摘要:
An on-vehicle multimedia device to be operated by software 16 including an application module group 18 having a plurality of application modules 19 that realizes their respective different functions and an application control module 17 for controlling each of the application modules 19, characterized by the device comprising external hardware which inputs and outputs data to be processed by the software.
摘要:
At least one graphic element includes basic element data of an image, such as a menu, and attributes of the basic element. At least one animation element associated with the graphic element describes a condition and a procedure for dynamically changing an attribute of the graphic element when the condition is fulfilled. The graphic element and the animation element are stored as drawing data. When the condition is fulfilled, the procedure described in the animation element is executed so that an attribute of the graphic element is changed.
摘要:
A substrate processing method and a substrate processing system exclude wafers W provided with a protective film having surface defects that will cause components of a resist to dissolve in an immersion liquid during an immersion exposure process, and rated abnormal from those to be processed by the immersion exposure process. The substrate processing system is provided with a protective film forming module for forming a protective film on a resist film formed on a surface of a wafer W, an exposure system 4 for processing the surface of the wafer W coated with a transparent immersion liquid layer by an immersion exposure process, and a developing module 28 for processing the wafer W by a developing process using a developer. A protective film inspecting device 33 detects surface defects in a protective film formed on a wafer W. A control computer 60 decides whether or not surface defects detected by the protective film inspecting device 33 is normal on the basis of information about the surface defects provided by the protective film inspecting device 33, and gives a control signal representing the results of decision to the exposure system 4. The control computer 60 gives an exposure process execution signal requesting processing the wafer W by the exposure process to the exposure system 4 when the surface defects in the protective film are rated normal or gives an exposure process not executing signal requesting not processing the substrate by the exposure process to the exposure system when the surface defects in the protective film are rated abnormal.
摘要:
Disclosed is a system which makes it possible to determine whether or not a new operation recipe is applicable to a substrate processing apparatus, the apparatus including plural functional components which operate to perform predetermined tasks to a substrate, and a controller comprising a computer which controls operations of the plural functional components based on an operation recipe including a plurality of operation parameters. An electronic medium storing a new operation recipe and a judgment program is connected to the computer of the substrate processing apparatus. The new operation recipe is retrieved from the electronic medium by means of the computer. The computer executes the judgment program to determine, by using the judgment program, whether or not the new operation recipe can be executed by the functional components.
摘要:
A resist coating system for semiconductor wafers has a treatment unit and a transfer unit. The treatment unit has a plurality of treatment sections, and a transfer robot moves along the treatment sections. The transfer robot has a vertically movable driving block and first, and second and third arms for holding the semiconductor wafers, which are vertically arranged on the driving block and supported by the same such that they can advance and retreat independent of one another, and an adiabatic plate supported by the driving block between the third arm and the first and second arms. The third arm is used to take each wafer out of a cooling section, which is one of the treatment section. The wafer exchange in each treatment section is performed by means of two of the first through third arms. An arm for taking from the treatment section a wafer having been treated is operated in synchronism with another arm for inserting into the section a wafer to be treated.
摘要:
In the present invention, a heating plate is divided into a plurality of regions. Integrated values of temperature fluctuations in each of the regions when a substrate is mounted on the heating plate in a normal state without extraneous matter are collected. A Mahalanobis reference space in the discriminant analysis method is formed based on the integrated values at normal time. During actual heat processing, an integrated value of temperature fluctuation of each of the regions when the substrate is mounted on the heating plate is then detected, so that a Mahalanobis distance about the integrated value during the processing is calculated based on the integrated value during the processing and the Mahalanobis reference space obtained in advance. Whether or not there is extraneous matter on the heating plate is determined by comparing the calculated Mahalanobis distance to a predetermined threshold value.
摘要:
In the present invention, a heating plate is divided into a plurality of regions. Integrated values of temperature fluctuations in each of the regions when a substrate is mounted on the heating plate in a normal state without extraneous matter are collected. A Mahalanobis reference space in the discriminant analysis method is formed based on the integrated values at normal time. During actual heat processing, an integrated value of temperature fluctuation of each of the regions when the substrate is mounted on the heating plate is then detected, so that a Mahalanobis distance about the integrated value during the processing is calculated based on the integrated value during the processing and the Mahalanobis reference space obtained in advance. Whether or not there is extraneous matter on the heating plate is determined by comparing the calculated Mahalanobis distance to a predetermined threshold value.
摘要:
The present invention is a conveying unit having a controller for detecting information corresponding to the thickness of each of a plurality of raw substrates, assigning desired identifiers to the raw substrates, storing the identifiers, and causing a conveyor to convey each of the raw substrates or controlling processing conditions for a plurality of processing chambers with the identifiers corresponding to the thickness of each of the raw substrates. Thus, even if one cassette accommodates a plurality of raw substrates, the conveyor can smoothly load the same type of raw substrates to the accommodating cassette and unload them therefrom in a simple structure. The controller sets desired processing conditions for each of the processing portions corresponding to the identifiers.
摘要:
A substrate processing method and a substrate processing system exclude wafers W provided with a protective film having surface defects that will cause components of a resist to dissolve in an immersion liquid during an immersion exposure process, and rated abnormal from those to be processed by the immersion exposure process. The substrate processing system is provided with a protective film forming module for forming a protective film on a resist film formed on a surface of a wafer W, an exposure system 4 for processing the surface of the wafer W coated with a transparent immersion liquid layer by an immersion exposure process, and a developing module 28 for processing the wafer W by a developing process using a developer. A protective film inspecting device 33 detects surface defects in a protective film formed on a wafer W. A control computer 60 decides whether or not surface defects detected by the protective film inspecting device 33 is normal on the basis of information about the surface defects provided by the protective film inspecting device 33, and gives a control signal representing the results of decision to the exposure system 4. The control computer 60 gives an exposure process execution signal requesting processing the wafer W by the exposure process to the exposure system 4 when the surface defects in the protective film are rated normal or gives an exposure process not executing signal requesting not processing the substrate by the exposure process to the exposure system when the surface defects in the protective film are rated abnormal.
摘要:
A coating and developing apparatus for coating a substrate with a plurality of color resists and for developing it after exposure, comprises: a scrubbing unit for scrubbing the substrate; a coating unit having a plurality of resist discharge nozzles for respectively discharging a plurality of color resists on the scrubbed substrate; and a developing unit for developing the substrate coated with the color resists after exposure. Accordingly, reduction in size of apparatus and space savings can be achieved, and manufacturing cost can also be reduced.