公开(公告)号：US20110170234A1

公开(公告)日：2011-07-14

申请号：US12801951

申请日：2010-07-02

申请人： Sung Ho Lee ,  Chang Ryul Jung ,  Wan Suk Yang ,  Hyun Chul Jung ,  Yeong Su Cho

发明人： Sung Ho Lee ,  Chang Ryul Jung ,  Wan Suk Yang ,  Hyun Chul Jung ,  Yeong Su Cho

IPC分类号： H01G9/155 ,  H01G9/02 ,  H01G9/08

CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/02 ,  H01G9/08 ,  H01G11/12 ,  H01G11/52 ,  H01G11/66 ,  H01G11/82 ,  Y02E60/13

摘要： There is provided an electric double layer capacitor including: a multilayer electric double layer capacitor cell including first and second electrodes facing each other with an ion-permeable separator interposed therebetween; and an insulating tape with which to enclose an outer surface of the multilayer electric double layer capacitor cell and having a plurality of pores. In the electric double layer capacitor, movements between the first and second electrodes and the ion-permeable separator are minimized so that the area of the facing surfaces of the first and second electrodes increases. Accordingly, high capacitance may be achieved. In addition, the pores formed in the insulating tape facilitate the path of an electrolyte so that the impregnation of the electrolyte into the multilayer electric double layer capacitor cell is thereby facilitated.

摘要翻译： 提供一种双电层电容器，其包括：多层双电层电容器单元，其包括彼此面对的第一和第二电极，隔着透离子隔离; 以及绝缘带，用于封闭多层双电层电容器单元的外表面并具有多个孔。 在双电层电容器中，第一电极和第二电极与离子可渗透隔板之间的移动被最小化，使得第一和第二电极的相对表面的面积增加。 因此，可以实现高电容。 此外，形成在绝缘带中的孔促进电解质的路径，从而便于电解质浸入多层双电层电容器电池中。

公开(公告)号：US20110170233A1

公开(公告)日：2011-07-14

申请号：US12801920

申请日：2010-07-01

申请人： Sung Ho Lee ,  Chang Ryul Jung ,  Hyun Chul Jung ,  Yeong Su Cho ,  Wan Suk Yang

发明人： Sung Ho Lee ,  Chang Ryul Jung ,  Hyun Chul Jung ,  Yeong Su Cho ,  Wan Suk Yang

IPC分类号： H01G9/016 ,  H01G9/155

CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/02 ,  H01G11/52 ,  H01G11/76 ,  H01G11/84 ,  Y02E60/13

摘要： There is provided a chip-type electric double layer capacitor cell and a method of manufacturing the same. The chip-type electric double layer capacitor cell includes a separator folded to include first and second folded portions with first and second open portions formed in opposite directions by the first and second folded portions, and first and second electrodes inserted into the first and second open portions. The positions of the first and second electrodes are fixed by the first and second folded portions of the separator, and accordingly, the appropriate arrangement of the plurality of first and second electrodes is facilitated. A short circuit between the first and second electrodes is avoided to thereby increase the capacitance of the chip-type electric double layer capacitor cell.

摘要翻译： 提供了一种芯片式双电层电容器单元及其制造方法。 芯片式双电层电容器电池包括折叠成包括第一和第二折叠部分的隔板，第一和第二折叠部分具有通过第一和第二折叠部分沿相反方向形成的第一和第二开口部分，并且第一和第二电极插入第一和第二开口 部分。 第一和第二电极的位置由隔板的第一和第二折叠部分固定，因此，便于多个第一和第二电极的适当布置。 避免了第一和第二电极之间的短路，从而增加了芯片式双电层电容器单元的电容。

公开(公告)号：US20110197408A1

公开(公告)日：2011-08-18

申请号：US12923829

申请日：2010-10-08

申请人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

发明人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

IPC分类号： H01G9/00

CPC分类号： H01G9/0029 ,  Y02E60/13 ,  Y10T29/413 ,  Y10T29/417 ,  Y10T29/49114 ,  Y10T29/4913

摘要： There are provided methods of manufacturing an electric double layer capacitor cell and an electric double layer capacitor and an apparatus for manufacturing an electric double layer capacitor cell. The method of manufacturing the electric double layer capacitor cell includes preparing first and second electrode sheets by printing electrode material onto conductive sheets, respectively, with the exception of regions to be provided as first and second terminal lead-out portions in the conductive sheets; punching the first and second electrode sheets so as to form a plurality of first and second unit electrodes, respectively, each first unit electrode having the first terminal lead-out portion and each second unit electrode having the second terminal lead-out portion; stacking the first and second electrode sheets with a separator interposed therebetween in order that the plurality of first and second unit electrodes are overlapped; and cutting the first and second electrode sheets being stacked into the first and second unit electrodes.

摘要翻译： 提供制造双电层电容器单元和双电层电容器的方法以及双电层电容器单元的制造装置。 制造双电层电容器单元的方法包括通过将电极材料分别印刷到导电片上来制备第一和第二电极片，除了要在导电片中作为第一和第二端子引出部分设置的区域之外; 冲压第一和第二电极片以分别形成多个第一和第二单位电极，每个第一单元电极具有第一端子引出部分和每个第二单位电极具有第二端子引出部分; 为了使多个第一和第二单位电极重叠，将第一和第二电极片层叠在隔板之间; 以及切割堆叠在第一和第二单元电极中的第一和第二电极片。

公开(公告)号：US08187343B2

公开(公告)日：2012-05-29

申请号：US12923829

申请日：2010-10-08

申请人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

发明人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

IPC分类号： H01M4/82

CPC分类号： H01G9/0029 ,  Y02E60/13 ,  Y10T29/413 ,  Y10T29/417 ,  Y10T29/49114 ,  Y10T29/4913

摘要： There are provided methods of manufacturing an electric double layer capacitor cell and an electric double layer capacitor and an apparatus for manufacturing an electric double layer capacitor cell. The method of manufacturing the electric double layer capacitor cell includes preparing first and second electrode sheets by printing electrode material onto conductive sheets, respectively, with the exception of regions to be provided as first and second terminal lead-out portions in the conductive sheets; punching the first and second electrode sheets so as to form a plurality of first and second unit electrodes, respectively, each first unit electrode having the first terminal lead-out portion and each second unit electrode having the second terminal lead-out portion; stacking the first and second electrode sheets with a separator interposed therebetween in order that the plurality of first and second unit electrodes are overlapped; and cutting the first and second electrode sheets being stacked into the first and second unit electrodes.

摘要翻译： 提供制造双电层电容器单元和双电层电容器的方法以及双电层电容器单元的制造装置。 制造双电层电容器单元的方法包括通过将电极材料分别印刷到导电片上来制备第一和第二电极片，除了要在导电片中作为第一和第二端子引出部分设置的区域之外; 冲压第一和第二电极片以分别形成多个第一和第二单位电极，每个第一单元电极具有第一端子引出部分和每个第二单位电极具有第二端子引出部分; 为了使多个第一和第二单位电极重叠，将第一和第二电极片层叠在隔板之间; 以及切割堆叠在第一和第二单元电极中的第一和第二电极片。

公开(公告)号：US20120210549A1

公开(公告)日：2012-08-23

申请号：US13459570

申请日：2012-04-30

申请人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

发明人： Sang Kyun Lee ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Chang Ryul Jung ,  Wan Suk Yang

IPC分类号： H01L21/00

CPC分类号： H01G9/0029 ,  Y02E60/13 ,  Y10T29/49114 ,  Y10T29/4913

摘要： A method of manufacturing the electric double layer capacitor cell includes preparing first and second electrode sheets by printing electrode material onto conductive sheets, respectively, with the exception of regions to be provided as first and second terminal lead-out portions in the conductive sheets; punching the first and second electrode sheets so as to form a plurality of first and second unit electrodes, respectively, each first unit electrode having the first terminal lead-out portion and each second unit electrode having the second terminal lead-out portion; stacking the first and second electrode sheets with a separator interposed therebetween in order that the plurality of first and second unit electrodes are overlapped; and cutting the first and second electrode sheets being stacked into the first and second unit electrodes.

摘要翻译： 制造双电层电容器单元的方法包括通过将电极材料分别印刷到导电片上来制备第一和第二电极片，除了要在导电片中作为第一和第二端子引出部分设置的区域之外， 冲压第一和第二电极片以分别形成多个第一和第二单位电极，每个第一单元电极具有第一端子引出部分和每个第二单位电极具有第二端子引出部分; 为了使多个第一和第二单位电极重叠，将第一和第二电极片层叠在隔板之间; 以及切割堆叠在第一和第二单元电极中的第一和第二电极片。

公开(公告)号：US20110102972A1

公开(公告)日：2011-05-05

申请号：US12923950

申请日：2010-10-15

申请人： Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Hyun Chul Jung ,  Yeong Su Cho ,  Sang Kyun Lee

发明人： Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Hyun Chul Jung ,  Yeong Su Cho ,  Sang Kyun Lee

IPC分类号： H01G9/08 ,  H01G13/00 ,  B23K11/00 ,  B23K20/10

CPC分类号： H01G11/80 ,  H01G9/016 ,  H01G9/10 ,  H01G9/155 ,  H01G11/74 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13 ,  Y02T10/7022

摘要： There is provided a chip-type electric double layer capacitor comprising: a resin case having a housing space provided therein and formed of insulating resin and first and second external terminals inserted into the resin case by insert injection molding. Each of the external terminals has a first portion exposed to an outer surface of the resin case for external contact and a second portion exposed to an inner surface of the housing space for internal contact. a sealing portion includes a groove portion provided in the resin case along a circumference of at least one of the first and second external terminals and a resin filling the groove portion. An electric double layer capacitor cell is mounted in the housing space and electrically connected to the second portion of the first and second external terminals.

摘要翻译： 提供了一种芯片式双电层电容器，包括：具有设置在其中的由绝缘树脂形成的容纳空间的树脂壳体和通过插入注射成型插入到树脂壳体中的第一和第二外部端子。 每个外部端子具有暴露于用于外部接触的树脂壳体的外表面的第一部分和暴露于壳体空间的内表面以用于内部接触的第二部分。 密封部分包括沿着第一和第二外部端子中的至少一个的圆周设置在树脂壳体中的凹槽部分和填充凹槽部分的树脂。 电双层电容器电池安装在容纳空间中并电连接到第一和第二外部端子的第二部分。

公开(公告)号：US20110058307A1

公开(公告)日：2011-03-10

申请号：US12591410

申请日：2009-11-18

申请人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

发明人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

IPC分类号： H01G9/155

CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/52 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13

摘要： The present invention relates to a chip-type electric double layer capacitor and a method for manufacturing a method for manufacturing the same. The chip-type electric double layer capacitor includes an electric double layer element including two electrodes that include two different polarities and electrode terminals protruded on sides opposite to each other, a first separator that prevents the two electrodes from being short-circuited, and a second separator that is disposed at a position opposed to the first separator on the basis of one electrode of the two electrodes; and a package including package terminals attached to the protruded electrode terminals of the two electrodes, which are formed on the bottom thereof and housing the electric double layer element, wherein the electric double layer element is wound on the basis of the protruded electrode terminals opposite to the two electrodes as a reference axis and the electrode terminals are attached to the package terminals, respectively.

摘要翻译： 芯片型双电层电容器及其制造方法技术领域本发明涉及芯片式双电层电容器及其制造方法。 芯片式双电层电容器包括双电层元件，其包括两个电极，其包括两个不同的极性，并且在彼此相反的一侧突出的电极端子，防止两个电极短路的第一隔板，以及第二隔离件 分离器，其基于两个电极的一个电极设置在与第一分离器相对的位置处; 以及包括安装在两个电极的突出电极端子上的封装端子的封装，它们形成在其底部并容纳双电层元件，其中基于与第二电极相对的突出电极端子缠绕双电层元件 作为参考轴的两个电极和电极端子分别附接到封装端子。

公开(公告)号：US20110058306A1

公开(公告)日：2011-03-10

申请号：US12591010

申请日：2009-11-04

申请人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

发明人： Sung Ho Lee ,  Seung Hyun Ra ,  Dong Sup Park ,  Yeong Su Cho ,  Sang Kyun Lee ,  Hyun Chul Jung ,  Chang Ryul Jung

IPC分类号： H01G9/155 ,  H01G9/08

CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  Y02E60/13

摘要： Disclosed is a package structure of a chip-type electric double layer capacitor which includes a lower package, which houses an electric double layer element and has a package terminal formed thereon to be electrically connected to the electric double layer element, and an upper package which is disposed on a top part of the lower package and seals the electric double layer element from the outside, wherein the package terminals are formed to be protruded from an internal bottom surface and an external bottom surface of the lower package, and the external bottom surface of the lower package has at least two pairs of protrusions formed thereon.

摘要翻译： 公开了芯片型双电层电容器的封装结构，其包括下封装，其容纳双电层元件并且具有形成在其上的封装端子以电连接到双电层元件，以及上封装 设置在下封装的顶部，并将双电层元件从外部密封，其中封装端子形成为从下封装的内底表面和外底表面突出，外表面 的下部封装具有形成在其上的至少两对突起。

公开(公告)号：US20100328846A1

公开(公告)日：2010-12-30

申请号：US12654534

申请日：2009-12-22

申请人： Sung Ho Lee ,  Hyun Chul Jung ,  Chang Ryul Jung ,  Yeong Su Cho

发明人： Sung Ho Lee ,  Hyun Chul Jung ,  Chang Ryul Jung ,  Yeong Su Cho

IPC分类号： H01G9/00

CPC分类号： H01G9/0029 ,  H01G11/28 ,  H01G11/34 ,  H01G11/48 ,  H01G11/86 ,  Y02E60/13

摘要： An electrode for an electric double layer capacitor includes a current collector including an aluminum (Al) foil layer and a highly conductive metal layer having a higher conductivity than Al and laminated on the Al foil layer, a groove formed in the Al foil layer to cause the highly conductive metal layer to contact an electrode material, and an electrode layer formed of the electrode material on the groove and the Al foil layer.

摘要翻译： 一种双电层电容器用电极，其特征在于，具备铝（Al）箔层和比Al强的导电性高的层叠在Al箔层上的导电性金属层的集电体，形成在铝箔层中的槽 与电极材料接触的高导电性金属层，以及由槽上的电极材料形成的电极层和Al箔层。

公开(公告)号：US20120297594A1

公开(公告)日：2012-11-29

申请号：US13568483

申请日：2012-08-07

申请人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

发明人： Sang Kyun Lee ,  Chang Ryul Jung ,  Sung Ho Lee ,  Dong Sup Park ,  Yeong Su Cho ,  Hyun Chul Jung

IPC分类号： H01G9/155

CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01G11/84 ,  Y02E60/13 ,  Y02T10/7022 ,  Y10T29/417

摘要： A method of manufacturing a chip-type electric double layer capacitor, including: forming a lower case having an opened housing space and first and second external terminals buried therein, the first and second external terminals having first surfaces exposed to the housing space, respectively, and second surfaces exposed to an outer region of the lower case, respectively; mounting an electric double layer capacitor cell in the housing space such that the electric double layer capacitor cell is electrically connected to the first surfaces of the first and second external terminals exposed to the housing space; and mounting an upper cap on the lower case so as to cover the housing space.

摘要翻译： 一种制造芯片式双电层电容器的方法，包括：形成具有开放的容纳空间的下壳体和埋入其中的第一和第二外部端子，第一和第二外部端子分别具有暴露于容纳空间的第一表面， 以及分别暴露于所述下壳体的外部区域的第二表面; 将双电层电容器单元安装在容纳空间中，使得双电层电容器单元电连接到暴露于容纳空间的第一和第二外部端子的第一表面; 并将上盖安装在下壳体上以覆盖住容纳空间。