摘要:
The present invention provides an inspection apparatus and inspection method capable of inspecting the shape of a board used in a liquid crystal panel with high fineness and efficiency. A computer 21 controls an X-electrode select section 22 and a Y-electrode select section 23 to drive liquid crystal driving electrodes 102 selectively. A FLASHSHOCK Sensor 1 is located at a position opposed to a board 100 in a non-contact manner. The FLASHSHOCK Sensor 1 is adapted to detect each potential variation caused in the liquid crystal electrodes 101-104 and then output the detected potential variation to the computer 21 as a detect signal. The computer 21 receives the detect signal from the FLASHSHOCK Sensor 1 to create image data, and detects disconnection, short-circuit, chipping or the like in the liquid crystal electrodes based on the created image data. Further, the computer 21 displays an image representing each shape of the liquid crystal electrodes on a display 21a.
摘要:
It is an object of the present invention to finely inspect a dimension of a conductive pattern. A sensor element 12a includes an MOSFET. A diffusion layer of the MOSFET having a larger surface area serves as a passive element, and is placed opposes to the conductive pattern. The passive element is formed continuously with a source of the MOSFET to be electrically conductive thereto. A gate of the MOSFET is connected to a vertical select section 14, and a drain of the MOSFET is connected to a lateral select section 13. When a sensor element 12a is selected by a timing generating section 15, a signal is transmitted from the vertical select section 14 to the gate to turn on the MOSFET. In this moment, if an inspection signal is output from a probe 22, the potential in the conductive pattern 101 is varied. Thus, a current flows from the source to the drain and then the current is transmitted to a signal processing section 16 through the lateral select section 13. By analyzing the position of the sensor element which outputs a detect signal, the position of the conductive pattern 101 in a circuit board 100 may be discriminated.
摘要:
The present invention provides an inspection apparatus and method capable of intuitively obtaining inspection results of circuit wirings. An inspection system 20 comprises a sensor chip 1 including plural sensor elements, a computer 21, probes 22 for supplying an inspection signal to circuit wirings 101, and a selector 23 for switching the supply of the inspection signal to the probes 22. The computer 21 receives the detected signals from the sensor chip 1, and generates an image data to display an image of the circuit wirings as an inspection subject on a display 21a. This make it possible to check the shape of the specific circuit wiring and to detect defects such as disconnection, short-circuit, and chipping in the circuit wiring 101 based on the generated image data and the design image data representing the design circuit wiring.
摘要:
An inspection apparatus is provided capable of adequately positioning an inspection chip to a conductive pattern as an inspection object. For connecting an electrode pad 1b of an inspection chip 1 with a lead 2a of a package 2, bump electrodes 3 and 4 are first provided at the inspection chip and at the package, respectively. Then, an anisotropic conductor 5 is provided to cover between the bump electrodes 3 and 4, and a conductor film 6 is provided on the anisotropic conductor 5 to extend between the bump electrodes 3 and 4. The anisotropic conductor 5 is thermo-compression bonded to provide an electrical connection between the conductor film 6 and the bump electrodes 3 and 4. This structure may provide a desirable surface of the inspection chip 1 having a sufficiently reduced thickness.
摘要:
Disclosed is an apparatus and method for detecting positional displacement of a board. A board 20 having a surface formed with a conductive pattern 25 is transferred in a direction A while supplying an AC signal from a power supply section 3 to the surface of the board. The level of positional displacement of the board is detected in accordance with the transfer speed of the board and the difference between the timings of the intermediate signal levels generated when the AC signal is sensed by a pair of position sensors 1, 2 opposed to the leading edge of the board. The present invention allows positional displacement of the board to be detected in a simple non-contact structure while maintaining a high degree of accuracy without variation over time.
摘要:
Disclosed is an circuit-pattern inspection apparatus comprising a power supply element 30 adapted to be capacitively coupled with a parallel array of conductive patterns 20 to supply an inspection signal to one end of each of the conductible patterns, an open sensor 40 adapted to be capacitively coupled with all of the other ends of the conductive patterns to detect the inspection signal, and a short sensor 50 arranged at a position displaced from the power supply element 30 and adapted to be capacitively coupled with two lines of the conductive patterns to detect the inspection signal. The quality of the conductive pattern is inspected such that the presence of disconnection is determined when the detect signal from the open sensor 40 is largely reduced, and the presence of short is determined when the detect signal from the short sensor 50 largely rises and then falls. The circuit-pattern inspection apparatus can detect defects in a circuit board reliably and readily.
摘要:
Disclosed is a circuit pattern inspection apparatus for inspecting a conductive pattern of a circuit board which includes first and second comb-shaped conductive patterns (15a, 15b) each having a plurality of terminal portions arranged substantially parallel to each other and a base portion connecting respective anchor ends of the terminal portions together, wherein the terminal portions of the first comb-shaped conductive pattern are alternately arranged with respect to the terminal portions of said second comb-shaped conductive pattern, and the first second comb-shaped conductive patterns (15a, 15b) are adapted, respectively, to be supplied with an AC inspection signal, and grounded. The circuit pattern inspection apparatus having first and second detection means (20, 30) each having a detection electrode for detecting a signal from the first and second comb-shaped conductive patterns, and a scalar robot (80) operable to move each of the first and second detection means (20, 30) across common ones of the terminal portions, while allowing them be capacitively coupled with the terminal portions.
摘要:
The present invention discloses a technique for inspecting a branched circuit wiring having branch portions branched halfway therefrom by using a less number of non-contact sensors. An inspection method for inspecting a branched circuit wiring having three or more ends, including the steps of: supplying an inspection signal to one end of the branched circuit wiring; disposing one or more non-contact sensors for detecting the inspection signal while being in non-contact with the branched circuit wiring over the remaining ends other than one end of the branched circuit wiring; and determining if any disconnection is caused in the branched circuit wiring, based on the inspection signal detected by the one or more non-contact sensors. The disposing step includes the step of arranging at least one of the one or more non-contact sensors to cover the remaining ends.
摘要:
Disclosed is a circuit-pattern inspection apparatus for inspecting a comb-shaped pattern 20 having an edge region formed as a plurality of finger pattern segments and a base region formed as an integral connection pattern segment, and a plurality of discrete patterns 30 each disposed between the adjacent finger pattern segments in a non-connecting manner and being not in connecting with the remaining discrete patterns. The inspection apparatus comprises means for supplying an AC signal alternately to either one of the finger pattern segments and both the finger pattern segments and the discrete patterns while maintaining the other at a ground potential, and sensors 131, 132, 133 for detecting the AC signal disposed in the edge region. The inspection apparatus can reliably detect the presence of defects in a circuit board without any difficulties.
摘要:
An inspection apparatus and method are disclosed. The inspection apparatus comprises a probe 30 having a width equal to or less than that of the layout pitch of conductive patterns 15 to be inspected, and a sensor section 20 having an area capable of covering the layout region of the conductive patterns. The probe 30 is adapted to be scanningly moved across an inspection-signal supply region including respective portions of the conductive patterns. The sensor section 20 is positioned opposed to the conductive patterns 15. An AC inspection signal is fed from an AC power source 35 to the probe 30 to form a capacitive coupling between one electrode or the conductive pattern, and the other electrode or the sensor section 20, and a detected signal from the sensor section 20 is amplified through an amplifier 25 to check the detected signal. Then, it is determined if each of the conductive patterns supplied with the inspection signal includes a short-circuit, according to whether the level of the detected signal is different from a signal level in a normal state. The present invention can provide an inspection apparatus and method capable of readily detecting a short-circuit possibly existing in various conductive patterns, in a simple control.