公开(公告)号：US06700186B2

公开(公告)日：2004-03-02

申请号：US10024827

申请日：2001-12-17

申请人： Shoshi Yasunaga ,  Hideshi Hanada ,  Takahiro Ishibashi ,  Jun Sugimoto ,  Yuichi Dohki ,  Hitoshi Etoh

发明人： Shoshi Yasunaga ,  Hideshi Hanada ,  Takahiro Ishibashi ,  Jun Sugimoto ,  Yuichi Dohki ,  Hitoshi Etoh

IPC分类号： H01L23495

CPC分类号： H01L23/49541 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A lead frame for a semiconductor device. The semiconductor device has a sheet with oppositely facing sides and a thickness between the oppositely facing sides. The sheet has first and second unit lead frames. Each unit lead frame has a support for a semiconductor chip and at least one lead space from the support. The sheet has a tie bar network which connects a) the support to the at least one lead on each of the first and second lead frames and b) the first and second lead frames, each to the other. The sheet has a dividing line along which the sheet can be cut to separate the first and second lead frames from each other. The tie bar network consists of at least one tie bar extending along a substantial length of the dividing line. The support has a first thickness between the oppositely facing sides of the sheet. The at least one tie bar has a second thickness between the oppositely facing sides of the sheet over a substantial length of the dividing line that is less than the first thickness.

摘要翻译： 一种用于半导体器件的引线框架。 半导体器件具有相对面对的片材和相对面对侧之间的厚度。 片材具有第一和第二单元引线框架。 每个单元引线框架具有对于半导体芯片的支持和至少一个来自支撑件的引导空间。 该片材具有连接杆网络，其将支撑件连接到第一和第二引线框架中的每一个上的至少一个引线，以及b）第一引线框架和第二引线框架。 片材具有分割线，沿着该分割线可以切割片材以使第一和第二引线框架彼此分离。 连杆网络由至少一个沿着分割线的相当长度延伸的连杆构成。 支撑件在片材的相对面侧之间具有第一厚度。 所述至少一个连接杆在所述分隔线的相当长度上小于所述第一厚度的所述片材的相对面对之间具有第二厚度。

公开(公告)号：US06518657B2

公开(公告)日：2003-02-11

申请号：US09878637

申请日：2001-06-11

申请人： Hideshi Hanada ,  Jun Sugimoto ,  Yuichi Douki

发明人： Hideshi Hanada ,  Jun Sugimoto ,  Yuichi Douki

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device having oppositely facing first and second sides. The semiconductor device has a support exposed at the first side of the semiconductor device, a semiconductor device mounted on the support, and a plurality of leads connected to the semiconductor device. A lead identifier on the support is visible at the first side of the semiconductor device, and assists identification of a specific lead in the plurality of leads.