公开(公告)号：US5597737A

公开(公告)日：1997-01-28

申请号：US552448

申请日：1995-11-03

申请人： Stuart E. Greer ,  Joel P. Dietz ,  Aubrey K. Sparkman

发明人： Stuart E. Greer ,  Joel P. Dietz ,  Aubrey K. Sparkman

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66

CPC分类号： G01R31/2831 ,  G01R31/2886

摘要： Flip-chip is fast becoming the mounting method of choice in the semiconductor industry for dice having a high number of contacts. Since many applications require known-good-die, these flip-chip semiconductor dice must be tested and burned-in. By testing and burning-in the semiconductor wafers prior to solder bumping, the probe tips (42, 44, 46 & 48) can contact the hard planar surface of the under-bump-metallurgy (40) on each bonding pad (14) for easier and more reliable contact and hence test results. The probe tips can be either of an array (42 & 44) or cantilevered needle (46 & 48) type. Blunt probe tips (42 & 48) are well-suited to making contact on the shoulder of each bonding pad of each semiconductor die, while sharp probe tips (44 & 46) are preferable for contacting the center of each bonding pad. Solder bumping is performed post-testing.

摘要翻译： 倒装芯片正在快速成为半导体工业中具有大量接触的骰子的安装方法。 由于许多应用需要已知的裸芯片，因此这些倒装芯片半导体芯片必须经过测试和烧录。 通过在焊料凸起之前测试和燃烧半导体晶片，探针尖端（42,44,46和48）可接触每个接合焊盘（14）上的凸点下 - 冶金学（40）的硬平坦表面，用于 更容易和更可靠的接触和因此的测试结果。 探针尖端可以是阵列（42和44）或悬臂针（46和48）类型。 钝头探针尖端（42和48）非常适合于在每个半导体管芯的每个焊盘的肩部上接触，而尖锐的探针尖端（44和46）优选用于接触每个焊盘的中心。 焊接碰撞在测试后进行。