摘要:
The disclosure is directed to a thermally-stable dielectric fluid. The dielectric fluid includes (a) an oil, (b) a substituted, hindered phenolic antioxidant having at least two substituted cresol groups being covalently bonded to each other through a methylene bridge, and (c) a substituted, diphenyl amine antioxidant having at least two substituted phenyl groups being covalently bonded to each other through an amine bridge.
摘要:
The disclosure is directed to a thermally-stable dielectric fluid. The dielectric fluid includes (a) an oil, (b) a substituted, hindered phenolic antioxidant having at least two substituted cresol groups being covalently bonded to each other through a methylene bridge, and (c) a substituted, diphenyl amine antioxidant having at least two substituted phenyl groups being covalently bonded to each other through an amine bridge.
摘要:
Inhalable compositions are described. The inhalable compositions comprise one or more respirable aggregates, the respirable aggregates comprising one or more poorly water soluble active agents, wherein at least one of the active agents reaches a maximum lung concentration (Cmax) of at least about 0.25 μg/gram of lung tissue and remains at such concentration for a period of at least one hour after being delivered to the lung. Methods for making such compositions and methods for using such compositions are also disclosed.
摘要:
The present invention relates to an ethanol-free, non-fatty, non-sticky perfumed aqueous cosmetic microemulsion composition, including one or more fragrance materials, a solvent, an aqueous medium, and optionally, one or more surfactants; wherein the solvent in the microemulsion is a vicinal diol such as 1,2-hexanediol.
摘要:
A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要:
A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要:
The present invention refers to a high internal phase polyclectrolyte emulsions which are useful for the manufacture of superabsorbent polymers having two phases: i) a continuous oil phase and the ii) a dispersed aqueous phase containing the aqueous monomer solution prior to polymerization and the polyelectrolyte in water-soluble, or water-swellable or very slightly crosslinked form after polymerization, wherein the polymerization occurs in the dispersed aqueous phase and wherein the dispersed aqueous phase contains a high concentration of polyclectrolyte. The present invention also refers to a process for preparing such emulsions and for inverting these emulsions so as to form films or other patterns of the superabsorbent polymer. Absorbent structures containing SAP films or other patterns prepared by the present invention are also contemplated.
摘要:
The present invention pertains to an improved method of oxidizing substituted aromatic compounds (such as p xylene) to their corresponding aromatic acids (such as terephthalic acid). The improvement involves carrying out the oxidation reaction in an aqueous medium, wherein the aqueous medium contains at least 30 percent water, preferably up to 30 percent surfactant and preferably a low molecular weight material containing a hydrophilic end group as a co-surfactant. The reaction is carried out at a pH of less than 3.0.
摘要:
A method for determining the percent of a solid material dissolved into a liquid medium is disclosed. The method comprises the steps of combining the solid material and the liquid medium; determining the initial solid concentration (i); determining the dynamic solid concentration (d) using a light scattering technique; and calculating the percent dissolved material according to the formula: [(i−d)/i]×100. Methods for determining dissolution rate and particle size using turbidity measurements are also disclosed.
摘要:
A process for hypochlorinating unsaturated alpha-olefins to produce chlorohydrins which comprises forming a microemulsion of water and an unsaturated alpha-olefin and then adding an oxidant to the microemulsion under conditions sufficient to form the chlorohydrins. The microemulsion is formed by adding a non-nucleophilic surfactant and, optionally, a co-surfactant, to the mixture of water and unsaturated alpha-olefin.