公开(公告)号：US20110147779A1

公开(公告)日：2011-06-23

申请号：US12972529

申请日：2010-12-20

申请人： Sin-Ho KANG ,  Tae-Hun KIM ,  Seung-Ho JANG ,  Kyoung-Bo HAN ,  Jae-yong CHOI

发明人： Sin-Ho KANG ,  Tae-Hun KIM ,  Seung-Ho JANG ,  Kyoung-Bo HAN ,  Jae-yong CHOI

IPC分类号： H01L33/10 ,  H01L21/52

CPC分类号： H01L33/486 ,  H01L33/504 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.

摘要翻译： 提供一种发光二极管（LED）封装以及制造LED封装的方法。 LED封装包括具有穿过壳体设置的第一和第二引线框架的壳体; 设置在所述壳体上的LED芯片，所述LED芯片具有分别通过共晶键直接连接到所述第一引线框架和所述第二引线框架的第一和第二电极; 以及设置在覆盖LED芯片的壳体上的透镜。