NON-SYMMETRIC SINGLE CIRCUIT BOARD ASSEMBLY WITH LOGIC AND POWER COMPONENTS

    公开(公告)号:US20230389177A1

    公开(公告)日:2023-11-30

    申请号:US18200283

    申请日:2023-05-22

    Inventor: Ryan D. Yaklin

    CPC classification number: H05K1/09 H02K9/00 H02K5/04 H05K7/1427

    Abstract: A single circuit board assembly for forming a vehicle-motor interface includes a first side of a board with logic modules located thereon. The single circuit board assembly also includes a second side of the board with power modules located thereon. The board comprises a first plurality of layers and a second plurality of layers, the first plurality of layers adjacent the first side of the board and the second plurality of layers adjacent the second side of the board, wherein the first plurality of layers has a first total thickness and the second plurality of layers has a second total thickness, wherein the first total thickness is different than the second total thickness.

    SINGLE CIRCUIT BOARD ASSEMBLY WITH LOGIC AND POWER COMPONENTS

    公开(公告)号:US20220394848A1

    公开(公告)日:2022-12-08

    申请号:US17824613

    申请日:2022-05-25

    Abstract: A single circuit board assembly for forming a vehicle-motor interface, the single circuit board assembly includes a first side of a board with logic modules located thereon. The single circuit board assembly also includes a second side of the board with power modules located thereon. The board comprises a plurality of layers, the plurality of layers having at least one through via and at least one buried via defined therein, wherein the at least one through via extends through all of the plurality of layers, the at least one buried via extending through less than all of the plurality of layers.

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