摘要:
A humidity sensor package includes: a humidity sensor that is mounted on a main surface of a package substrate and that have a humidity-sensing area; a control IC that is mounted on the main surface of the package substrate; a sealing resin that seals at least an external connection portion of the humidity sensor; and a partition member that partitions a sealing area of the sealing resin and the humidity-sensing area from each other so as to expose the humidity-sensing area to an external environment. Here, a first distance in the thickness direction from the package substrate to the top surface of the partition member is smaller than a second distance in the thickness direction from the package substrate to the top surface of the sealing resin.
摘要:
A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.
摘要:
A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.
摘要:
A thin film magnetic head includes a recording and playback element, a lead conductor layer for feeding a power to the recording and playback element, an electrically conductive bump for conductively connecting the lead conductor layer to an electrode pad for external connection, and an insulating protective layer filling between the recording and playback element and the electrically conductive bump. A thermal deformation-preventing layer composed of a material having a thermal expansion coefficient smaller than that of the insulating protective layer is disposed in the insulating protective layer in such a way as to locate between a medium-facing surface and the electrically conductive bump without being exposed at the medium-facing surface. In the resulting thin film magnetic head, protrusion of the recording and playback element toward the recording medium side can be prevented without changing the configuration of the recording and playback element nor the forming material.
摘要:
A perpendicular magnetic recording head according to the present invention is composed of a first magnetic layer having a main magnetic pole exposed at a facing surface opposite a recording medium, a second magnetic layer adjacent to the first magnetic layer with an intermediary non-magnetic layer disposed therebetween, and a coil layer for applying a recording magnetic field to the first magnetic layer. Since the second magnetic layer has a shape including a substantially arched portion in its cross section along a height direction, it becomes possible to keep an Edge Write magnetic field in a low level and improve external magnetic field resistance.
摘要:
In a thin-film magnetic head, an lower magnetic pole layer is formed on a lower core layer to form a step between the lower core layer and the lower magnetic pole layer. A coil layer and a coil-insulating layer are formed on the lower core layer, and an upper core layer is formed over the lower magnetic pole layer and the coil-insulating layer. This configuration decreases the height of the coil-insulating layer from the lower magnetic pole layer compared to the height in a conventional thin-film magnetic head. The front end of the upper core layer can be precisely formed so as to have a track width Tw. This thin-film magnetic head is suitable for narrower track widths.
摘要:
A perpendicular magnetic recording head includes a first magnetic layer having a main magnetic pole exposed at a medium-facing surface that faces a recording medium; a second magnetic layer that faces the first magnetic layer with a nonmagnetic layer interposed therebetween; and a coil layer for applying a recording magnetic field to the first magnetic layer. The second magnetic layer includes a relatively thick edge portion, whereby the edge-write magnetic field is reduced and the external magnetic field resistance is increased.
摘要:
A thin-film magnetic head is capable of securing an insulating property and minimizing the projection of a recording element section due to heat expansion. The thin-film magnetic head includes a pair of magnetic layers disposed with a predetermined gap therebetween on a surface facing a recording medium. The layers are connected to each other along an inner part in a height direction from the medium-facing surface. A spiral recording coil is disposed between the pair of magnetic layers and wound around a connecting portion of the pair of magnetic layers. The recording coil includes a dense coil portion formed with a pitch smaller than that of the inner part in the height direction so as to be closer to the medium-facing surface than the connecting portion. An organic insulating layer is locally formed to fill coil gaps of the dense coil portion, and coil gaps other than those of the dense coil portion are filled with an inorganic insulating layer.
摘要:
A manufacturing method of a thin film magnetic head is provided. In the manufacturing method of a thin film magnetic head, an inorganic insulating layer is formed along at least a sidewall surface of each conductor part. A gap of each conductor part is filled by an organic insulating layer. An upper surface of the conductor part, a magnetic pole portion, and a connecting layer are grinded to be planar with an organic insulating layer and an inorganic insulating layer. During an upper surface of each conductor part is grinded, the inorganic insulating layer, which is hard, suppresses a shear drop of each conductor part by grinding.
摘要:
In a thin-film magnetic head, a lower magnetic pole layer and a planarizing magnetic layer in continuity with the lower magnetic layer are arranged. Since a coil formation surface is positioned lower than the top surface of the lower magnetic pole layer and the planarizing magnetic layer, the front end of an upper magnetic core layer is formed to be a predetermined track width with a high accuracy. A thin-film magnetic head having good information writing characteristics and a method for manufacturing the thin-film magnetic head are thus provided.