Metal pattern forming method
    1.
    发明授权
    Metal pattern forming method 失效
    金属图案形成方法

    公开(公告)号:US07524432B2

    公开(公告)日:2009-04-28

    申请号:US11686834

    申请日:2007-03-15

    IPC分类号: H01L21/302

    摘要: A method of forming a metal pattern comprising forming a metal film having a lower layer made of a metal and an upper layer made of a metal different from the metal of the lower layer, forming a resist film having a predetermined pattern on the upper layer, and patterning the metal film by etching the metal film using the resist film as a mask. Here, patterning the metal film comprises etching the upper layer, immersing the resist film and the upper layer in a pretreatment liquid containing a nonionic surfactant after the first etching process, and etching the lower layer after the immersing process.

    摘要翻译: 一种形成金属图案的方法,包括形成具有由金属制成的下层的金属膜和由与下层金属不同的金属制成的上层的金属膜,在上层形成具有预定图案的抗蚀剂膜, 并通过使用抗蚀剂膜作为掩模蚀刻金属膜来图案化金属膜。 这里,图案化金属膜包括蚀刻上层,在第一蚀刻工艺之后将抗蚀剂膜和上层浸入含有非离子表面活性剂的预处理液中,并在浸渍处理之后蚀刻下层。

    METAL PATTERN FORMING METHOD
    2.
    发明申请
    METAL PATTERN FORMING METHOD 失效
    金属图案形成方法

    公开(公告)号:US20070218695A1

    公开(公告)日:2007-09-20

    申请号:US11686834

    申请日:2007-03-15

    IPC分类号: H01L21/302 H01L21/461

    摘要: A method of forming a metal pattern comprising forming a metal film having a lower layer made of a metal and an upper layer made of a metal different from the metal of the lower layer, forming a resist film having a predetermined pattern on the upper layer, and patterning the metal film by etching the metal film using the resist film as a mask. Here, patterning the metal film comprises etching the upper layer, immersing the resist film and the upper layer in a pretreatment liquid containing a nonionic surfactant after the first etching process, and etching the lower layer after the immersing process.

    摘要翻译: 一种形成金属图案的方法,包括形成具有由金属制成的下层的金属膜和由与下层金属不同的金属制成的上层的金属膜,在上层形成具有预定图案的抗蚀剂膜, 并通过使用抗蚀剂膜作为掩模蚀刻金属膜来图案化金属膜。 这里,图案化金属膜包括蚀刻上层,在第一蚀刻工艺之后将抗蚀剂膜和上层浸入含有非离子表面活性剂的预处理液中,并在浸渍处理之后蚀刻下层。

    Coating apparatus and coating method using the same
    3.
    发明授权
    Coating apparatus and coating method using the same 有权
    涂布装置及其涂布方法采用该方法

    公开(公告)号:US07332034B2

    公开(公告)日:2008-02-19

    申请号:US10992093

    申请日:2004-11-19

    摘要: To provide a coating apparatus, which can surely prevent a coating solution from spreading, to simplify a manufacturing process and reduce the manufacturing cost and provide a coating method using the same. The coating apparatus includes a holding table holding a plate having a through hole penetrating in a thickness direction; and a coating head including a slit-shaped nozzle orifice which discharges a coating solution, the nozzle orifice being opposed to a coating surface opposite to a holding surface held on the holding table. The coating apparatus applies the coating solution to the coating surface of the plate by moving the plate and the coating head relative to each other in an in-plane direction of the coating surface. In addition, the coating apparatus includes coating preventing means, which prevents the coating solution from entering the through hole of the plate.

    摘要翻译: 为了提供能够可靠地防止涂布液扩散的涂布装置,简化制造工序,降低制造成本,提供使用该涂布装置的涂布方法。 所述涂布装置包括保持台,所述保持台保持具有沿厚度方向穿透的通孔的板; 以及涂布头,其包括排出涂布溶液的狭缝状喷嘴孔,所述喷嘴孔与与保持在保持台上的保持面相反的涂布面相对。 涂布装置通过在涂布表面的面内方向上相对于彼此移动板和涂覆头将涂布溶液施加到板的涂覆表面。 此外,涂布设备包括防止涂层溶液进入板的通孔的涂覆防止装置。

    Coaoting apparatus and coating method using the same
    4.
    发明申请
    Coaoting apparatus and coating method using the same 有权
    注射装置和使用其的涂布方法

    公开(公告)号:US20050191420A1

    公开(公告)日:2005-09-01

    申请号:US10992093

    申请日:2004-11-19

    摘要: To provide a coating apparatus which can surely prevent a coating solution from spreading to simplify a manufacturing process and reduce the manufacturing cost and provide a coating method using the same. The coating apparatus includes a holding table holding a plate having a through hole penetrating in a thickness direction; and a coating head including a slit-shaped nozzle orifice which discharges a coating solution, the nozzle orifice being opposed to a coating surface opposite to a holding surface held on the holding table. The coating apparatus applies the coating solution to the coating surface of the plate by moving the plate and the coating head relative to each other in an in-plane direction of the coating surface. In addition, the coating apparatus includes coating preventing means which prevents the coating solution from entering the through hole of the plate.

    摘要翻译: 提供一种能够可靠地防止涂布液扩散以简化制造工序并降低制造成本并提供使用该涂布装置的涂布方法的涂布装置。 所述涂布装置包括保持台,所述保持台保持具有沿厚度方向穿透的通孔的板; 以及涂布头,其包括排出涂布溶液的狭缝状喷嘴孔,所述喷嘴孔与与保持在保持台上的保持面相反的涂布面相对。 涂布装置通过在涂布表面的面内方向上相对于彼此移动板和涂覆头将涂布溶液施加到板的涂覆表面。 此外,涂布装置包括防止涂布液进入板的通孔的防止涂布装置。

    Substrate holding device, substrate holding method and substrate heating device
    5.
    发明申请
    Substrate holding device, substrate holding method and substrate heating device 审中-公开
    基板保持装置,基板保持方法和基板加热装置

    公开(公告)号:US20060126050A1

    公开(公告)日:2006-06-15

    申请号:US11298830

    申请日:2005-12-12

    申请人: Shinya Momose

    发明人: Shinya Momose

    IPC分类号: G03B27/58

    摘要: A substrate holding device comprises a holding table for holding a substrate, heating means for heating the holding table, and attraction means for causing the substrate to be attracted onto the holding table. When the substrate which has warped is placed on the holding table heated by the heating means, the attraction means causes a plurality of regions of the substrate to be attracted and held with different timings in accordance with the amount of a decrease in warpage of the substrate due to heat of the holding table.

    摘要翻译: 基板保持装置包括用于保持基板的保持台,用于加热保持台的加热装置和用于使基板被吸引到保持台上的吸引装置。 当已经翘曲的基板被放置在由加热装置加热的保持台上时,吸引装置使得基板的多个区域根据基板的翘曲减小量被不同的定时吸引和保持 由于保持台的热量。