Abstract:
A phase-change memory device and a fabrication method thereof, capable of reducing driving current while minimizing a size of a contact hole used for forming a PN diode in the phase-change memory device that employs the PN diode. The method of fabricating the phase-change memory device includes the steps of preparing a semiconductor substrate having a junction area formed with a dielectric layer, forming an interlayer dielectric layer having etching selectivity lower than that of the dielectric layer over an entire structure, and forming a contact hole by removing predetermined portions of the interlayer dielectric layer and the dielectric layer. The contact area between the PN diode and the semiconductor substrate is increased so that interfacial resistance is reduced.
Abstract:
A method of fabricating a semiconductor device includes forming a mask pattern for exposing a region of a semiconductor substrate. Dopant ions are implanted into the exposed region of the semiconductor substrate at a tilt angle of approximately 4.4° to 7°.
Abstract:
A method of fabricating a semiconductor device includes forming a mask pattern for defining a region of a semiconductor substrate. An impurity layer for suppressing punch-through will be formed in the defined region. Dopant ions are implanted into the defined region of the semiconductor substrate at a tilt angle of approximately 4.4° to 7°.
Abstract:
A method of manufacturing a semiconductor device to have uniform topology includes forming an interlayer insulating layer on a semiconductor device, carrying out an ion implantation process by varying an amount of ion-implantation according to a height profile of the interlayer insulating layer, and planarizing the interlayer insulating layer.
Abstract:
A method of fabricating a semiconductor device includes forming a mask pattern for defining a region of a semiconductor substrate. A field stop dopant layer will be formed in the defined region. Dopant ions are implanted into the defined region of the semiconductor substrate at a tilt angle of approximately 4.4° to 7°.
Abstract:
A target apparatus for producing a radioisotope having improved cooling performance including a cavity member including a cavity accommodating H218O concentrate and producing 18F through a nuclear reaction between the H218O concentrate and protons irradiated onto the H218O concentrate, wherein the cavity member includes a front aperture and a rear aperture disposed in opposite directions on a path in which the protons are irradiated and connected to the cavity so that the cavity has openings. wherein a thermo-chemically stable layer plated with titanium or niobium is formed in an inner circumference of the cavity.
Abstract:
A method of fabricating a semiconductor device includes forming a mask pattern for defining a region on a semiconductor substrate. A well will be formed in the defined region. Dopant ions are implanted into the defined region of the semiconductor substrate at a tilt angle of approximately 4.4° to 7°.