公开(公告)号：US20210021936A1

公开(公告)日：2021-01-21

申请号：US16890858

申请日：2020-06-02

Applicant: Skyworks Solutions, Inc.

Inventor： Yu Hui ,  Kwang Jae Shin

IPC: H04R17/02 ,  B81B3/00 ,  H04R1/04 ,  H04R7/10 ,  H04R19/04

Abstract: A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.

公开(公告)号：US20230283962A1

公开(公告)日：2023-09-07

申请号：US18107735

申请日：2023-02-09

Applicant: Skyworks Solutions, Inc.

Inventor： Yu Hui ,  Kwang Jae Shin

IPC: H04R17/02 ,  B81B3/00 ,  H04R1/04 ,  H04R7/10 ,  H04R19/04

CPC classification number: H04R17/02 ,  B81B3/0072 ,  H04R1/04 ,  H04R7/10 ,  H04R19/04 ,  H04R2420/07 ,  B81B2203/0127 ,  B81B2203/019 ,  B81B2203/04 ,  H04R2201/003 ,  H04R2499/11 ,  B81B2201/0257

Abstract: A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.

公开(公告)号：US11606646B2

公开(公告)日：2023-03-14

申请号：US17138320

申请日：2020-12-30

Applicant: Skyworks Solutions, Inc.

Inventor： Yu Hui ,  Kwang Jae Shin

IPC: H04R17/00 ,  H04R17/02 ,  B81B3/00 ,  H04R1/04 ,  H04R7/10 ,  H04R19/04

Abstract: A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.

公开(公告)号：US20210120345A1

公开(公告)日：2021-04-22

申请号：US17138320

申请日：2020-12-30

Applicant: Skyworks Solutions, Inc.

Inventor： Yu Hui ,  Kwang Jae Shin

IPC: H04R17/02 ,  H04R19/04 ,  B81B3/00 ,  H04R7/10 ,  H04R1/04

Abstract: A piezoelectric microelectromechanical systems diaphragm microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can have two or more piezoelectric film layers disposed over the top end of the substrate and defining a diaphragm structure. Each of the two or more piezoelectric film layers can have a predefined residual stress that substantially cancel each other out so that the diaphragm structure is substantially flat with substantially zero residual stress. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when the diaphragm is subjected to sound pressure via the opening in the substrate.