公开(公告)号：US08329556B2

公开(公告)日：2012-12-11

申请号：US12158678

申请日：2006-12-19

Applicant: Shu Yuan ,  Jing Lin

Inventor： Shu Yuan ,  Jing Lin

IPC: H01L21/44 ,  H01L21/46

CPC classification number: H01L21/268 ,  H01L21/2686 ,  H01L21/28575

Abstract: A process for the fabrication of semiconductor devices on a substrate, the semiconductor devices including at least one metal layer. The process includes, removing the substrate and applying a second substrate; and annealing the at least one metal layer by application of a beam of electromagnetic radiation on the at least one metal layer.

Abstract translation: 一种用于在衬底上制造半导体器件的工艺，所述半导体器件包括至少一个金属层。 该方法包括：去除衬底并施加第二衬底; 以及通过在所述至少一个金属层上施加电磁辐射束来对所述至少一个金属层进行退火。

公开(公告)号：US20100047996A1

公开(公告)日：2010-02-25

申请号：US12158678

申请日：2006-12-19

Applicant: Shu Yuan ,  Jing Lin

Inventor： Shu Yuan ,  Jing Lin

IPC: H01L21/26 ,  H01L21/30

CPC classification number: H01L21/268 ,  H01L21/2686 ,  H01L21/28575

Abstract: A process for the fabrication of semiconductor devices on a substrate, the semiconductor devices including at least one metal layer. The process includes, removing the substrate and applying a second substrate; and annealing the at least one metal layer by application of a beam of electromagnetic radiation on the at least one metal layer.

Abstract translation: 一种用于在衬底上制造半导体器件的工艺，所述半导体器件包括至少一个金属层。 该方法包括：去除衬底并施加第二衬底; 以及通过在所述至少一个金属层上施加电磁辐射束来对所述至少一个金属层进行退火。

公开(公告)号：USD937466S1

公开(公告)日：2021-11-30

申请号：US29764785

申请日：2021-01-02

Applicant: Jing Lin

Designer： Jing Lin

公开(公告)号：USD928385S1

公开(公告)日：2021-08-17

申请号：US29775743

申请日：2021-03-25

Applicant: Jing Lin

Designer： Jing Lin

公开(公告)号：US20150233840A1

公开(公告)日：2015-08-20

申请号：US13998046

申请日：2013-09-25

Applicant: Ajharali Amanullah ,  Jing Lin ,  Kok Weng Wong

Inventor： Ajharali Amanullah ,  Jing Lin ,  Kok Weng Wong

IPC: G01N21/88 ,  H04N5/235 ,  G06T7/00 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/8825 ,  G01N2201/06113 ,  G01N2201/0636 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/10152 ,  G06T2207/20212 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H04N5/2354 ,  H01L2924/00

Abstract: An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer. The system comprises a reflector assembly for enabling the third image capture device to receive illumination reflected from the semiconductor wafer in multiple directions.

Abstract translation: 用于检查半导体晶片的检查系统。 检查系统包括用于提供宽带照明的照明设备。 宽带照明可以具有不同的对比度，例如明场和暗场宽带照明。 检查系统还包括第一图像捕获装置和第二图像捕获装置，每个被配置为在半导体晶片运动的同时接收宽带照明以捕获半导体晶片的图像。 该系统包括许多用于使准直宽带照明的管透镜。 该系统还包括稳定机构和物镜组件。 该系统还包括细线照明发射器和用于接收细线照明从而捕获半导体晶片的三维图像的第三图像捕获装置。 该系统包括反射器组件，用于使得第三图像捕获装置能够在多个方向上接收从半导体晶片反射的照明。

公开(公告)号：US08452086B2

公开(公告)日：2013-05-28

申请号：US12500928

申请日：2009-07-10

Applicant: Eric Saund ,  Jing Lin ,  Prateek Sarkar

Inventor： Eric Saund ,  Jing Lin ,  Prateek Sarkar

IPC: G06K9/34

CPC classification number: G06K9/34 ,  G06K9/00456 ,  G06K9/00476 ,  G06K9/6254 ,  G06K2209/01

Abstract: A user interface and method is embodied on a computer readable medium and executable on a computer. The user interface is a labeler which labels only foreground pixels of an image stored in a computing environment. The labeler operates in a Region mode/state and Brush mode/state, and includes a Tentative mode that permits an assigned label to be changed after pixels have been selected. Groups of pixels may be selected for labeling at once by a point-and-click command, and a pixel may belong to one or more groups of pixels which are stored in memory as image layers. The groups are formed dynamically by user selection actions, and/or through automatic recognition algorithms. Pixels already labeled with certain labels may be locked to not be altered by additional labeling operations. Unassigned pixels may be highlighted to increase the ease at which they are identified in an image. Comparisons between labeled images are undertaken to indicate differences between different groundtruth labeling.

Abstract translation: 用户界面和方法体现在计算机可读介质上并且可在计算机上执行。 用户界面是仅标记存储在计算环境中的图像的前景像素的标签器。 标签器在区域模式/状态和画笔模式/状态下工作，并且包括允许在选择像素之后更改分配的标签的暂定模式。 可以通过点击命令一次选择像素组来标记，并且像素可以属于作为图像层存储在存储器中的一组或多组像素。 通过用户选择动作和/或通过自动识别算法动态地形成组。 已经标注了某些标签的像素可能会被锁定，以免被额外的标签操作所改变。 可以突出显示未分配的像素以增加在图像中识别它们的容易性。 进行标记图像之间的比较，以指示不同的地面标签之间的差异。

公开(公告)号：US20110071043A1

公开(公告)日：2011-03-24

申请号：US12880841

申请日：2010-09-13

Applicant: Hugh A. Sampson ,  Jing Lin ,  Ludmilla Bardina

Inventor： Hugh A. Sampson ,  Jing Lin ,  Ludmilla Bardina

IPC: C40B30/04 ,  C40B40/10 ,  C07K7/08 ,  C07K14/00

CPC classification number: G01N33/6854 ,  G01N2333/4731 ,  G01N2800/24

Abstract: Methods for performing epitope mapping, and for characterizing the antibody binding affinity and epitope diversity of antibodies in a sample using peptide microarray are provided. In some aspects, methods are provided for the specific characterization of IgE and IgG4. Also disclosed are methods for diagnosing whether a milk-allergic individual will outgrow his or her allergy based on the characterization of the individual's milk allergen-specific IgE antibodies.

Abstract translation: 提供了使用肽微阵列进行表位作图和用于表征样品中抗体结合亲和力和抗体表位多样性的方法。 在一些方面，提供了用于IgE和IgG4的特异性表征的方法。 还公开了用于基于个体的牛奶变应原特异性IgE抗体的表征来诊断乳过敏个体是否会超过他或她的过敏的方法。

公开(公告)号：US20090266718A1

公开(公告)日：2009-10-29

申请号：US12225785

申请日：2007-04-05

Applicant: Jing Lin

Inventor： Jing Lin

IPC: G01N27/327 ,  G01N27/26

CPC classification number: C12Q1/006 ,  C12Q1/004 ,  G01N27/3274

Abstract: An electrochemical test sensor is adapted to measure glucose and correct for the oxygen effect in a fluid sample. The test sensor comprises a base, first and second working electrodes, and a counter electrode. The first working electrode includes glucose oxidase, a mediator and peroxidase. The second working electrode includes glucose oxidase and the mediator. The first working electrode, the second working electrode and the counter electrode are located on the base. In other embodiments, an electrochemical test sensor is adapted to measure cholesterol, lactate, pyruvate or xanthine and correct for the oxygen effect in a fluid sample.

Abstract translation: 电化学测试传感器适于测量葡萄糖并校正流体样品中的氧效应。 测试传感器包括基座，第一和第二工作电极以及对电极。 第一工作电极包括葡萄糖氧化酶，介体和过氧化物酶。 第二工作电极包括葡萄糖氧化酶和介体。 第一工作电极，第二工作电极和对电极位于基座上。 在其他实施方案中，电化学测试传感器适于测量胆固醇，乳酸盐，丙酮酸盐或黄嘌呤并校正流体样品中的氧效应。

公开(公告)号：US20050277298A1

公开(公告)日：2005-12-15

申请号：US11201845

申请日：2005-08-11

Applicant: Jing Lin ,  Ching-Hua Hsieh ,  Shau-Lin Shue ,  Mong-Song Liang

Inventor： Jing Lin ,  Ching-Hua Hsieh ,  Shau-Lin Shue ,  Mong-Song Liang

IPC: H01L21/44 ,  H01L21/4763 ,  H01L21/768 ,  H01L23/532 ,  H01L33/00

CPC classification number: H01L21/76843 ,  H01L21/76807 ,  H01L21/76831 ,  H01L21/76832 ,  H01L21/76834 ,  H01L21/76855 ,  H01L21/76864 ,  H01L21/76873 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A new method and structure is provided for the creation of a copper dual damascene interconnect. A dual damascene structure is created in the layer of dielectric, optionally a metal barrier layer is deposited over exposed surfaces of the dual damascene structure. A copper seed layer is deposited, the dual damascene structure is filled with copper. An anneal is applied to the created copper interconnect after which excess copper is removed from the dielectric. Of critical importance to the invention, a thin layer of oxide is then deposited as a cap layer over the copper dual damascene interconnect, an etch stop layer is then deposited over the thin layer of oxide for continued upper-level metallization.

Abstract translation: 提供了一种新的方法和结构，用于创建铜双镶嵌互连。 在电介质层中产生双镶嵌结构，任选地，金属阻挡层沉积在双镶嵌结构的暴露表面上。 沉积铜籽晶层，双镶嵌结构填充铜。 对所制造的铜互连进行退火，之后从电介质去除多余的铜。 对本发明至关重要的是，然后在铜双镶嵌互连件上沉积薄层的氧化物作为覆盖层，然后将蚀刻停止层沉积在氧化物薄层上用于持续的上层金属化。

公开(公告)号：US20140099363A1

公开(公告)日：2014-04-10

申请号：US14111480

申请日：2012-04-11

Applicant: Jing Lin

Inventor： Jing Lin

IPC: A61K9/48 ,  A61J3/07 ,  A61K35/64

CPC classification number: A61K9/4808 ,  A23L21/25 ,  A23L29/10 ,  A23P10/30 ,  A61J3/07 ,  A61K9/4825 ,  A61K9/4875 ,  A61K35/644

Abstract: This invention provides capsules and, more specifically soft capsules, wherein the fill material comprises an emulsified syrup. In particular, the present invention provides a means of encapsulating honey in a gelatin, modified-gelatin or gelatin-free shell material. Furthermore, the capsules described herein are capable of being manufactured using a rotary die apparatus.

Abstract translation: 本发明提供胶囊，更具体地说是软胶囊，其中填充材料包含乳化糖浆。 特别地，本发明提供了将蜂蜜包封在明胶，改性明胶或不含明胶的外壳材料中的方法。 此外，本文所述的胶囊能够使用旋转模具装置制造。