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公开(公告)号：US09920232B2
公开(公告)日：2018-03-20
申请号：US14792093
申请日：2015-07-06
发明人： Syuzo Aoki , Takuya Oda , Takuya Kurosawa , Shoji Koizumi , Hidekazu Takizawa , Yutaka Komatsu , Shinichi Anzawa
IPC分类号： B22F7/08 , C09K5/14 , B22F9/04 , B22F3/10 , C22C1/04 , C22C1/10 , C22C26/00 , F28F21/02 , F28F21/08 , F28D15/04 , C01B32/158 , C01B32/182
CPC分类号： C09K5/14 , B22F3/10 , B22F7/08 , B22F9/04 , C01B32/158 , C01B32/182 , C01B2202/00 , C22C1/0425 , C22C1/1084 , C22C26/00 , F28D15/046 , F28F21/02 , F28F21/08 , F28F2245/02 , F28F2255/18 , H01L2924/0002 , Y02P20/124 , Y10T428/25 , Y10T428/256 , Y10T428/30 , H01L2924/00
摘要： A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.
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公开(公告)号：US09332659B2
公开(公告)日：2016-05-03
申请号：US14477156
申请日：2014-09-04
发明人： Minshong Tan , Syuzo Aoki , Takuya Oda
IPC分类号： H05K5/00
CPC分类号： G06F1/181 , G06F1/183 , H05K5/0008
摘要： An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.
摘要翻译： 一种电子部件壳体，包括：下壳体，具有底板，具有突出部的辅助壁，形成在所述侧壁的外表面上的接合突起;以及螺钉孔，形成在所述侧壁中的所述突出部 并且具有顶板，形成有接合孔的侧壁和被迫在顶板侧的侧壁中的切口孔的上壳体。 下壳体的突出部分接合到上壳体的凹口孔中，并且螺纹孔暴露在凹口中。 下壳体的接合突起接合在上壳体的接合孔中。
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公开(公告)号：US09933822B2
公开(公告)日：2018-04-03
申请号：US15083396
申请日：2016-03-29
发明人： Minshong Tan , Syuzo Aoki , Takuya Oda
CPC分类号： G06F1/181 , G06F1/183 , H05K5/0008
摘要： An electronic component case includes, a lower case including a bottom plate, a side wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole formed in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.
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