摘要:
The present invention provides an apparatus including a calculating unit which calculates a first time serving as a time required to drive a stage in a non-scanning direction perpendicular to a scanning direction, and a second time serving as a time required to drive the stage in the scanning direction, both of which range from when exposure of one of the plurality of shot regions ends until exposure of the next shot region starts, and an adjusting unit which adjusts, when the first time is longer than the second time, one of a time for which an acceleration of the stage nonlinearly changes in the process of reversing the scanning direction, and a settling time taken for the stage to settle from when acceleration of the stage ends until exposure starts, so that the second time becomes longer than the first time in driving the stage in the scanning direction.
摘要:
The present invention provides an apparatus including a calculating unit which calculates a first time serving as a time required to drive a stage in a non-scanning direction perpendicular to a scanning direction, and a second time serving as a time required to drive the stage in the scanning direction, both of which range from when exposure of one of the plurality of shot regions ends until exposure of the next shot region starts, and an adjusting unit which adjusts, when the first time is longer than the second time, one of a time for which an acceleration of the stage nonlinearly changes in the process of reversing the scanning direction, and a settling time taken for the stage to settle from when acceleration of the stage ends until exposure starts, so that the second time becomes longer than the first time in driving the stage in the scanning direction.
摘要:
An exposure system includes a wafer processing apparatus for performing a preparation-for-exposure process on a wafer before an exposure process is performed, an exposure apparatus for performing the exposure process on the wafer subjected to the preparation-for-exposure process performed by the wafer processing apparatus, wherein the exposure apparatus also performs a calibration process to correct an error caused by a time-varying environmental parameter and/or caused by the exposure apparatus itself, and a host computer connected to the wafer processing apparatus and the exposure apparatus via communication means. Depending on the time needed for the wafer processing apparatus to perform the preparation-for-exposure process, the host computer outputs a calibration execution command for performing the calibration process to the exposure apparatus. Thereby, the total time from the start of processing a lot to the end thereof is minimized and thus, the total throughput is improved.
摘要:
Wafers are sequentially loaded, exposed, and unloaded. When a wafer exposed or being exposed is to be recovered in a carrier in a predetermined case, a storage section stores information for specifying the slot of the carrier in which the recovered wafer is stored and information associated with the wafer in correspondence with each other. When the wafer recovered is the first wafer recovered in the lot to which the wafer belongs, and a wafer is already present in the carrier, a new carrier is set in place of the wafer in accordance with an output, and the wafer is recovered in the new carrier.