公开(公告)号：US20200008306A1

公开(公告)日：2020-01-02

申请号：US16024835

申请日：2018-06-30

Applicant: Sierra Circuits, Inc.

Inventor： Konstantine KARAVAKIS ,  Kenneth BAHL ,  Steve Carney

IPC: H05K3/42 ,  H05K3/02 ,  H05K3/18 ,  H05K3/10 ,  H05K3/24 ,  H05K1/03 ,  H05K1/11

Abstract: A circuit board is formed from a non-catalytic laminate coated with an optically curable catalytic adhesive, which, after curing with an optical source such as UV, has a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and blanket surface plasma etch operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.