Nano-based gas diffusion media
    4.
    发明申请
    Nano-based gas diffusion media 失效
    纳米级气体扩散介质

    公开(公告)号:US20070238010A1

    公开(公告)日:2007-10-11

    申请号:US11731968

    申请日:2007-04-02

    IPC分类号: H01M4/94 H01M4/88

    CPC分类号: H01M8/023

    摘要: The present invention relates to novel methods for producing a nano-porous gas diffusion media, compositions thereof, and devices comprising the same. The nano-porous gas diffusion media of the invention is produced using photolithographic techniques to create a solid substrate comprising a plurality of nano-scale (1 nm-300 μm) pores or holes that allow for the diffusion or exchange of molecules, gases, and/or liquids through the substrate. The nano-porous diffusion media of the invention also displays superior electro- and thermal conductivity, and increased durability and performance. In some embodiments, the nano-porous diffusion media of the invention is also coated with a self-assembling monolayer (SAM) of organic molecules to further improve its physical characteristics.

    摘要翻译: 本发明涉及制备纳米多孔气体扩散介质的新方法及其组合物及其制备方法。 使用光刻技术制造本发明的纳米多孔气体扩散介质,以产生包含多个纳米尺度(1nm-300μm)的孔或孔的固体基质,这些孔或孔允许扩散或交换分子,气体和 /或液体通过基底。 本发明的纳米多孔扩散介质还显示出优异的导电性和导热性,并且增加了耐久性和性能。 在一些实施方案中,本发明的纳米多孔扩散介质还涂覆有有机分子的自组装单层(SAM)以进一步改善其物理特性。

    Nano-based gas diffusion media
    6.
    发明授权
    Nano-based gas diffusion media 失效
    纳米级气体扩散介质

    公开(公告)号:US07785748B2

    公开(公告)日:2010-08-31

    申请号:US11731968

    申请日:2007-04-02

    IPC分类号: H01M2/00 H01M4/00

    CPC分类号: H01M8/023

    摘要: The present invention relates to novel methods for producing a nano-porous gas diffusion media, compositions thereof, and devices comprising the same. The nano-porous gas diffusion media of the invention is produced using photolithographic techniques to create a solid substrate comprising a plurality of nano-scale (1 nm-300 μm) pores or holes that allow for the diffusion or exchange of molecules, gases, and/or liquids through the substrate. The nano-porous diffusion media of the invention also displays superior electro- and thermal conductivity, and increased durability and performance. In some embodiments, the nano-porous diffusion media of the invention is also coated with a self-assembling monolayer (SAM) of organic molecules to further improve its physical characteristics.

    摘要翻译: 本发明涉及制备纳米多孔气体扩散介质的新方法及其组合物及其制备方法。 使用光刻技术制造本发明的纳米多孔气体扩散介质,以产生包含多个纳米尺度(1nm-300μm)的孔或孔的固体基质,其允许分子,气体和 /或液体通过基底。 本发明的纳米多孔扩散介质还显示出优异的导电性和导热性,并且增加了耐久性和性能。 在一些实施方案中,本发明的纳米多孔扩散介质还涂覆有有机分子的自组装单层(SAM)以进一步改善其物理特性。

    VACUUM ASSISTED RESIN TRANSFER MOLDING TECHNIQUES WITH FLOW FLOODING CHAMBER
    7.
    发明申请
    VACUUM ASSISTED RESIN TRANSFER MOLDING TECHNIQUES WITH FLOW FLOODING CHAMBER 审中-公开
    真空辅助树脂传输模具技术与流动浮筒

    公开(公告)号:US20070063393A1

    公开(公告)日:2007-03-22

    申请号:US11458122

    申请日:2006-07-18

    IPC分类号: B29C70/00

    摘要: Vacuum assisted resin transfer molding techniques are improved by mounting a rigid external shell on top of a vacuum bag. The shell is sealed around the vacuum bag so that a vacuum is created between the shell and the vacuum bag, the vacuum causes the vacuum bag to be freely stretched and lifted away from the preform to create a flow flooding chamber which provides a flow channel on the top face of the preform to accelerate the resin flow and reduce the injection time.

    摘要翻译: 通过将刚性外壳安装在真空袋顶部来提高真空辅助树脂传递模塑技术。 壳体围绕真空袋被密封,使得在壳体和真空袋之间产生真空,真空使得真空袋自由地拉伸并从预成型件上提起,从而形成一个流动驱动室,该流动通道在 预成型件的顶面加速树脂流动并减少注射时间。

    Molding systems and processes
    8.
    发明申请
    Molding systems and processes 失效
    成型系统和工艺

    公开(公告)号:US20060255500A1

    公开(公告)日:2006-11-16

    申请号:US10544503

    申请日:2004-02-04

    申请人: Suresh Advani

    发明人: Suresh Advani

    IPC分类号: B29C45/00

    摘要: A mold system (1000) includes a gate control system (150) that selectively deforms a deformable member (140) to selectively close one or more injection gates (127, 227) and/or vent gates (128, 228) in a mold platen (160, 260). The injection gates (127, 227) are selectively opened and closed by engaging the deformable member (140) with the injection gates (127, 227). The deformable member (140) is located between the gate control system (150) and the curing fluid, and curing fluid entering the mold platen (160, 260) therefore does not contact the gate control system (150).

    摘要翻译: 模具系统(1000)包括门控制系统(150),其选择性地使可变形构件(140)变形以选择性地关闭模板中的一个或多个注入门(127,227)和/或排气门(128,228) (160,260)。 通过使可变形构件(140)与注入门(127,227)接合来选择性地打开和关闭注入门(127,227)。 可变形构件(140)位于门控制系统(150)和固化流体之间,因此进入模板(160,260)的固化流体不接触门控制系统(150)。