公开(公告)号：US20200262024A1

公开(公告)日：2020-08-20

申请号：US16795103

申请日：2020-02-19

申请人： Shou-Sung Chang ,  Hari Soundararajan ,  Haosheng Wu ,  Jianshe Tang

发明人： Shou-Sung Chang ,  Hari Soundararajan ,  Haosheng Wu ,  Jianshe Tang

IPC分类号： B24B37/015

摘要： A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.

公开(公告)号：US20200001426A1

公开(公告)日：2020-01-02

申请号：US16448874

申请日：2019-06-21

申请人： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang ,  Jeonghoon Oh ,  Rajeev Bajaj ,  Andrew Siordia

发明人： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang ,  Jeonghoon Oh ,  Rajeev Bajaj ,  Andrew Siordia

IPC分类号： B24B37/015 ,  B24B37/20 ,  B24B37/27 ,  G05D23/24

摘要： A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system. The temperature control system includes a plurality of thermal control modules positioned above the polishing pad at a plurality of different radial positions to heat or cool a plurality of regions of the polishing pad. Each thermal control module is configured to independently heat or cool a radial region of the polishing pad.

公开(公告)号：US20200001427A1

公开(公告)日：2020-01-02

申请号：US16448980

申请日：2019-06-21

申请人： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang ,  Jeonghoon Oh ,  Rajeev Bajaj ,  Andrew Siordia

发明人： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang ,  Jeonghoon Oh ,  Rajeev Bajaj ,  Andrew Siordia

IPC分类号： B24B37/015 ,  B24B57/02 ,  B24B37/20

摘要： A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.