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公开(公告)号：US09997477B2
公开(公告)日：2018-06-12
申请号：US15094125
申请日：2016-04-08
发明人： Tsung-Hsien Tsai , Heng-Cheng Chu , Chien-Cheng Lin , Chih-Hsien Chiu , Hsin-Lung Chung , Yude Chu
IPC分类号： H01L23/66 , H01L49/02 , H01L23/64 , H01L23/00 , H01L25/16 , H01L25/00 , H01L21/56 , H01L23/31
CPC分类号： H01L23/66 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/64 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/16 , H01L25/50 , H01L28/00 , H01L2223/6661 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
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公开(公告)号：US20180063966A1
公开(公告)日：2018-03-01
申请号：US15607872
申请日：2017-05-30
发明人： Chih-Hsien Chiu , Chen-Wen Huang , Hsin-Lung Chung , Wen-Jung Tsai , Jia-Huei Hung , Fu-Tang Huang
IPC分类号： H05K3/32 , H01L23/00 , H01L23/373 , H01L21/48
CPC分类号： H05K3/323 , H01L21/4853 , H01L23/373 , H01L24/73
摘要： An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.
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3.发明授权Semiconductor package with shielding member and method of manufacturing the same 有权具有屏蔽构件的半导体封装及其制造方法公开(公告)号：US09490219B2
公开(公告)日：2016-11-08
申请号：US14459678
申请日：2014-08-14
IPC分类号： H01L23/552 , H01L21/56 , H01L23/66 , H01L23/31 , H01L23/00
CPC分类号： H01L23/552 , H01L21/56 , H01L23/3121 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2224/131 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/1421 , H01L2924/15313 , H01L2924/19105 , H01L2924/3025 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.
摘要翻译： 本发明提供一种半导体封装，包括衬底，设置在衬底上的多个半导体元件，设置在至少两个半导体元件之间的至少一个屏蔽构件和封装半导体元件和屏蔽构件的密封剂。 通过屏蔽部件，可以防止半导体元件之间引起的电磁干扰。
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公开(公告)号：US20160081234A1
公开(公告)日：2016-03-17
申请号：US14607743
申请日：2015-01-28
发明人： Chih-Hsien Chiu , Hsin-Lung Chung , Chia-Yang Chen , Chao-Ya Yang , Yude Chu , Chih-Ming Cheng
IPC分类号： H05K9/00
CPC分类号： H01L23/552 , H01L25/0657 , H01L25/16 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/73253 , H01L2224/73265 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014
摘要： A package structure is provided, including an electronic element with a low frequency, a shielding member connected to the electrosnic element, and an encapsulant covering the electronic element and the shielding member, such that the electronic element is shielded from erroneous signals.
摘要翻译： 提供一种封装结构，包括低频电子元件，连接到电气元件的屏蔽构件，以及覆盖电子元件和屏蔽构件的密封剂，使得电子元件被屏蔽而不会发生错误信号。
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公开(公告)号：US10566320B2
公开(公告)日：2020-02-18
申请号：US16211714
申请日：2018-12-06
发明人： Chi-Liang Shih , Chun-Chong Chien , Hsin-Lung Chung , Te-Fang Chu
IPC分类号： H01L21/56 , H01L25/16 , H01L25/00 , H01L23/552 , H01L23/31 , H01L23/498 , H01L23/538
摘要： An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.
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公开(公告)号：US09907186B1
公开(公告)日：2018-02-27
申请号：US15607872
申请日：2017-05-30
发明人： Chih-Hsien Chiu , Chen-Wen Huang , Hsin-Lung Chung , Wen-Jung Tsai , Jia-Huei Hung , Fu-Tang Huang
IPC分类号： H01L23/495 , H05K3/32 , H01L23/00 , H01L23/373 , H01L21/48
CPC分类号： H05K3/323 , H01L21/4853 , H01L23/373 , H01L24/73
摘要： An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.
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公开(公告)号：US09502758B2
公开(公告)日：2016-11-22
申请号：US14146163
申请日：2014-01-02
发明人： Hsin-Lung Chung , Hao-Ju Fang , Chih-Hsien Chiu , Yude Chu , Tsung-Hsien Tsai
CPC分类号： H01Q1/40 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/19107 , H01Q9/42 , H01Q23/00 , H01L2924/00014
摘要： An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.
摘要翻译： 公开了一种电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 形成在所述基板上并封装所述电子元件的密封剂; 以及嵌入所述密封剂中而不与所述基板接触并从所述密封剂的表面露出的天线体。 由于天线体不设置在基板上，所以可以减小基板的表面积，以满足电子封装的小型化要求。
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公开(公告)号：US09337250B2
公开(公告)日：2016-05-10
申请号：US14087554
申请日：2013-11-22
发明人： Tsung-Hsien Tsai , Heng-Cheng Chu , Chien-Cheng Lin , Chih-Hsien Chiu , Hsin-Lung Chung , Yude Chu
CPC分类号： H01L23/66 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/64 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/16 , H01L25/50 , H01L28/00 , H01L2223/6661 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
摘要翻译： 提供半导体封装及其制造方法。 半导体封装包括：具有多个导电焊盘的衬底和围绕形成在其表面上的导电焊盘的多个焊盘; 安装在导电焊盘上的多个无源器件; 绝缘层，其形成在所述表面上并且具有嵌入其中的无源器件的一部分; 安装在所述绝缘层的顶表面上的半导体芯片; 电连接半导体芯片和接合焊盘的多个接合线; 形成在基板的表面上以封装绝缘层，接合线和半导体芯片的密封剂，其中投射到基板上的半导体芯片的区域覆盖无源器件中最外面的一个的一部分。 因此，无源器件的安装密度提高。
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公开(公告)号：US20150333017A1
公开(公告)日：2015-11-19
申请号：US14459678
申请日：2014-08-14
IPC分类号： H01L23/552 , H01L23/66 , H01L21/56
CPC分类号： H01L23/552 , H01L21/56 , H01L23/3121 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2224/131 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/1421 , H01L2924/15313 , H01L2924/19105 , H01L2924/3025 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.
摘要翻译： 本发明提供一种半导体封装，包括衬底，设置在衬底上的多个半导体元件，设置在至少两个半导体元件之间的至少一个屏蔽构件和封装半导体元件和屏蔽构件的密封剂。 通过屏蔽部件，可以防止半导体元件之间引起的电磁干扰。
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公开(公告)号：US20150243574A1
公开(公告)日：2015-08-27
申请号：US14256496
申请日：2014-04-18
发明人： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Sheng-Ming Yang , Hung-Cheng Chen , Chia-Yang Chen
IPC分类号： H01L23/31 , H01L23/00 , H01L23/498 , H01L21/56
CPC分类号： H01L23/49838 , H01L23/3128 , H01L23/49816 , H01L23/50 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/32268 , H01L2224/451 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/83191 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19105 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.
摘要翻译： 提供了一种制造半导体封装的方法，其包括以下步骤：提供具有多个焊盘和相对的第二表面的具有第一表面的封装基板; 在所述包装基板的第一表面上设置多个无源元件; 通过粘合膜将半导体芯片设置在无源元件上; 通过多个接合线电连接半导体芯片和接合焊盘; 以及在所述封装衬底的所述第一表面上形成密封剂以封装所述半导体芯片，所述无源元件和所述接合线。 通过在封装基板和半导体芯片之间配置无源元件，本发明节约了封装基板上的空间，增加了布线灵活性。 此外，由于接合线不容易与无源元件接触，所以本发明防止发生短路。
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