公开(公告)号：US20180342484A1

公开(公告)日：2018-11-29

申请号：US15694613

申请日：2017-09-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Chih-Chiang He

IPC: H01L25/065 ,  H01L25/00

Abstract: An electronic package and a method for fabricating the same are provided. A metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate is provided. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

公开(公告)号：US20200251395A1

公开(公告)日：2020-08-06

申请号：US16460766

申请日：2019-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/498

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulating layer encapsulates the electronic component and the conductive elements. The encapsulating layer is formed with recessed portions corresponding in position to the conductive elements. A gap is formed between the conductive elements and the recessed portions.

公开(公告)号：US20210351097A1

公开(公告)日：2021-11-11

申请号：US17241199

申请日：2021-04-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L21/768

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.

公开(公告)号：US10916526B2

公开(公告)日：2021-02-09

申请号：US16837470

申请日：2020-04-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Chih-Chiang He

IPC: H01L25/065 ,  H01L25/00 ,  H01L25/10 ,  H01L25/16

Abstract: A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

公开(公告)号：US20200227390A1

公开(公告)日：2020-07-16

申请号：US16837470

申请日：2020-04-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Chih-Chiang He

IPC: H01L25/065 ,  H01L25/00 ,  H01L25/10 ,  H01L25/16

Abstract: A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

公开(公告)号：US20240047374A1

公开(公告)日：2024-02-08

申请号：US17968349

申请日：2022-10-18

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Chih-Chiang He ,  Chun-Chong Chien ,  Wen-Jung Tsai

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/3157 ,  H01L21/56 ,  H01L24/05 ,  H01L24/13 ,  H01L2924/3025 ,  H01L2224/0401 ,  H01L2224/13023 ,  H01L2924/1811

Abstract: An electronic package is provided with a plurality of electronic elements disposed on a carrier structure and a shielding structure located between two adjacent electronic elements, where the shielding structure is formed with at least one cavity and shielding members located on opposite sides of the cavity, such that the shielding members are arranged between the two electronic elements. Therefore, the electromagnetic signal will be reflected via the shielding members to prevent the two electronic elements from electromagnetically interfering with each other.

公开(公告)号：US20210005524A1

公开(公告)日：2021-01-07

申请号：US16793667

申请日：2020-02-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.