摘要:
A vertical non-volatile memory device is structured/fabricated to include a substrate, groups of memory cell strings each having a plurality of memory transistors distributed vertically so that the memory throughout multiple layers on the substrate, integrated word lines coupled to sets of the memory transistors, respectively, and stacks of word select lines. The memory transistors of each set are those transistors, of one group of the memory cell strings, which are disposed in the same layer above the substrate. The word select lines are respectively connected to the integrated word lines.
摘要:
A vertical non-volatile memory device is structured/fabricated to include a substrate, groups of memory cell strings each having a plurality of memory transistors distributed vertically so that the memory throughout multiple layers on the substrate, integrated word lines coupled to sets of the memory transistors, respectively, and stacks of word select lines. The memory transistors of each set are those transistors, of one group of the memory cell strings, which are disposed in the same layer above the substrate. The word select lines are respectively connected to the integrated word lines.
摘要:
A flash memory device having a vertical channel structure. The flash memory device includes a substrate having a surface that extends in a first direction, a channel region having a pillar shape and extending from the substrate in a second direction that is perpendicular to the first direction, a gate dielectric layer formed around the channel region, a memory cell string comprising a plurality of transistors sequentially formed around the channel region in the second direction, wherein the gate dielectric layer is disposed between the plurality of transistors and the channel region, and a bit line connected to one of the plurality of transistors, and surrounding a side wall and an upper surface of one end of the channel region so as to directly contact the channel region.
摘要:
A flash memory device having a vertical channel structure. The flash memory device includes a substrate having a surface that extends in a first direction, a channel region having a pillar shape and extending from the substrate in a second direction that is perpendicular to the first direction, a gate dielectric layer formed around the channel region, a memory cell string comprising a plurality of transistors sequentially formed around the channel region in the second direction, wherein the gate dielectric layer is disposed between the plurality of transistors and the channel region, and a bit line connected to one of the plurality of transistors, and surrounding a side wall and an upper surface of one end of the channel region so as to directly contact the channel region.
摘要:
A method of fabricating a non-volatile memory device according to an example embodiment may include etching a plurality of sacrificial films and insulation films to form a plurality of first openings that expose a plurality of first portions of a semiconductor substrate. A plurality of channel layers may be formed in the plurality of first openings so as to coat the plurality of first portions of the semiconductor substrate and side surfaces of the plurality of first openings. A plurality of insulation pillars may be formed on the plurality of channel layers so as to fill the plurality of first openings. The plurality of sacrificial films and insulation films may be further etched to form a plurality of second openings that expose a plurality of second portions of the semiconductor substrate. A plurality of side openings may be formed by removing the plurality of sacrificial films. A plurality of gate dielectric films may be formed on surfaces of the plurality of side openings. A plurality of gate electrodes may be formed on the plurality of gate dielectric films so as to fill the plurality of side openings.
摘要:
A method of fabricating a non-volatile memory device according to an example embodiment may include etching a plurality of sacrificial films and insulation films to form a plurality of first openings that expose a plurality of first portions of a semiconductor substrate. A plurality of channel layers may be formed in the plurality of first openings so as to coat the plurality of first portions of the semiconductor substrate and side surfaces of the plurality of first openings. A plurality of insulation pillars may be formed on the plurality of channel layers so as to fill the plurality of first openings. The plurality of sacrificial films and insulation films may be further etched to form a plurality of second openings that expose a plurality of second portions of the semiconductor substrate. A plurality of side openings may be formed by removing the plurality of sacrificial films. A plurality of gate dielectric films may be formed on surfaces of the plurality of side openings. A plurality of gate electrodes may be formed on the plurality of gate dielectric films so as to fill the plurality of side openings.
摘要:
A porous membrane with pores that includes a polymerization product of a polyazole-based material, an electrolyte membrane including the porous membrane with a proton-conductive polymer provided in pores of the porous membrane, methods of manufacturing the porous membrane and the electrolyte membrane, and a fuel cell employing at least one of the porous membrane and the electrolyte membrane.
摘要:
A porous membrane with pores that includes a polymerization product of a polyazole-based material, an electrolyte membrane including the porous membrane with a proton-conductive polymer provided in pores of the porous membrane, methods of manufacturing the porous membrane and the electrolyte membrane, and a fuel cell employing at least one of the porous membrane and the electrolyte membrane.
摘要:
Provided are non-volatile memory devices and methods of fabricating the same, including improved bit line and contact formation that may reduce resistance and parasitic capacitance, thereby reducing manufacturing costs and improving device performance. The non-volatile memory devices may include a substrate; a plurality of field regions formed on the substrate, each of the field regions including a homogeneous first field and a second field that is divided into two sub regions via a bridge region; an active region formed on the substrate and defined as having a string structure by the field regions, where at least two strings may be connected via one of the bridge regions; and a plurality of shared bit lines may be formed on the field regions and connected to the active region via bit line contacts, where the bit line contacts may be direct contacts.
摘要:
A method of generating and allocating codewords includes allocating one of two selectable codewords b1 and b2 as codeword “b” when a preceding codeword “a” and a following codeword “b” form a code stream X, in which the codewords b1 and b2 have opposite INV values which are parameters indicating whether the number of ‘1s’ contained in a codeword is an odd number or an even number. When the code stream of the preceding codeword “a” and the following codeword b1 is X1, and when the code stream of the preceding codeword “a” and the following codeword b2 is X2, the codewords are allocated such that the INV values of X1 and X2 are maintained to be opposite when the preceding codeword “a” or the following codeword b1 (b2) (b1 or b2) should be replaced by another codeword in compliance with a predetermined boundary condition given between codewords. The codewords are allocated so that a DC suppression capability of the code stream can be maintained.