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    HUMIDITY SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    HUMIDITY SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开
    湿度传感器封装及其制造方法

    公开(公告)号：US20120000284A1

    公开(公告)日：2012-01-05

    申请号：US13169918

    申请日：2011-06-27

    申请人： Shinya Yokoyama ,  Satoshi Waga ,  Atsushi Tondokoro ,  Tadashi Sakashita ,  Hideki Hasegawa ,  Sumihito Morita ,  Hideki Kamimura ,  Masaya Yamatani

    发明人： Shinya Yokoyama ,  Satoshi Waga ,  Atsushi Tondokoro ,  Tadashi Sakashita ,  Hideki Hasegawa ,  Sumihito Morita ,  Hideki Kamimura ,  Masaya Yamatani

    IPC分类号： G01N27/22 ,  B23P25/00

    CPC分类号： G01D11/245 ,  G01N33/0014 ,  Y10T29/4998

    摘要： A humidity sensor package includes: a humidity sensor that is mounted on a main surface of a package substrate and that have a humidity-sensing area; a control IC that is mounted on the main surface of the package substrate; a sealing resin that seals at least an external connection portion of the humidity sensor; and a partition member that partitions a sealing area of the sealing resin and the humidity-sensing area from each other so as to expose the humidity-sensing area to an external environment. Here, a first distance in the thickness direction from the package substrate to the top surface of the partition member is smaller than a second distance in the thickness direction from the package substrate to the top surface of the sealing resin.

    摘要翻译： 一种湿度传感器包括：湿度传感器，其安装在封装基板的主表面上并具有湿度感测区域; 控制IC，其安装在所述封装基板的主表面上; 至少密封湿度传感器的外部连接部分的密封树脂; 以及分隔构件，其将密封树脂的密封区域和湿度感测区域彼此分隔开，以将湿度感测区域暴露于外部环境。 这里，从封装基板到分隔部件的顶面的厚度方向的第一距离小于从封装基板到密封树脂的顶面的厚度方向的第二距离。

    Capacitive type humidity sensor and manufacturing method thereof
    2.
    发明授权
    Capacitive type humidity sensor and manufacturing method thereof 有权
    电容式湿度传感器及其制造方法

    公开(公告)号：US08776597B2

    公开(公告)日：2014-07-15

    申请号：US13232589

    申请日：2011-09-14

    申请人： Satoshi Waga ,  Sumihito Morita ,  Masaru Sakurai ,  Masaya Yamatani ,  Hideki Kamimura

    发明人： Satoshi Waga ,  Sumihito Morita ,  Masaru Sakurai ,  Masaya Yamatani ,  Hideki Kamimura

    IPC分类号： G01N27/22 ,  B81B7/00

    CPC分类号： G01N27/223 ,  B81B7/0032 ,  G01N27/225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  Y10T29/49007 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.

    摘要翻译： 提供了一种电容式湿度传感器，其中传感器芯片基板具有静电电容根据湿度变化的传感器部分，静电电容不变的参考部分和作为每个部分的输出端子的多个焊盘， 并且电连接到焊盘并将这些部分之间的电容差输出为电压的IC基板固定到相同的支撑基板，其中形成围绕传感器部分的密封区域的保护构件， 覆盖参考部分，设置在传感器芯片基板上，除了由保护部件覆盖的区域之外，支撑基板被密封树脂​​覆盖，传感器部分在被保护件包围的区域处暴露于空气中 构件，并且其它构成元件被密封树脂​​覆盖。

    CAPACITIVE TYPE HUMIDITY SENSOR AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    CAPACITIVE TYPE HUMIDITY SENSOR AND MANUFACTURING METHOD THEREOF 有权
    电容式湿度传感器及其制造方法

    公开(公告)号：US20120000285A1

    公开(公告)日：2012-01-05

    申请号：US13232589

    申请日：2011-09-14

    申请人： Satoshi Waga ,  Sumihito Morita ,  Masaru Sakurai ,  Masaya Yamatani ,  Hideki Kamimura

    发明人： Satoshi Waga ,  Sumihito Morita ,  Masaru Sakurai ,  Masaya Yamatani ,  Hideki Kamimura

    IPC分类号： G01N27/22 ,  G01R3/00

    CPC分类号： G01N27/223 ,  B81B7/0032 ,  G01N27/225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  Y10T29/49007 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.

    摘要翻译： 提供了一种电容式湿度传感器，其中传感器芯片基板具有静电电容根据湿度变化的传感器部分，静电电容不变的参考部分和作为每个部分的输出端子的多个焊盘， 并且电连接到焊盘并将这些部分之间的电容差输出为电压的IC基板固定到相同的支撑基板，其中形成围绕传感器部分的密封区域的保护构件， 覆盖参考部分，设置在传感器芯片基板上，除了由保护部件覆盖的区域之外，支撑基板被密封树脂​​覆盖，传感器部分在被保护件包围的区域处暴露于空气中 构件，并且其它构成元件被密封树脂​​覆盖。

    SAW filter and method of manufacturing the same
    5.
    发明授权
    SAW filter and method of manufacturing the same 有权
    SAW滤波器及其制造方法

    公开(公告)号：US07498905B2

    公开(公告)日：2009-03-03

    申请号：US11204119

    申请日：2005-08-15

    申请人： Takuo Kudo ,  Satoshi Waga

    发明人： Takuo Kudo ,  Satoshi Waga

    IPC分类号： H03H9/64

    CPC分类号： H03H9/6483 ,  H03H9/02921

    摘要： In an SAW filter on one side of a piezoelectric substrate are formed a pattern portion constituted by a conductor and provided on the outer circumferential portion of the surface acoustic wave device, and a conductor removing portion formed between the surface acoustic wave device and the pattern portion. The shape of the surface acoustic wave device is formed by the conductor removing portion and the surface acoustic wave device remains non-conductive with the pattern by the conductor removing portion.

    摘要翻译： 在压电基板的一侧的SAW滤波器中，形成由导体构成的图案部，设置在弹性表面波元件的外周部，形成在弹性表面波元件与图案部之间的导体除去部 。 声表面波装置的形状由导体去除部形成，声表面波装置通过导体去除部保持与图案不导通。

    Surface acoustic wave device and manufacturing method thereof
    6.
    发明申请
    Surface acoustic wave device and manufacturing method thereof 审中-公开
    声表面波装置及其制造方法

    公开(公告)号：US20050127794A1

    公开(公告)日：2005-06-16

    申请号：US11007489

    申请日：2004-12-08

    申请人： Kyosuke Ozaki ,  Hideyuki Takahashi ,  Takashi Sato ,  Satoshi Waga ,  Takeshi Ikeda ,  Toshihiro Meguro

    发明人： Kyosuke Ozaki ,  Hideyuki Takahashi ,  Takashi Sato ,  Satoshi Waga ,  Takeshi Ikeda ,  Toshihiro Meguro

    IPC分类号： H03H9/145 ,  H03H3/08 ,  H03H3/10 ,  H03H9/02 ,  H03H9/25

    CPC分类号： H03H9/02834

    摘要： A piezoelectric substrate and interdigital electrode portions are covered with an insulating layer with an insulating thin film interposed therebetween. The piezoelectric substrate is made of LiTaO3 and the insulating thin film and the insulating layer are made of silicon oxide. By intentionally making the upper surface of the insulating layer flat, the deterioration of propagation efficiency of surface acoustic waves can be suppressed, so that it is possible to reduce increase in insertion loss of a resonator. Since the upper surface of the insulating layer is flat, it is also possible to reduce variation in resonant frequency and anti-resonant frequency due to the temperature change of the surface acoustic wave device.

    摘要翻译： 压电基板和叉指电极部分被绝缘层覆盖，绝缘层介于其间。 压电基板由LiTaO 3 3制成，绝缘薄膜和绝缘层由氧化硅制成。 通过有意地使绝缘层的上表面平坦化，可以抑制表面声波的传播效率的恶化，从而可以减小谐振器的插入损耗的增加。 由于绝缘层的上表面是平坦的，所以也可以减小由于弹性表面波器件的温度变化引起的谐振频率和反谐振频率的变化。

    Method of manufacturing surface acoustic wave device
    9.
    发明授权
    Method of manufacturing surface acoustic wave device 有权
    表面声波装置的制造方法

    公开(公告)号：US07368034B2

    公开(公告)日：2008-05-06

    申请号：US11179111

    申请日：2005-07-11

    申请人： Shiro Ikeda ,  Satoshi Waga

    发明人： Shiro Ikeda ,  Satoshi Waga

    IPC分类号： B29C65/00 ,  H03H9/25

    CPC分类号： H03H9/02921 ,  H03H3/08

    摘要： A method of manufacturing a surface acoustic wave device includes interposing a thermosetting adhesive between the insulator that is inserted in the housing portion while the comb-shaped electrodes are directed upward and a bottom portion of the housing portion, and curing the adhesive by heating in a state in which a conductive member is disposed near the opening portion to come in contact with the comb-shaped electrodes, such that the conductive member is separated from the comb-shaped electrodes. Accordingly, a process of forming a conductive film made of carbon and a process of removing the conductive film are not required. Therefore, it is possible to provide a method of manufacturing a surface acoustic wave device that has high productivity and that prevents pyroelectric breakdown between the comb-shaped electrodes at low cost.

    摘要翻译： 一种表面声波装置的制造方法，其特征在于，在所述绝缘体插入所述壳体部的同时，将所述梳状电极向上方延伸的壳体部的底部插入所述热固性粘合剂， 导电构件设置在开口部附近以与梳状电极接触的状态，使得导电构件与梳状电极分离。 因此，不需要形成由碳制成的导电膜的工艺和除去导电膜的工艺。 因此，可以提供一种制造具有高生产率并且以低成本防止梳状电极之间的热电击穿的表面声波装置的方法。