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    Light-emitting diode mounted on intersected and discontinuous transparent conductive pattern layers and manufacturing method thereof
    1.
    发明授权
    Light-emitting diode mounted on intersected and discontinuous transparent conductive pattern layers and manufacturing method thereof 有权
    安装在相交和不连续的透明导电图案层上的发光二极管及其制造方法

    公开(公告)号：US08604510B2

    公开(公告)日：2013-12-10

    申请号：US13649348

    申请日：2012-10-11

    申请人： Ssu-Yuan Weng ,  Yu-Huan Liu

    发明人： Ssu-Yuan Weng ,  Yu-Huan Liu

    IPC分类号： H01L33/00 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L21/00 ,  F21V3/00 ,  F21V5/00

    CPC分类号： H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.

    摘要翻译： 公开了一种发光二极管（LED）及其制造方法。 LED包括透明基板，多个透明导电层，多个金属电路和LED芯片。 LED芯片适用于发光，一部分光朝向透明基板发射。 LED的制造方法包括以下步骤。 首先，在透明基板上形成透明导电层。 接下来，通过蚀刻透明导电层形成导电图案。 交叉金属电路通过将金属设置在透明导电层的一部分上而形成。 最后，将LED芯片设置在金属电路上，使得LED芯片电连接到金属电路。

    Light-Emitting Diode Mounted On Transparent Conductive Layers And Manufacturing Method Thereof
    2.
    发明申请
    Light-Emitting Diode Mounted On Transparent Conductive Layers And Manufacturing Method Thereof 有权
    透明导电层上的发光二极管及其制造方法

    公开(公告)号：US20130032850A1

    公开(公告)日：2013-02-07

    申请号：US13649348

    申请日：2012-10-11

    申请人： Ssu-Yuan Weng ,  Yu-Huan Liu

    发明人： Ssu-Yuan Weng ,  Yu-Huan Liu

    IPC分类号： H01L33/42

    CPC分类号： H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.

    摘要翻译： 公开了一种发光二极管（LED）及其制造方法。 LED包括透明基板，多个透明导电层，多个金属电路和LED芯片。 LED芯片适用于发光，一部分光朝向透明基板发射。 LED的制造方法包括以下步骤。 首先，在透明基板上形成透明导电层。 接下来，通过蚀刻透明导电层形成导电图案。 交叉金属电路通过将金属设置在透明导电层的一部分上而形成。 最后，将LED芯片设置在金属电路上，使得LED芯片电连接到金属电路。

    Light-emitting diode module and the manufacturing thereof
    5.
    发明申请
    Light-emitting diode module and the manufacturing thereof 有权
    发光二极管模块及其制造

    公开(公告)号：US20080283856A1

    公开(公告)日：2008-11-20

    申请号：US11827475

    申请日：2007-07-12

    申请人： Ssu-Yuan Weng

    发明人： Ssu-Yuan Weng

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  H01L33/58

    摘要： A method for manufacturing a light-emitting diode (LED) module is provided. Plural LED package structures are formed on a substrate first. A space is located between two adjacent LED package structures. A Lens laminated plate is subsequently bonded to the LED package structures. The lens laminated plate includes plural lenses, and each lens is located right above a LED of each LED package structure. Finally, plural LED modules are formed by cutting the substrate along the space. A LED module structure is also disclosed.

    摘要翻译： 提供一种制造发光二极管（LED）模块的方法。 首先在基板上形成多个LED封装结构。 一个空间位于两个相邻的LED封装结构之间。 透镜层压板随后结合到LED封装结构。 透镜层叠板包括多个透镜，并且每个透镜位于每个LED封装结构的LED的正上方。 最后，通过沿着该空间切割基板来形成多个LED模块。 还公开了LED模块结构。

    Light-emitting diode module and manufacturing method thereof
    7.
    发明授权
    Light-emitting diode module and manufacturing method thereof 有权
    发光二极管模块及其制造方法

    公开(公告)号：US08110842B2

    公开(公告)日：2012-02-07

    申请号：US11827475

    申请日：2007-07-12

    申请人： Ssu-Yuan Weng

    发明人： Ssu-Yuan Weng

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  H01L33/58

    摘要： A method for manufacturing a light-emitting diode (LED) module is provided. Plural LED package structures are formed on a substrate first. A space is located between two adjacent LED package structures. A Lens laminated plate is subsequently bonded onto the LED package structures. The lens laminated plate includes plural lenses, and each lens is located right above a LED of each LED package structure. Finally, plural LED modules are formed by cutting the substrate along the space. A LED module structure is also disclosed.

    摘要翻译： 提供一种制造发光二极管（LED）模块的方法。 首先在基板上形成多个LED封装结构。 一个空间位于两个相邻的LED封装结构之间。 随后将透镜层叠板结合到LED封装结构上。 透镜层叠板包括多个透镜，并且每个透镜位于每个LED封装结构的LED的正上方。 最后，通过沿着该空间切割基板来形成多个LED模块。 还公开了LED模块结构。