公开(公告)号：US09006039B2

公开(公告)日：2015-04-14

申请号：US14322372

申请日：2014-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Yu-Chih Yu ,  Ying-Chou Tsai

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L21/48 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/486 ,  H01L21/4875 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/83 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; forming a first encapsulant in the first openings; forming a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer.

Abstract translation: 一种封装衬底的制造方法，包括：提供具有第一表面和与第一表面相对的第二表面的金属板，其中第一表面具有多个用于在其间限定第一芯电路层的第一开口，第二表面具有 用于在其间限定第二芯电路层的多个第二开口，所述第一开口和所述第二开口中的每一个具有宽的外部部分和窄的内部部分，并且每个所述第二开口的内部部分与所述第二开口的内部部分连通 第一开口中的对应的一个; 在第一开口中形成第一密封剂; 在所述第二开口中形成第二密封剂; 以及在第一密封剂和第一核心电路层上形成表面电路层。

公开(公告)号：US08810045B2

公开(公告)日：2014-08-19

申请号：US13644561

申请日：2012-10-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Yu-Chih Yu ,  Ying-Chou Tsai

IPC: H01L23/28

CPC classification number: H01L21/48 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/486 ,  H01L21/4875 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/83 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A packaging substrate and a semiconductor package each include: a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; a first encapsulant formed in the first openings; a second encapsulant formed in the second openings; and a surface circuit layer formed on the first encapsulant and the first core circuit layer.

Abstract translation: 封装基板和半导体封装均包括：具有第一表面和与第一表面相对的第二表面的金属板，其中第一表面具有多个用于在其间限定第一芯电路层的第一开口，第二表面具有 用于在其间限定第二芯电路层的多个第二开口，所述第一开口和所述第二开口中的每一个具有宽的外部部分和窄的内部部分，并且每个所述第二开口的内部部分与所述第二开口的内部部分连通 第一开口中的对应的一个; 形成在第一开口中的第一密封剂; 形成在第二开口中的第二密封剂; 以及形成在第一密封剂和第一芯电路层上的表面电路层。

公开(公告)号：US20130334694A1

公开(公告)日：2013-12-19

申请号：US13644561

申请日：2012-10-04

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ching Ho ,  Yu-Chih Yu ,  Ying-Chou Tsai

IPC: H05K1/02 ,  B05D3/00 ,  B05D5/12 ,  H01L23/14 ,  H01L21/56

CPC classification number: H01L21/48 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/486 ,  H01L21/4875 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/83 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A packaging substrate is provided, including: a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; a first encapsulant formed in the first openings; a second encapsulant formed in the second openings; and a surface circuit layer formed on the first encapsulant and the first core circuit layer. The present invention effectively reduces the fabrication cost and increases the product reliability.

Abstract translation: 提供了一种包装衬底，包括：具有第一表面和与第一表面相对的第二表面的金属板，其中第一表面具有多个用于在其间限定第一芯电路层的第一开口，第二表面具有多个 的用于在其间限定第二芯电路层的第二开口，第一和第二开口中的每一个具有宽的外部部分和窄的内部部分，并且每个第二开口的内部部分与相应的第二开口的内部部分连通 第一个开口之一; 形成在第一开口中的第一密封剂; 形成在第二开口中的第二密封剂; 以及形成在所述第一密封剂和所述第一芯电路层上的表面电路层。 本发明有效地降低了制造成本，提高了产品的可靠性。

公开(公告)号：US09165789B2

公开(公告)日：2015-10-20

申请号：US14643444

申请日：2015-03-10

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Yu-Chih Yu ,  Ying-Chou Tsai

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L21/48 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/486 ,  H01L21/4875 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/83 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; forming a first encapsulant in the first openings; forming a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer.

Abstract translation: 一种封装衬底的制造方法，包括：提供具有第一表面和与第一表面相对的第二表面的金属板，其中第一表面具有多个用于在其间限定第一芯电路层的第一开口，第二表面具有 用于在其间限定第二芯电路层的多个第二开口，所述第一开口和所述第二开口中的每一个具有宽的外部部分和窄的内部部分，并且每个所述第二开口的内部部分与所述第二开口的内部部分连通 第一开口中的对应的一个; 在第一开口中形成第一密封剂; 在所述第二开口中形成第二密封剂; 以及在第一密封剂和第一核心电路层上形成表面电路层。

公开(公告)号：US20150187603A1

公开(公告)日：2015-07-02

申请号：US14643444

申请日：2015-03-10

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Yu-Chih Yu ,  Ying-Chou Tsai

IPC: H01L21/48 ,  H01L21/56

CPC classification number: H01L21/48 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/486 ,  H01L21/4875 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/83 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; forming a first encapsulant in the first openings; forming a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer.

Abstract translation: 一种封装衬底的制造方法，包括：提供具有第一表面和与第一表面相对的第二表面的金属板，其中第一表面具有多个用于在其间限定第一芯电路层的第一开口，第二表面具有 用于在其间限定第二芯电路层的多个第二开口，所述第一开口和所述第二开口中的每一个具有宽的外部部分和窄的内部部分，并且每个所述第二开口的内部部分与所述第二开口的内部部分连通 第一开口中的对应的一个; 在第一开口中形成第一密封剂; 在所述第二开口中形成第二密封剂; 以及在第一密封剂和第一核心电路层上形成表面电路层。

公开(公告)号：US20140315353A1

公开(公告)日：2014-10-23

申请号：US14322372

申请日：2014-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Yu-Chih Yu ,  Ying-Chou Tsai

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L21/48 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/486 ,  H01L21/4875 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49861 ,  H01L24/83 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; a first encapsulant in the first openings; a second encapsulant in the second openings; and forming a surface circuit layer on the first encapsulant and the first core circuit layer.

Abstract translation: 一种封装衬底的制造方法，包括：提供具有第一表面和与第一表面相对的第二表面的金属板，其中第一表面具有多个用于在其间限定第一芯电路层的第一开口，第二表面具有 用于在其间限定第二芯电路层的多个第二开口，所述第一开口和所述第二开口中的每一个具有宽的外部部分和窄的内部部分，并且每个所述第二开口的内部部分与所述第二开口的内部部分连通 第一开口中的对应的一个; 第一开口中的第一密封剂; 在第二开口中的第二密封剂; 以及在第一密封剂和第一核心电路层上形成表面电路层。