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公开(公告)号：US10582642B2
公开(公告)日：2020-03-03
申请号：US15751243
申请日：2016-07-08
Applicant: Siemens Aktiengesellschaft
Inventor： Martin Franke , Peter Frühauf , Rüdiger Knofe , Bernd Müller , Stefan Nerreter , Michael Niedermayer , Ulrich Wittreich , Manfred Zäske
Abstract: Examples include cooling members for electronic components and/or methods for producing cooling members. The members may include: an assembly side for an electronic component and an upper side opposite the assembly side; at least one cooling chimney extending through the cooling member away from the assembly side which leads to an outlet opening in the upper side of the cooling member; and a number of cooling channels. The cooling channels may have a smaller cross-section than a cross-section of the cooling chimney which lead from inlet openings in the upper side of the cooling member to the cooling chimney.
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公开(公告)号：US20180269371A1
公开(公告)日：2018-09-20
申请号：US15761485
申请日：2016-09-07
Applicant: Siemens Aktiengesellschaft
Inventor： Martin Franke , Peter Frühauf , Rüdiger Knofe , Bernd Müller , Stefan Nerreter , Michael Niedermayer , Ulrich Wittreich , Manfred Zäske
CPC classification number: H01L35/30 , F04D25/06 , F04D33/00 , H01L23/38 , H01L23/467 , H01L35/28 , H02H5/04 , H05K1/0203 , H05K2201/064 , H05K2201/066 , H05K2201/10037 , H05K2201/10151 , H05K2201/10219
Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.
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