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    Power and ground buss layout for reduced substrate size
    3.
    发明授权
    Power and ground buss layout for reduced substrate size 有权
    电源和接地总线布局，以减小基板尺寸

    公开(公告)号：US07344227B2

    公开(公告)日：2008-03-18

    申请号：US11676551

    申请日：2007-02-20

    申请人： David G. King ,  Kristi M. Rowe

    发明人： David G. King ,  Kristi M. Rowe

    IPC分类号： B41J2/05

    CPC分类号： B41J2/04541 ,  B41J2/04548 ,  B41J2/04563 ,  B41J2/0458 ,  B41J2/14072 ,  B41J2/14129

    摘要： A semiconductor substrate for a micro-fluid ejection device. The substrate includes plurality of micro-fluid ejection actuators disposed adjacent a fluid supply slot in the semiconductor substrate. A plurality of power transistors, occupying a power transistor active area of the substrate, are disposed adjacent the ejection actuators and are connected through a first metal conductor layer to the ejection actuators. An array of logic circuits, occupying a logic circuit area of the substrate, is disposed adjacent the plurality of power transistors and is connected through a polysilicon conductor layer to the power transistors. A power conductor and a ground conductor for the ejection actuators is routed in a second metal conductor layer. The power conductor overlaps at least a portion of the power transistor active area of the substrate and the ground conductor overlaps at least a portion of the logic circuit area of the substrate.

    摘要翻译： 一种用于微流体喷射装置的半导体衬底。 衬底包括邻近半导体衬底中的流体供应槽设置的多个微流体喷射致动器。 占据基板的功率晶体管有源区的多个功率晶体管被设置在喷射致动器附近，并且通过第一金属导体层连接到喷射致动器。 占据基板的逻辑电路区域的逻辑电路阵列被布置成与多个功率晶体管相邻，并且通过多晶硅导体层连接到功率晶体管。 用于喷射致动器的电源导体和接地导体在第二金属导体层中布线。 电源导体与衬底的功率晶体管有源区域的至少一部分重叠，并且接地导体与衬底的逻辑电路区域的至少一部分重叠。

    Power and ground buss layout for reduced substrate size
    4.
    发明授权
    Power and ground buss layout for reduced substrate size 有权
    电源和接地总线布局，以减小基板尺寸

    公开(公告)号：US07195341B2

    公开(公告)日：2007-03-27

    申请号：US10956939

    申请日：2004-09-30

    申请人： David G. King ,  Kristi M. Rowe

    发明人： David G. King ,  Kristi M. Rowe

    IPC分类号： B41J2/05

    CPC分类号： B41J2/04541 ,  B41J2/04548 ,  B41J2/04563 ,  B41J2/0458 ,  B41J2/14072 ,  B41J2/14129

    摘要： A semiconductor substrate for a micro-fluid ejection device. The substrate includes plurality of micro-fluid ejection actuators disposed adjacent a fluid supply slot in the semiconductor substrate. A plurality of power transistors, occupying a power transistor active area of the substrate, are disposed adjacent the ejection actuators and are connected through a first metal conductor layer to the ejection actuators. An array of logic circuits, occupying a logic circuit area of the substrate, is disposed adjacent the plurality of power transistors and is connected through a polysilicon conductor layer to the power transistors. A power conductor and a ground conductor for the ejection actuators is routed in a second metal conductor layer. The power conductor overlaps at least a portion of the power transistor active area of the substrate and the ground conductor overlaps at least a portion of the logic circuit area of the substrate.

    摘要翻译： 一种用于微流体喷射装置的半导体衬底。 衬底包括邻近半导体衬底中的流体供应槽设置的多个微流体喷射致动器。 占据基板的功率晶体管有源区的多个功率晶体管被设置在喷射致动器附近，并且通过第一金属导体层连接到喷射致动器。 占据基板的逻辑电路区域的逻辑电路阵列被布置成与多个功率晶体管相邻，并且通过多晶硅导体层连接到功率晶体管。 用于喷射致动器的电源导体和接地导体在第二金属导体层中布线。 电源导体与衬底的功率晶体管有源区域的至少一部分重叠，并且接地导体与衬底的逻辑电路区域的至少一部分重叠。

    Methods and apparatuses for sensing temperature of multi-via heater chips
    5.
    发明授权
    Methods and apparatuses for sensing temperature of multi-via heater chips 有权
    用于感测多通道加热器芯片温度的方法和装置

    公开(公告)号：US07594708B2

    公开(公告)日：2009-09-29

    申请号：US11323809

    申请日：2005-12-30

    申请人： Lucas David Barkley ,  Bruce David Gibson ,  Eric Spencer Hall ,  David G. King ,  George K. Parish

    发明人： Lucas David Barkley ,  Bruce David Gibson ,  Eric Spencer Hall ,  David G. King ,  George K. Parish

    IPC分类号： B41J29/38

    CPC分类号： B41J2/195 ,  B41J2/04563 ,  B41J2/0458

    摘要： Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.

    摘要翻译： 用于与打印装置一起使用的加热器芯片，例如包括基本上邻近第一通孔定位的第一加热器阵列的加热器芯片和基本上邻近第二通孔定位的第二加热器阵列。 加热器芯片还可以包括位于第一加热器阵列和第二加热器阵列之间的区域，以及温度感测元件，其可操作以感测区域的温度，其中温度感测元件相对于该区域基本上居中设置。 根据本发明的一个实施例，温度感测元件包括温度感测电阻器。

    Methods and apparatuses for regulating the temperature of multi-via heater chips
    6.
    发明授权
    Methods and apparatuses for regulating the temperature of multi-via heater chips 有权
    用于调节多通道加热器芯片温度的方法和装置

    公开(公告)号：US07484823B2

    公开(公告)日：2009-02-03

    申请号：US11324167

    申请日：2005-12-30

    申请人： Lucas David Barkley ,  Bruce David Gibson ,  Eric Spencer Hall ,  David G. King ,  George K Parish

    发明人： Lucas David Barkley ,  Bruce David Gibson ,  Eric Spencer Hall ,  David G. King ,  George K Parish

    IPC分类号： B41J29/38

    CPC分类号： B41J2/195 ,  B41J2/04563 ,  B41J2/0458

    摘要： Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. Additionally, the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element to regulate the temperature of the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor and the heating may occur via non-nucleating heating.

    摘要翻译： 用于与打印装置一起使用的加热器芯片，例如包括基本上邻近第一通孔定位的第一加热器阵列的加热器芯片和基本上邻近第二通孔定位的第二加热器阵列。 加热器芯片还可以包括位于第一加热器阵列和第二加热器阵列之间的区域，以及温度感测元件，其可操作以感测区域的温度，其中温度感测元件相对于该区域基本上居中设置。 另外，第一加热器阵列和第二加热器阵列可操作以响应于由温度感测元件感测的区域的温度接收加热，以调节该区域的温度。 根据本发明的一个实施例，温度感测元件包括温度感测电阻器，并且加热可以通过非成核加热发生。

    Printhead having a plurality of print modes
    7.
    发明授权
    Printhead having a plurality of print modes 有权
    打印头具有多种打印模式

    公开(公告)号：US07815285B2

    公开(公告)日：2010-10-19

    申请号：US11254456

    申请日：2005-10-20

    申请人： Lucas D. Barkley ,  David G. King ,  Randall D. Mayo ,  George K. Parish

    发明人： Lucas D. Barkley ,  David G. King ,  Randall D. Mayo ,  George K. Parish

    IPC分类号： B41J2/145

    CPC分类号： B41J19/145 ,  B41J2/2132 ,  G06K15/107

    摘要： Printheads configured to operate in accordance with a plurality of print modes. For example, one of the plurality of print modes can be selected in accordance with a bit of address data received by the printhead. In an exemplary embodiment, the selection of print mode can be accomplished by switching one or more actuator (e.g., heater) circuit addresses on the printhead.

    摘要翻译： 打印头被配置为根据多种打印模式进行操作。 例如，可以根据由打印头接收到的地址数据的位来选择多个打印模式之一。 在示例性实施例中，可以通过切换打印头上的一个或多个致动器（例如，加热器）电路地址来实现打印模式的选择。

    Method of imaging substance depletion detection for an imaging device
    10.
    发明授权
    Method of imaging substance depletion detection for an imaging device 有权
    用于成像装置的成像物质耗尽检测的成像方法

    公开(公告)号：US06612680B1

    公开(公告)日：2003-09-02

    申请号：US10185954

    申请日：2002-06-28

    申请人： David G. King ,  Patrick L. Kroger

    发明人： David G. King ,  Patrick L. Kroger

    IPC分类号： B41T29393

    CPC分类号： B41J29/393

    摘要： A method of imaging substance depletion detection in an imaging device. The method includes the steps of identifying a theoretical coverage of an imaging substance for a first area of a sheet of print media; determining an actual coverage of the imaging substance for the first area of the sheet of print media; comparing the theoretical coverage with the actual coverage; and determining whether a depletion of the imaging substance has occurred based on a result of the comparing step.

    摘要翻译： 一种成像装置中成像物质消耗检测的成像方法。 该方法包括以下步骤：识别打印介质片的第一区域的成像物质的理论覆盖; 确定所述打印介质片的所述第一区域的所述成像物质的实际覆盖范围; 将理论覆盖面与实际覆盖面进行比较; 以及基于所述比较步骤的结果来确定是否已经发生所述成像物质的耗尽。