Method for producing a strained layer on a substrate and corresponding layer structure
    2.
    发明授权
    Method for producing a strained layer on a substrate and corresponding layer structure 失效
    在基板上制造应变层的方法和相应的层结构

    公开(公告)号:US07416965B2

    公开(公告)日:2008-08-26

    申请号:US10553562

    申请日:2004-04-15

    IPC分类号: H01L21/36

    摘要: The invention relates to a method for producing a layer structure comprising a strained layer on a substrate. The inventive method comprises the steps of producing a defect area in a layer adjoining the layer to be strained, and relaxing at least one layer adjoining the layer to be strained. The defect area is especially produced in the substrate. Additional layers can be epitactically grown. Layer structures so produced are especially suitable for producing various types of components.

    摘要翻译: 本发明涉及一种用于制造包括在基底上的应变层的层结构的方法。 本发明的方法包括以下步骤:在邻近待应变层的层中产生缺陷区域,以及放置邻近待应变层的至少一层。 缺陷区域特别是在衬底中产生。 另外的层可以被外延生长。 如此生产的层结构特别适用于生产各种类型的部件。