公开(公告)号：US20120000284A1

公开(公告)日：2012-01-05

申请号：US13169918

申请日：2011-06-27

申请人： Shinya Yokoyama ,  Satoshi Waga ,  Atsushi Tondokoro ,  Tadashi Sakashita ,  Hideki Hasegawa ,  Sumihito Morita ,  Hideki Kamimura ,  Masaya Yamatani

发明人： Shinya Yokoyama ,  Satoshi Waga ,  Atsushi Tondokoro ,  Tadashi Sakashita ,  Hideki Hasegawa ,  Sumihito Morita ,  Hideki Kamimura ,  Masaya Yamatani

IPC分类号： G01N27/22 ,  B23P25/00

CPC分类号： G01D11/245 ,  G01N33/0014 ,  Y10T29/4998

摘要： A humidity sensor package includes: a humidity sensor that is mounted on a main surface of a package substrate and that have a humidity-sensing area; a control IC that is mounted on the main surface of the package substrate; a sealing resin that seals at least an external connection portion of the humidity sensor; and a partition member that partitions a sealing area of the sealing resin and the humidity-sensing area from each other so as to expose the humidity-sensing area to an external environment. Here, a first distance in the thickness direction from the package substrate to the top surface of the partition member is smaller than a second distance in the thickness direction from the package substrate to the top surface of the sealing resin.

摘要翻译： 一种湿度传感器包括：湿度传感器，其安装在封装基板的主表面上并具有湿度感测区域; 控制IC，其安装在所述封装基板的主表面上; 至少密封湿度传感器的外部连接部分的密封树脂; 以及分隔构件，其将密封树脂的密封区域和湿度感测区域彼此分隔开，以将湿度感测区域暴露于外部环境。 这里，从封装基板到分隔部件的顶面的厚度方向的第一距离小于从封装基板到密封树脂的顶面的厚度方向的第二距离。

公开(公告)号：US20060176359A1

公开(公告)日：2006-08-10

申请号：US11339370

申请日：2006-01-25

申请人： Shinya Yokoyama ,  Motoki Hirayama

发明人： Shinya Yokoyama ,  Motoki Hirayama

IPC分类号： B41J2/335

CPC分类号： B41J2/3351 ,  H01L2224/05554 ,  H01L2224/48137 ,  Y10T29/49083

摘要： A thermal head includes a large number of heating resistors disposed at a regular interval, individual conductors individually connected to each of the heating resistors, and common conductors connected to each of the heating resistors in common, the individual conductors and the common conductors serving as conductors for supplying the heating resistors with a current. In the thermal head, an underlayer having a large number of irregularities is provided and a conductor layer is provided on the underlayer along the irregularities. Thereby, bonding pads that are composed of the conductor layer and that have irregularities are provided as electrodes of the individual conductors or the common conductors.

摘要翻译： 热敏头包括大量以规则间隔布置的加热电阻器，单独连接到每个加热电阻器的各个导体以及连接到每个加热电阻器的公共导体，各个导体和用作导体的公共导体 用于向加热电阻器提供电流。 在热敏头中，设置具有大量不规则的底层，并且沿着凹凸设置在底层上设置导体层。 由此，由导体层构成且具有凹凸的接合焊盘作为各导体或共用导体的电极设置。

公开(公告)号：US07427998B2

公开(公告)日：2008-09-23

申请号：US11850521

申请日：2007-09-05

申请人： Shinya Yokoyama

发明人： Shinya Yokoyama

IPC分类号： B41J2/335

CPC分类号： H05B3/10 ,  B41J2/3351 ,  Y10T29/49083

摘要： A thermal head having electrode wiring lines in a narrow wiring region, in which a line and a space are narrow, with good pattern accuracy and a method of manufacturing the same are provided. A thermal head includes: a plurality of heating resistors arranged in a line at predetermined pitches there between on a protruding level difference part of a glazed substrate; bent wiring lines each of which serves to electrically connect a pair of adjacent heating resistors to each other; a common wiring line and individual wiring lines used to cause the pair of adjacent heating resistors to be electrically conducted through each of the bent wiring lines; and bonding pads formed on one ends of the individual wiring lines. The common wiring line has a narrow wiring region located between the bonding pads arranged in a line and a wide wiring region wider than the narrow wiring region. The wide wiring region is formed using a conductor layer and a resistor layer made of the same material as the heating resistors, and the narrow wiring region is formed using only the conductor layer without the resistor layer.

摘要翻译： 在具有良好图案精度的线和空间窄的窄布线区域中具有电极布线的热敏头及其制造方法。 热敏头包括：多个加热电阻器，其布置在玻璃基板的突出高度差部分之间的预定间距处的线中; 弯曲的布线用于将一对相邻的加热电阻器彼此电连接; 用于使一对相邻的加热电阻器通过每条弯曲的布线导电的公共布线和单独的布线; 以及形成在各个布线的一端上的接合焊盘。 公共布线具有窄布线区域，该布线区域位于布置成一行的接合焊盘和比窄布线区域宽的宽布线区域之间。 宽布线区域使用与加热电阻体相同的材料制成的导体层和电阻层形成，并且仅使用没有电阻层的导体层形成窄布线区域。

公开(公告)号：US20060262164A1

公开(公告)日：2006-11-23

申请号：US11436169

申请日：2006-05-17

申请人： Shinya Yokoyama

发明人： Shinya Yokoyama

IPC分类号： B41J2/05

CPC分类号： B41J2/33515 ,  B41J2/3357 ,  B41J2/3359

摘要： A method for manufacturing a thermal head is provided which includes the steps of forming a resistor layer and an insulating barrier layer, patterning the above two layers to form aligned heating resistors, forming a solid electrode layer over the heating resistors and the like, and partly removing the solid electrode layer to form opening portions and electrode layers for supplying electricity to the heating resistors. In the patterning step, part of the resistor layer and part of the insulating barrier layer, which are outside a heat generating area, are simultaneously removed to form the heating resistors having a planar U shape composed of a pair of effective heating portions and a connection portion connecting the above pair, the effective heating portions and the connection portion each having a predetermined length and width. The length of the connection portion is set to 5 μm or less.

摘要翻译： 提供了一种用于制造热敏头的方法，其包括形成电阻层和绝缘阻挡层的步骤，图案化上述两层以形成对准的加热电阻器，在加热电阻器等上形成固体电极层，以及部分 去除固体电极层以形成用于向加热电阻器供电的开口部分和电极层。 在图案化步骤中，同时除去在发热区域外部的电阻层部分和绝缘阻挡层的一部分，形成具有由一对有效加热部分构成的平面U形状的加热电阻体和连接 连接上述对的部分，有效加热部分和连接部分各自具有预定的长度和宽度。 连接部的长度设定为5um以下。

公开(公告)号：US20080062239A1

公开(公告)日：2008-03-13

申请号：US11850521

申请日：2007-09-05

申请人： Shinya Yokoyama

发明人： Shinya Yokoyama

IPC分类号： B41J2/335 ,  H05B3/00

CPC分类号： H05B3/10 ,  B41J2/3351 ,  Y10T29/49083

摘要： A thermal head having electrode wiring lines in a narrow wiring region, in which a line and a space are narrow, with good pattern accuracy and a method of manufacturing the same are provided. A thermal head includes: a plurality of heating resistors arranged in a line at predetermined pitches there between on a protruding level difference part of a glazed substrate; bent wiring lines each of which serves to electrically connect a pair of adjacent heating resistors to each other; a common wiring line and individual wiring lines used to cause the pair of adjacent heating resistors to be electrically conducted through each of the bent wiring lines; and bonding pads formed on one ends of the individual wiring lines. The common wiring line has a narrow wiring region located between the bonding pads arranged in a line and a wide wiring region wider than the narrow wiring region. The wide wiring region is formed using a conductor layer and a resistor layer made of the same material as the heating resistors, and the narrow wiring region is formed using only the conductor layer without the resistor layer.

摘要翻译： 在具有良好图案精度的线和空间窄的窄布线区域中具有电极布线的热敏头及其制造方法。 热敏头包括：多个加热电阻器，其布置在玻璃基板的突出高度差部分之间的预定间距处的线中; 弯曲的布线用于将一对相邻的加热电阻器彼此电连接; 用于使一对相邻的加热电阻器通过每条弯曲的布线导电的公共布线和单独的布线; 以及形成在各个布线的一端上的接合焊盘。 公共布线具有窄布线区域，该布线区域位于布置成一行的接合焊盘和比窄布线区域宽的宽布线区域之间。 宽布线区域使用与加热电阻体相同的材料制成的导体层和电阻层形成，并且仅使用没有电阻层的导体层形成窄布线区域。

公开(公告)号：US08567255B2

公开(公告)日：2013-10-29

申请号：US13109769

申请日：2011-05-17

申请人： Daigo Aoki ,  Hideyuki Hashimoto ,  Tetsuya Kobayashi ,  Kunio Koizumi ,  Yoshiaki Shimizu ,  Yutaka Takashima ,  Shinya Yokoyama

发明人： Daigo Aoki ,  Hideyuki Hashimoto ,  Tetsuya Kobayashi ,  Kunio Koizumi ,  Yoshiaki Shimizu ,  Yutaka Takashima ,  Shinya Yokoyama

IPC分类号： G01L9/06

CPC分类号： G01L9/0054

摘要： There is provided a semiconductor pressure sensor which improves the sensor sensitivity and is excellent in the withstand pressure characteristic and the temperature characteristic. In the semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, a recess which has a larger area than the planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in a protective film which covers the entire surface of the silicon substrate on the diaphragm side. The protective film located on the diaphragm is preferably formed of SiO2.

摘要翻译： 提供了提高传感器灵敏度并且耐压特性和温度特性优异的半导体压力传感器。 在半导体压力传感器中，其中隔膜由设置在硅衬底的顶表面和底表面中的一个上的空腔形成，并且多个压电电阻器设置在隔膜边缘中，具有比平面形状大的面积的凹部 隔膜的整个边缘在平面图中从隔膜边缘向外定位在覆盖隔膜侧的硅基板的整个表面的保护膜中。 位于隔膜上的保护膜优选由SiO 2形成。

公开(公告)号：US20110260269A1

公开(公告)日：2011-10-27

申请号：US13176351

申请日：2011-07-05

申请人： Shinya Yokoyama ,  Daigo Aoki ,  Yutaka Takashima

发明人： Shinya Yokoyama ,  Daigo Aoki ,  Yutaka Takashima

IPC分类号： H01L29/84

CPC分类号： G01L9/0054 ,  G01L9/0055

摘要： A piezoresistive pressure sensor is provided, which can prevent the occurrence of ESD breakdown due to the nearness of interconnection layers of a resistive element according to miniaturization thereof. The piezoresistive pressure sensor is so configured that respective semiconductor resistive layers on both sides of an arrangement are formed to be relatively longer than an adjacent semiconductor resistive layer, and thus a corner portion of a semiconductor connection layer that extends from the respective semiconductor resistive layers on both sides of the arrangement and a corner portion of the semiconductor interconnection layer that is nearest to the corner portion of the semiconductor connection layer, between which the ESD breakdown occurs easily, can be separated from each other.

摘要翻译： 提供一种压阻式压力传感器，其可以防止由于电阻元件的互连层的接近程度而导致的ESD击穿的发生，因为其小型化。 压阻式压力传感器被配置成使得在布置的两侧上的相应的半导体电阻层形成为相对比相邻的半导体电阻层更长，并且因此从半导体电阻层延伸的半导体连接层的角部分 布置的两侧和半导体互连层的最接近半导体连接层的角部的角部可以彼此分离，ESD突发之间容易发生ESD损坏。

公开(公告)号：US07324126B2

公开(公告)日：2008-01-29

申请号：US11339370

申请日：2006-01-25

申请人： Shinya Yokoyama ,  Motoki Hirayama

发明人： Shinya Yokoyama ,  Motoki Hirayama

IPC分类号： B41J2/335

CPC分类号： B41J2/3351 ,  H01L2224/05554 ,  H01L2224/48137 ,  Y10T29/49083

摘要： A thermal head includes a large number of heating resistors disposed at a regular interval, individual conductors individually connected to each of the heating resistors, and common conductors connected to each of the heating resistors in common, the individual conductors and the common conductors serving as conductors for supplying the heating resistors with a current. In the thermal head, an underlayer having a large number of irregularities is provided and a conductor layer is provided on the underlayer along the irregularities. Thereby, bonding pads that are composed of the conductor layer and that have irregularities are provided as electrodes of the individual conductors or the common conductors.

摘要翻译： 热敏头包括大量以规则间隔布置的加热电阻器，单独连接到每个加热电阻器的各个导体以及连接到每个加热电阻器的公共导体，各个导体和用作导体的公共导体 用于向加热电阻器提供电流。 在热敏头中，设置具有大量不规则的底层，并且沿着凹凸设置在底层上设置导体层。 由此，由导体层构成且具有凹凸的接合焊盘作为各导体或共用导体的电极设置。

公开(公告)号：US5681449A

公开(公告)日：1997-10-28

申请号：US584462

申请日：1996-01-11

申请人： Shinya Yokoyama ,  Michio Kuriyagawa ,  Tomoko Ogi ,  Hideo Kobayashi ,  Tomoaki Minowa ,  Seiichi Inoue ,  Norio Tenma

发明人： Shinya Yokoyama ,  Michio Kuriyagawa ,  Tomoko Ogi ,  Hideo Kobayashi ,  Tomoaki Minowa ,  Seiichi Inoue ,  Norio Tenma

IPC分类号： C02F11/00 ,  C02F11/10 ,  C02F11/14 ,  C10G1/02 ,  C10G17/00

CPC分类号： C10G1/02

摘要： An organic material-containing sludge is fluidized and is heat-treated at a high pressure in a reactor disposed underground to obtain an oil having a high calorific value. The heat treatment may be performed using an electrical energy, the terrestrial heat or a reaction heat obtained by oxidative treatment of similer sludge.

摘要翻译： 将含有机材料的污泥流化并在设置在地下的反应器中在高压下进行热处理，得到高发热量的油。 热处理可以使用电能，陆地热或通过模拟污泥的氧化处理获得的反应热进行。

公开(公告)号：US5651953A

公开(公告)日：1997-07-29

申请号：US501145

申请日：1995-07-11

申请人： Shinya Yokoyama ,  Tomoko Ogi ,  Tomoaki Minowa ,  Seiichi Inoue

发明人： Shinya Yokoyama ,  Tomoko Ogi ,  Tomoaki Minowa ,  Seiichi Inoue

IPC分类号： C01B3/02 ,  C01B3/32 ,  C10J3/00

CPC分类号： C01B3/323 ,  C10J3/00 ,  C10J2300/092 ,  C10J2300/0986

摘要： Hydrogen is produced from a cellulose-containing biomass by heating the biomass in the presence of water and a catalyst at a temperature of 250.degree.-374.degree. C. and at a pressure higher than the saturated vapor pressure of water. The catalyst includes a catalytic metal selected from the group consisting of nickel, iron, cobalt, molybdenum, tungsten, platinum and mixtures thereof.

摘要翻译： 通过在水和催化剂的存在下，在250-374℃的温度和高于饱和蒸气压的压力下加热生物质，由含纤维素的生物质产生氢。 催化剂包括选自镍，铁，钴，钼，钨，铂及其混合物的催化金属。