公开(公告)号：US20080266104A1

公开(公告)日：2008-10-30

申请号：US11742560

申请日：2007-04-30

申请人： Shin-Chang Chen ,  Shyh-Jong Chung ,  Ya-Ping Chen ,  Yung-Chih Lo

发明人： Shin-Chang Chen ,  Shyh-Jong Chung ,  Ya-Ping Chen ,  Yung-Chih Lo

IPC分类号： G08B13/14

CPC分类号： G06K19/07749 ,  G06K19/07767 ,  H01Q1/2216 ,  H01Q1/3241 ,  H01Q1/38 ,  H01Q9/0421

摘要： A radio frequency identification (RFID) device comprising a transmitter on a first surface of a substrate, a receiver on the first surface of the substrate, a ground area on a second surface of the substrate, a first antenna on the first surface of the substrate, the first antenna being electrically connected to the ground area and capable of transmitting outgoing signals, and a second antenna on the first surface of the substrate, the second antenna being electrically connected to the ground area and capable of receiving incoming signals.

摘要翻译： 一种射频识别（RFID）装置，包括在基板的第一表面上的发射器，在所述基板的第一表面上的接收器，所述基板的第二表面上的接地区域，所述基板的第一表面上的第一天线 所述第一天线电连接到所述地面区域并且能够发射输出信号，以及在所述基板的所述第一表面上的第二天线，所述第二天线电连接到所述接地区域并且能够接收输入信号。

公开(公告)号：US20050170577A1

公开(公告)日：2005-08-04

申请号：US10769316

申请日：2004-01-30

申请人： Liang-Gi Yao ,  Tien-Chih Chang ,  CC Lin ,  Shin-Chang Chen ,  Mong-Song Liang

发明人： Liang-Gi Yao ,  Tien-Chih Chang ,  CC Lin ,  Shin-Chang Chen ,  Mong-Song Liang

IPC分类号： C30B1/00 ,  H01L21/20 ,  H01L21/338

CPC分类号： H01L21/02381 ,  H01L21/0245 ,  H01L21/02505 ,  H01L21/02532

摘要： A strained silicon layer fabrication employs a substrate having successively formed thereover: (1) a first silicon-germanium alloy material layer; (2) a first silicon layer; (3) a second silicon-germanium alloy material layer; and (4) a second silicon layer. Within the fabrication each of the first silicon-germanium alloy layer and the second silicon-germanium alloy layer is formed of a thickness less than a threshold thickness for dislocation defect formation, such as to provide attenuated dislocation defect formation within the strained silicon layer fabrication.

摘要翻译： 应变硅层制造采用在其上依次形成的基板：（1）第一硅 - 锗合金材料层; （2）第一硅层; （3）第二硅 - 锗合金材料层; 和（4）第二硅层。 在制造中，第一硅 - 锗合金层和第二硅 - 锗合金层中的每一个由低于用于位错缺陷形成的阈值厚度的厚度形成，例如在应变硅层制造中提供衰减的位错缺陷形成。

公开(公告)号：US08482694B2

公开(公告)日：2013-07-09

申请号：US13088810

申请日：2011-04-18

申请人： Hsu Shan ,  I-Ting Huang ,  Shin-Chang Chen

发明人： Hsu Shan ,  I-Ting Huang ,  Shin-Chang Chen

IPC分类号： G02F1/1333

CPC分类号： G02B6/0088 ,  G02B6/009 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  Y10T29/4913

摘要： A liquid crystal module includes a housing, a light guide plate, at least one optical film, a liquid crystal panel, and a light bar. The housing includes a bottom plate with a bearing surface and a frame wall connected to the bottom plate. The light guide plate is disposed on the bearing surface and has a light emitting surface and a light incident side surface. The frame wall surrounds the light guide plate. The optical film is disposed above the light emitting surface. The liquid crystal panel is disposed above the optical film. The light bar includes a first circuit board and at least one light emitting element mounted on the first circuit board. The light emitting element is located opposite to the light incident side surface. The first circuit board located between the liquid crystal panel and the light emitting surface partially covers the light emitting surface.

摘要翻译： 液晶模块包括壳体，导光板，至少一个光学膜，液晶面板和光条。 壳体包括具有支承表面的底板和连接到底板的框架壁。 导光板配置在支承面上，具有发光面和光入射侧面。 框架壁围绕导光板。 光学膜设置在发光面的上方。 液晶面板配置在光学膜的上方。 灯条包括第一电路板和安装在第一电路板上的至少一个发光元件。 发光元件与光入射侧表面相对。 位于液晶面板和发光面之间的第一电路板部分覆盖发光面。

公开(公告)号：US20120299877A1

公开(公告)日：2012-11-29

申请号：US13296385

申请日：2011-11-15

申请人： Shao-Keng Huang ,  Shin-Chang Chen ,  Chi-Sheng Lin

发明人： Shao-Keng Huang ,  Shin-Chang Chen ,  Chi-Sheng Lin

IPC分类号： G06F3/042

CPC分类号： G06F3/0421

摘要： An optical touch display device is provided. The optical touch display device includes a front frame, a light guide strip, a photosensitive element, and a light source. The front frame includes a body portion having a display opening, at least one positioning board located on a corner of the body portion, and a protecting cover located on the body portion. An end of the protecting cover is adjacent to the positioning board. An opening groove is defined between the protecting cover and the body portion. The body portion, the positioning board, and the protecting cover are integrally formed. The light guide strip is placed in the opening groove. The photosensitive element is fixed on the positioning board. The light source is located between the photosensitive element and the light guide strip, and a light-emitting side of the light source faces a light inlet side of the light guide strip.

摘要翻译： 提供了一种光学触摸显示装置。 光学触摸显示装置包括前框架，导光条，感光元件和光源。 前框架包括具有显示开口的主体部分，位于主体部分的角部上的至少一个定位板和位于主体部分上的保护盖。 保护盖的一端与定位板相邻。 在保护盖和主体部分之间限定开口槽。 主体部分，定位板和保护盖一体形成。 导光条被放置在开口槽中。 光敏元件固定在定位板上。 光源位于感光元件和导光条之间，光源的发光侧面对导光条的光入射侧。

公开(公告)号：US07471354B2

公开(公告)日：2008-12-30

申请号：US11164542

申请日：2005-11-29

申请人： Shin-Chang Chen

发明人： Shin-Chang Chen

IPC分类号： G02F1/1335

CPC分类号： G02B6/0055 ,  G02B6/0038 ,  G02F1/133605 ,  G02F2001/133607

摘要： A backlight module including a frame, a reflective adhesive tape, a fixing adhesive tape, a reflective plate, a light-guiding plate and at least one of light source, is provided. The frame has a groove at one side. The reflective adhesive tape is disposed in the groove. The fixing adhesive tape is disposed at the side of the frame, and is disposed on the reflective adhesive tape. The reflective plate is disposed in the frame, wherein a gap is formed between the reflective plate and the fixing adhesive tape, and the gap is above the reflective adhesive tape. The light-guiding plate is disposed in the frame, and is disposed on the reflective plate and the fixing adhesive tape. The light-guiding plate has at least one light-incident surface. The light source is disposed beside the light-incident surface of the light-guiding plate. The backlight module is adapted for providing uniform surface light source.

摘要翻译： 提供了包括框架，反射胶带，固定胶带，反射板，导光板和光源中的至少一个的背光模块。 框架在一侧有凹槽。 反射胶带设置在凹槽中。 固定胶带设置在框架的侧面，并设置在反光胶带上。 反射板设置在框架中，其中在反射板和固定胶带之间形成间隙，并且间隙在反射胶带上方。 导光板设置在框架中，并且设置在反射板和固定胶带上。 导光板具有至少一个光入射表面。 光源设置在导光板的光入射面旁边。 背光模块适于提供均匀的表面光源。

公开(公告)号：US20070115403A1

公开(公告)日：2007-05-24

申请号：US11164542

申请日：2005-11-29

申请人： Shin-Chang Chen

发明人： Shin-Chang Chen

IPC分类号： G02F1/1335

CPC分类号： G02B6/0055 ,  G02B6/0038 ,  G02F1/133605 ,  G02F2001/133607

摘要： A backlight module including a frame, a reflective adhesive tape, a fixing adhesive tape, a reflective plate, a light-guiding plate and at least one of light source, is provided. The frame has a groove at one side. The reflective adhesive tape is disposed in the groove. The fixing adhesive tape is disposed at the side of the frame, and is disposed on the reflective adhesive tape. The reflective plate is disposed in the frame, wherein a gap is formed between the reflective plate and the fixing adhesive tape, and the gap is above the reflective adhesive tape. The light-guiding plate is disposed in the frame, and is disposed on the reflective plate and the fixing adhesive tape. The light-guiding plate has at least one light-incident surface. The light source is disposed beside the light-incident surface of the light-guiding plate. The backlight module is adapted for providing uniform surface light source.

摘要翻译： 提供了包括框架，反射胶带，固定胶带，反射板，导光板和光源中的至少一个的背光模块。 框架在一侧有凹槽。 反射胶带设置在凹槽中。 固定胶带设置在框架的侧面，并设置在反光胶带上。 反射板设置在框架中，其中在反射板和固定胶带之间形成间隙，并且间隙在反射胶带上方。 导光板设置在框架中，并且设置在反射板和固定胶带上。 导光板具有至少一个光入射表面。 光源设置在导光板的光入射面旁边。 背光模块适于提供均匀的表面光源。

公开(公告)号：US07105393B2

公开(公告)日：2006-09-12

申请号：US10769316

申请日：2004-01-30

申请人： Liang-Gi Yao ,  Tien-Chih Chang ,  CC Lin ,  Shin-Chang Chen ,  Mong-Song Liang

发明人： Liang-Gi Yao ,  Tien-Chih Chang ,  CC Lin ,  Shin-Chang Chen ,  Mong-Song Liang

IPC分类号： H01L21/338

CPC分类号： H01L21/02381 ,  H01L21/0245 ,  H01L21/02505 ,  H01L21/02532

摘要： A strained silicon layer fabrication employs a substrate having successively formed thereover: (1) a first silicon-germanium alloy material layer; (2) a first silicon layer; (3) a second silicon-germanium alloy material layer; and (4) a second silicon layer. Within the fabrication each of the first silicon-germanium alloy layer and the second silicon-germanium alloy layer is formed of a thickness less than a threshold thickness for dislocation defect formation, such as to provide attenuated dislocation defect formation within the strained silicon layer fabrication.

摘要翻译： 应变硅层制造采用在其上依次形成的基板：（1）第一硅 - 锗合金材料层; （2）第一硅层; （3）第二硅 - 锗合金材料层; 和（4）第二硅层。 在制造中，第一硅 - 锗合金层和第二硅 - 锗合金层中的每一个由低于用于位错缺陷形成的阈值厚度的厚度形成，例如在应变硅层制造中提供衰减的位错缺陷形成。