公开(公告)号：US08962396B2

公开(公告)日：2015-02-24

申请号：US14086135

申请日：2013-11-21

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Ching-Hua Chen ,  Heng-Cheng Chu ,  Hsin-Lung Chung ,  Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L21/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/56 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49174 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design.

Abstract translation: 一种无载体半导体封装，包括具有绝缘层和嵌入绝缘层中的电路层并具有多个导电迹线和RF（射频）迹线的电路结构，设置在该绝缘层的第一表面上的芯片，以及 电连接到导电迹线，覆盖芯片和电路层的密封剂，形成在与第一表面相对的绝缘层的第二表面上的接地层和设置在导电迹线上的多个焊球 导电迹线，其中焊球的部分电连接接地层，以便允许RF迹线和接地层形成具有RF功能的微带线，从而获得具有低成本的单层无载流子半导体封装， 简化射频设计。

公开(公告)号：US20140080265A1

公开(公告)日：2014-03-20

申请号：US14086135

申请日：2013-11-21

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD

Inventor： Ching-Hua Chen ,  Heng-Cheng Chu ,  Hsin-Lung Chung ,  Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L21/56

CPC classification number: H01L21/56 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49174 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A carrier-free semiconductor package includes a circuit structure having an insulating layer and a circuit layer embedded in the insulating layer and having a plurality of conductive traces and RF (radio frequency) traces, a chip disposed on a first surface of the insulating layer and electrically connected to the conductive traces, an encapsulant covering the chip and the circuit layer, a ground layer formed on a second surface of the insulating layer opposite to the first surface, and a plurality of solder balls disposed on the conductive traces or terminals on the conductive traces, wherein portions of the solder balls electrically connect the ground layer so as to allow the RF traces and the ground layer to form a microstrip line having an RF function, thus obtaining a single-layer carrier-free semiconductor package having low cost and simplified RF design.

Abstract translation: 一种无载体半导体封装，包括具有绝缘层和嵌入绝缘层中的电路层并具有多个导电迹线和RF（射频）迹线的电路结构，设置在该绝缘层的第一表面上的芯片，以及 电连接到导电迹线，覆盖芯片和电路层的密封剂，形成在与第一表面相对的绝缘层的第二表面上的接地层和设置在导电迹线上的多个焊球 导电迹线，其中焊球的部分电连接接地层，以便允许RF迹线和接地层形成具有RF功能的微带线，从而获得具有低成本的单层无载流子半导体封装， 简化射频设计。