置本身引起的误差,以及连接到晶片处理装置和曝光装置的主计算机经由 沟通方式。 根据晶片处理装置执行准备曝光处理所需的时间,主计算机向曝光装置输出用于执行校准处理的校准执行命令。 因此,从处理开始到结束的总时间最小化,从而提高总吞吐量。

    Semiconductor manufacturing apparatus and device manufacturing method
    4.
    发明授权
    Semiconductor manufacturing apparatus and device manufacturing method 有权
    半导体制造装置及器件制造方法

    公开(公告)号:US06580958B1

    公开(公告)日:2003-06-17

    申请号:US09444515

    申请日:1999-11-22

    申请人: Shin Takano

    发明人: Shin Takano

    IPC分类号: G06F1900

    CPC分类号: H01L21/67276

    摘要: Wafers are sequentially loaded, exposed, and unloaded. When a wafer exposed or being exposed is to be recovered in a carrier in a predetermined case, a storage section stores information for specifying the slot of the carrier in which the recovered wafer is stored and information associated with the wafer in correspondence with each other. When the wafer recovered is the first wafer recovered in the lot to which the wafer belongs, and a wafer is already present in the carrier, a new carrier is set in place of the wafer in accordance with an output, and the wafer is recovered in the new carrier.

    摘要翻译: 晶片顺序加载,曝光和卸载。 当在预定的情况下,在载体中回收暴露或露出的晶片时,存储部分相互对应地存储用于指定存储了回收的晶片的载体的槽的信息和与晶片相关联的信息。 当回收的晶片是在晶片所属的批次中回收的第一晶片,并且晶片已经存在于载体中时,根据输出设置新的载体来代替晶片,并且晶片被回收 新的载体。