Sputter target assembly having a metal-matrix-composite backing plate and methods of making same
    3.
    发明授权
    Sputter target assembly having a metal-matrix-composite backing plate and methods of making same 失效
    具有金属基复合背板的溅射靶组件及其制造方法

    公开(公告)号:US06183686B2

    公开(公告)日:2001-02-06

    申请号:US09365919

    申请日:1999-08-03

    IPC分类号: B22F314

    摘要: A method of producing a sputter target assembly including a metal target attached to a metal-matrix-composite backing plate and sputter target assemblies made thereby. The method includes hot isostatically pressing a silicon carbide-aluminum powder composition to form a backing plate while simultaneously bonding the powder composition to a metal target to form a diffusion-type bond between the target and the backing plate such that the target assembly possesses extremely high resistance to warpage at high operating temperatures. A second embodiment of the sputter target assembly includes an annular sealing member of machined aluminum disposed in the backing plate around the target.

    摘要翻译: 一种制造溅射靶组件的方法,该溅射靶组件包括连接到金属基复合材料背板的金属靶和由此制成的溅射靶组件。 该方法包括热等静压碳化硅 - 铝粉末组合物以形成背板,同时将粉末组合物粘合到金属靶上,以在靶和背板之间形成扩散型结合,使得目标组件具有非常高的 在高工作温度下耐翘曲。 溅射靶组件的第二实施例包括设置在围绕靶的背板中的加工铝的环形密封构件。