公开(公告)号：USD772734S1

公开(公告)日：2016-11-29

申请号：US29529016

申请日：2015-06-03

Applicant: Sinfonia Technology Co., Ltd.

Designer： Hidetoshi Katada ,  Takenori Motoori

公开(公告)号：USD841489S1

公开(公告)日：2019-02-26

申请号：US29611611

申请日：2017-07-24

Applicant: Sinfonia Technology Co., Ltd.

Designer： Hidetoshi Katada ,  Takenori Motoori

公开(公告)号：US20130308281A1

公开(公告)日：2013-11-21

申请号：US13732881

申请日：2013-01-02

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Takenori Motoori ,  Hideaki Moriya ,  Hidetoshi Katada

IPC: H05K5/00 ,  H05K13/00

CPC classification number: H05K5/0004 ,  H01L21/50 ,  H05K5/0247 ,  H05K7/1427 ,  H05K13/00 ,  Y10T29/49117

Abstract: The Electronic Module has a body case 2, including a plurality of case members 3, 4 and that has an internal space (S) where a first opening P1 is formed on one side surface of the internal space and a second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space of the body case, and a resin body 6 that covers the substrate 5 by being filled in the internal space of the body case and solidified or hardened, and is characterized by that a plurality of the case members and the substrate 5 are integrated by the use of the resin body 6 as an accouplement.

Abstract translation: 电子模块具有主体壳体2，其包括多个壳体部件3,4，并且具有内部空间（S），其中第一开口P1形成在内部空间的一个侧表面上，第二开口P2打开 当多个壳体部件彼此分离时，与第一开口P1的方向不同的方向处于暴露状态;安装有传感器IC51的基板5，并且容纳在主体壳体的内部空间中 以及树脂体6，其通过填充在主体壳体的内部空间中并固化或硬化而覆盖基板5，其特征在于，多个壳体构件和基板5通过使用树脂 身体6作为附件。

公开(公告)号：US09474168B2

公开(公告)日：2016-10-18

申请号：US14811275

申请日：2015-07-28

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Takenori Motoori ,  Hideaki Moriya ,  Hidetoshi Katada

IPC: H05K7/02 ,  H05K7/04 ,  H05K5/00 ,  H05K13/00 ,  H05K5/02 ,  H05K7/14 ,  H01L21/50

CPC classification number: H05K5/0004 ,  H01L21/50 ,  H05K5/0247 ,  H05K7/1427 ,  H05K13/00 ,  Y10T29/49117

Abstract: The Electronic Module includes body case 2 that comprises a plurality of case members 3, 4 by abutting each other and that has an internal space (S) where the first opening P1 is formed on one side surface of the internal space (S) and the second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members 3, 4 are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space (S) of the body case 2, and a resin body 6 that covers the substrate 5 by being filled in the internal space (S) of the body case 2 and solidified or hardened, and is characterized by that a plurality of the case members 3, 4.

Abstract translation: 电子模块包括主体壳体2，其包括多个壳体构件3,4，通过彼此邻接并且具有内部空间（S），其中第一开口P1形成在内部空间（S）的一个侧表面上，并且 当多个壳体构件3,4彼此分离时，与第一开口P1不同的方向开口的第二开口P2处于暴露状态，安装有传感器IC51的基板5， 容纳在主体壳体2的内部空间（S）中，以及树脂体6，其通过填充在主体壳体2的内部空间（S）中并且固化或硬化而覆盖基板5，其特征在于， 多个壳体构件3,4。

公开(公告)号：US09131599B2

公开(公告)日：2015-09-08

申请号：US13732881

申请日：2013-01-02

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Takenori Motoori ,  Hideaki Moriya ,  Hidetoshi Katada

IPC: H05K5/00 ,  H05K13/00 ,  H01L21/50

CPC classification number: H05K5/0004 ,  H01L21/50 ,  H05K5/0247 ,  H05K7/1427 ,  H05K13/00 ,  Y10T29/49117

Abstract: The Electronic Module has a body case 2, including a plurality of case members 3, 4 and that has an internal space (S) where a first opening P1 is formed on one side surface of the internal space and a second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space of the body case, and a resin body 6 that covers the substrate 5 by being filled in the internal space of the body case and solidified or hardened, and is characterized by that a plurality of the case members and the substrate 5 are integrated by the use of the resin body 6 as an accouplement.

Abstract translation: 电子模块具有主体壳体2，其包括多个壳体部件3,4，并且具有内部空间（S），其中第一开口P1形成在内部空间的一个侧表面上，第二开口P2打开 当多个壳体部件彼此分离时，与第一开口P1的方向不同的方向处于暴露状态;安装有传感器IC51的基板5，并且容纳在主体壳体的内部空间中 以及树脂体6，其通过填充在主体壳体的内部空间中并固化或硬化而覆盖基板5，其特征在于，多个壳体构件和基板5通过使用树脂 身体6作为附件。

公开(公告)号：US20150334853A1

公开(公告)日：2015-11-19

申请号：US14811275

申请日：2015-07-28

Applicant: SINFONIA TECHNOLOGY CO., LTD.

Inventor： Takenori Motoori ,  Hideaki Moriya ,  Hidetoshi Katada

IPC: H05K5/00 ,  H05K7/14 ,  H05K5/02

CPC classification number: H05K5/0004 ,  H01L21/50 ,  H05K5/0247 ,  H05K7/1427 ,  H05K13/00 ,  Y10T29/49117

Abstract: The Electronic Module includes body case 2 that comprises a plurality of case members 3, 4 by abutting each other and that has an internal space (S) where the first opening P1 is formed on one side surface of the internal space (S) and the second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members 3, 4 are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space (S) of the body case 2, and a resin body 6 that covers the substrate 5 by being filled in the internal space (S) of the body case 2 and solidified or hardened, and is characterized by that a plurality of the case members 3, 4.

Abstract translation: 电子模块包括主体壳体2，其包括多个壳体构件3,4，通过彼此邻接并且具有内部空间（S），其中第一开口P1形成在内部空间（S）的一个侧表面上，并且 当多个壳体构件3,4彼此分离时，与第一开口P1不同的方向开口的第二开口P2处于暴露状态，安装有传感器IC51的基板5， 容纳在主体壳体2的内部空间（S）中，以及树脂体6，其通过填充在主体壳体2的内部空间（S）中并且固化或硬化而覆盖基板5，并且其特征在于， 多个壳体构件3,4。