Doped silicon deposition process in resistively heated single wafer chamber
    1.
    发明授权
    Doped silicon deposition process in resistively heated single wafer chamber 有权
    在电阻加热的单晶片室中掺杂硅沉积工艺

    公开(公告)号:US06559039B2

    公开(公告)日:2003-05-06

    申请号:US09858821

    申请日:2001-05-15

    IPC分类号: H01L2124

    摘要: A method for depositing doped polycrystalline or amorphous silicon film. The method includes placing a substrate onto a susceptor. The susceptor includes a body having a resistive heater therein and a thermocouple in physical contact with the resistive heater. The susceptor is located in the process chamber such that the process chamber has a top portion above the susceptor and a bottom portion below the susceptor. The method further includes heating the susceptor. The method further includes providing a process gas mix into the process chamber through a shower head located on the susceptor. The process gas mix includes a silicon source gas, a dopant gas, and a carrier gas. The carrier gas includes nitrogen. The method further includes forming the doped silicon film from the silicon source gas.

    摘要翻译: 一种沉积掺杂多晶或非晶硅膜的方法。 该方法包括将基底放置在基座上。 感受体包括其中具有电阻加热器的主体和与电阻加热器物理接触的热电偶。 感受体位于处理室中,使得处理室具有在基座上方的顶部部分和基座下方的底部部分。 该方法还包括加热基座。 该方法还包括通过位于基座上的喷淋头将工艺气体混合物提供到处理室中。 处理气体混合物包括硅源气体,掺杂剂气体和载气。 载气包括氮气。 该方法还包括从硅源气体形成掺杂硅膜。