HUMIDITY SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    HUMIDITY SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
    湿度传感器封装及其制造方法

    公开(公告)号:US20120000284A1

    公开(公告)日:2012-01-05

    申请号:US13169918

    申请日:2011-06-27

    IPC分类号: G01N27/22 B23P25/00

    摘要: A humidity sensor package includes: a humidity sensor that is mounted on a main surface of a package substrate and that have a humidity-sensing area; a control IC that is mounted on the main surface of the package substrate; a sealing resin that seals at least an external connection portion of the humidity sensor; and a partition member that partitions a sealing area of the sealing resin and the humidity-sensing area from each other so as to expose the humidity-sensing area to an external environment. Here, a first distance in the thickness direction from the package substrate to the top surface of the partition member is smaller than a second distance in the thickness direction from the package substrate to the top surface of the sealing resin.

    摘要翻译: 一种湿度传感器包括:湿度传感器,其安装在封装基板的主表面上并具有湿度感测区域; 控制IC,其安装在所述封装基板的主表面上; 至少密封湿度传感器的外部连接部分的密封树脂; 以及分隔构件,其将密封树脂的密封区域和湿度感测区域彼此分隔开,以将湿度感测区域暴露于外部环境。 这里,从封装基板到分隔部件的顶面的厚度方向的第一距离小于从封装基板到密封树脂的顶面的厚度方向的第二距离。

    Capacitive type humidity sensor and manufacturing method thereof
    2.
    发明授权
    Capacitive type humidity sensor and manufacturing method thereof 有权
    电容式湿度传感器及其制造方法

    公开(公告)号:US08776597B2

    公开(公告)日:2014-07-15

    申请号:US13232589

    申请日:2011-09-14

    IPC分类号: G01N27/22 B81B7/00

    摘要: A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.

    摘要翻译: 提供了一种电容式湿度传感器,其中传感器芯片基板具有静电电容根据湿度变化的传感器部分,静电电容不变的参考部分和作为每个部分的输出端子的多个焊盘, 并且电连接到焊盘并将这些部分之间的电容差输出为电压的IC基板固定到相同的支撑基板,其中形成围绕传感器部分的密封区域的保护构件, 覆盖参考部分,设置在传感器芯片基板上,除了由保护部件覆盖的区域之外,支撑基板被密封树脂​​覆盖,传感器部分在被保护件包围的区域处暴露于空气中 构件,并且其它构成元件被密封树脂​​覆盖。

    CAPACITIVE TYPE HUMIDITY SENSOR AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    CAPACITIVE TYPE HUMIDITY SENSOR AND MANUFACTURING METHOD THEREOF 有权
    电容式湿度传感器及其制造方法

    公开(公告)号:US20120000285A1

    公开(公告)日:2012-01-05

    申请号:US13232589

    申请日:2011-09-14

    IPC分类号: G01N27/22 G01R3/00

    摘要: A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.

    摘要翻译: 提供了一种电容式湿度传感器,其中传感器芯片基板具有静电电容根据湿度变化的传感器部分,静电电容不变的参考部分和作为每个部分的输出端子的多个焊盘, 并且电连接到焊盘并将这些部分之间的电容差输出为电压的IC基板固定到相同的支撑基板,其中形成围绕传感器部分的密封区域的保护构件, 覆盖参考部分,设置在传感器芯片基板上,除了由保护部件覆盖的区域之外,支撑基板被密封树脂​​覆盖,传感器部分在被保护件包围的区域处暴露于空气中 构件,并且其它构成元件被密封树脂​​覆盖。

    Thin film magnetic head including thermal deformation-preventing layer
    4.
    发明授权
    Thin film magnetic head including thermal deformation-preventing layer 有权
    薄膜磁头包括热变形防止层

    公开(公告)号:US08045293B2

    公开(公告)日:2011-10-25

    申请号:US11851692

    申请日:2007-09-07

    IPC分类号: G11B5/31 G11B5/60 G11B21/21

    摘要: A thin film magnetic head includes a recording and playback element, a lead conductor layer for feeding a power to the recording and playback element, an electrically conductive bump for conductively connecting the lead conductor layer to an electrode pad for external connection, and an insulating protective layer filling between the recording and playback element and the electrically conductive bump. A thermal deformation-preventing layer composed of a material having a thermal expansion coefficient smaller than that of the insulating protective layer is disposed in the insulating protective layer in such a way as to locate between a medium-facing surface and the electrically conductive bump without being exposed at the medium-facing surface. In the resulting thin film magnetic head, protrusion of the recording and playback element toward the recording medium side can be prevented without changing the configuration of the recording and playback element nor the forming material.

    摘要翻译: 薄膜磁头包括记录和重放元件,用于向记录和回放元件供电的引线导体层,用于将引线导体层导电连接到用于外部连接的电极焊盘的导电凸块,以及绝缘保护 记录和再现元件与导电凸块之间的层填充。 由热膨胀系数小于绝缘保护层的材料构成的热变形防止层设置在绝缘保护层中,以便定位在介质表面和导电凸块之间,而不会 暴露在面向中间的表面。 在所得到的薄膜磁头中,可以防止记录和再现元件向记录介质侧的突出,而不改变记录和再现元件的构造以及形成材料。

    Perpendicular Magnetic Recording Head and Perpendicular Magnetic Recording/Reproducing Head
    5.
    发明申请
    Perpendicular Magnetic Recording Head and Perpendicular Magnetic Recording/Reproducing Head 有权
    垂直磁记录头和垂直磁记录/再现头

    公开(公告)号:US20080019043A1

    公开(公告)日:2008-01-24

    申请号:US11780608

    申请日:2007-07-20

    IPC分类号: G11B5/127

    摘要: A perpendicular magnetic recording head according to the present invention is composed of a first magnetic layer having a main magnetic pole exposed at a facing surface opposite a recording medium, a second magnetic layer adjacent to the first magnetic layer with an intermediary non-magnetic layer disposed therebetween, and a coil layer for applying a recording magnetic field to the first magnetic layer. Since the second magnetic layer has a shape including a substantially arched portion in its cross section along a height direction, it becomes possible to keep an Edge Write magnetic field in a low level and improve external magnetic field resistance.

    摘要翻译: 根据本发明的垂直磁记录头由具有在与记录介质相对的相对表面暴露的主磁极的第一磁性层组成,与第一磁性层相邻的第二磁性层,其中设置有中间非磁性层 以及用于向第一磁性层施加记录磁场的线圈层。 由于第二磁性层具有沿其高度方向的横截面中包括大致拱形部分的形状,因此可以将边缘写入磁场保持在低电平并提高外部磁场电阻。

    Thin-film magnetic head suitable for narrow tracks
    6.
    发明授权
    Thin-film magnetic head suitable for narrow tracks 失效
    薄膜磁头适用于窄轨

    公开(公告)号:US06731457B2

    公开(公告)日:2004-05-04

    申请号:US09754518

    申请日:2001-01-04

    IPC分类号: G11B5147

    摘要: In a thin-film magnetic head, an lower magnetic pole layer is formed on a lower core layer to form a step between the lower core layer and the lower magnetic pole layer. A coil layer and a coil-insulating layer are formed on the lower core layer, and an upper core layer is formed over the lower magnetic pole layer and the coil-insulating layer. This configuration decreases the height of the coil-insulating layer from the lower magnetic pole layer compared to the height in a conventional thin-film magnetic head. The front end of the upper core layer can be precisely formed so as to have a track width Tw. This thin-film magnetic head is suitable for narrower track widths.

    摘要翻译: 在薄膜磁头中,在下芯层上形成下磁极层,以在下芯层和下磁极层之间形成台阶。 在下芯层上形成线圈层和线圈绝缘层,在下磁极层和线圈绝缘层上形成上芯层。 与以往的薄膜磁头的高度相比,这种构造使线圈绝缘层与下磁极层的高度相比降低。 上芯层的前端可精确地形成为具有轨道宽度Tw。 该薄膜磁头适用于较窄的轨道宽度。

    THIN-FILM MAGNETIC HEAD CAPABLE OF SECURING INSULATING PROPERTY AND MINIMIZING PROJECTION OF A RECORDING ELEMENT SECTION DUE TO HEAT EXPANSION
    8.
    发明申请
    THIN-FILM MAGNETIC HEAD CAPABLE OF SECURING INSULATING PROPERTY AND MINIMIZING PROJECTION OF A RECORDING ELEMENT SECTION DUE TO HEAT EXPANSION 有权
    薄膜电磁头能够保护绝热材料和最小化延伸部件的记录元件部分

    公开(公告)号:US20070230041A1

    公开(公告)日:2007-10-04

    申请号:US11692046

    申请日:2007-03-27

    IPC分类号: G11B5/17 G11B5/147

    摘要: A thin-film magnetic head is capable of securing an insulating property and minimizing the projection of a recording element section due to heat expansion. The thin-film magnetic head includes a pair of magnetic layers disposed with a predetermined gap therebetween on a surface facing a recording medium. The layers are connected to each other along an inner part in a height direction from the medium-facing surface. A spiral recording coil is disposed between the pair of magnetic layers and wound around a connecting portion of the pair of magnetic layers. The recording coil includes a dense coil portion formed with a pitch smaller than that of the inner part in the height direction so as to be closer to the medium-facing surface than the connecting portion. An organic insulating layer is locally formed to fill coil gaps of the dense coil portion, and coil gaps other than those of the dense coil portion are filled with an inorganic insulating layer.

    摘要翻译: 薄膜磁头能够确保绝缘性能,并且由于热膨胀使记录元件部分的投影最小化。 薄膜磁头包括在与记录介质相对的表面上以预定间隙设置的一对磁性层。 这些层沿着与介质相对表面在高度方向上的内部部分彼此连接。 螺旋记录线圈设置在一对磁性层之间,并缠绕在一对磁性层的连接部分上。 记录线圈包括致密线圈部分,其形成为具有比内部部分在高度方向上的间距更小的间距,以便比连接部分更靠近中间面。 局部地形成有机绝缘层以填充致密线圈部分的线圈间隙,而不是致密线圈部分的线圈间隙填充有无机绝缘层。

    Method of manufacturing a thin film magnetic head
    9.
    发明申请
    Method of manufacturing a thin film magnetic head 失效
    制造薄膜磁头的方法

    公开(公告)号:US20070067983A1

    公开(公告)日:2007-03-29

    申请号:US11527892

    申请日:2006-09-27

    IPC分类号: G11B5/127

    摘要: A manufacturing method of a thin film magnetic head is provided. In the manufacturing method of a thin film magnetic head, an inorganic insulating layer is formed along at least a sidewall surface of each conductor part. A gap of each conductor part is filled by an organic insulating layer. An upper surface of the conductor part, a magnetic pole portion, and a connecting layer are grinded to be planar with an organic insulating layer and an inorganic insulating layer. During an upper surface of each conductor part is grinded, the inorganic insulating layer, which is hard, suppresses a shear drop of each conductor part by grinding.

    摘要翻译: 提供了薄膜磁头的制造方法。 在薄膜磁头的制造方法中,沿着每个导体部分的至少一个侧壁表面形成无机绝缘层。 每个导体部分的间隙由有机绝缘层填充。 将导体部分的上表面,磁极部分和连接层用有机绝缘层和无机绝缘层研磨成平面。 在每个导体部分的上表面被研磨时,硬的无机绝缘层通过研磨抑制每个导体部分的剪切降。