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公开(公告)号：US20120320529A1
公开(公告)日：2012-12-20
申请号：US13601206
申请日：2012-08-31
申请人： Sy-Jenq Loong , Donald Lynn Smith
发明人： Sy-Jenq Loong , Donald Lynn Smith
CPC分类号： H05K7/20254 , H01L21/4878 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K7/20927 , H05K2201/09054 , Y10T29/49359 , H01L2924/00
摘要： The current invention comprises a base plate made of at least a first metal and a second metal clad together with a metallurgical bond, where the first and second metals are different metals. The base plate includes an enhanced surface that is entirely contained within the second meta where the enhanced surface comprises fins, pins, or other structures. The tip of the enhanced surface extends above the outer surface of the second metal, and the enhancements are monolithic with the second metal. The base plate can form one component of a cold plate for cooling electronics.
摘要翻译： 本发明包括由至少第一金属制成的基板和与冶金结合在一起的第二金属包层，其中第一和第二金属是不同的金属。 基板包括完全包含在第二间隔元件内的增强表面，其中增强表面包括翅片，销或其它结构。 增强表面的尖端延伸到第二金属的外表面上方，并且增强物与第二金属是整体的。 基板可以形成用于冷却电子设备的冷板的一个部件。
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公开(公告)号：US20110079376A1
公开(公告)日：2011-04-07
申请号：US12573107
申请日：2009-10-03
申请人： Sy-Jenq LOONG , Donald Lynn Smith
发明人： Sy-Jenq LOONG , Donald Lynn Smith
CPC分类号： B23P15/26 , B01D8/00 , B21J5/12 , F28F3/022 , F28F3/048 , H01L21/4878 , H01L23/3677 , H01L23/473 , H01L2924/0002 , H05K7/20254 , Y10T29/4935 , Y10T29/49359 , H01L2924/00
摘要： A cold plate includes an enclosure with an inlet, an outlet, a base and a lid. The inlet and outlet are in fluid communication, so fluid can flow from the inlet though the enclosure to the outlet. The base is formed from a base plate, and the base plate includes an island facing into the enclosure. A plurality of pins extends from the island toward the lid. The pins can have a spiral shape, where the cross sectional profile of the pins change along the length of the pin.
摘要翻译： 冷板包括具有入口，出口，基座和盖子的外壳。 入口和出口处于流体连通状态，因此流体可以通过外壳的入口流到出口。 基座由基板形成，并且基板包括面向外壳的岛状物。 多个销从岛向盖延伸。 销可以具有螺旋形状，其中销的横截面轮廓沿销的长度改变。
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公开(公告)号：US09681580B2
公开(公告)日：2017-06-13
申请号：US13601206
申请日：2012-08-31
申请人： Sy-Jenq Loong , Donald Lynn Smith
发明人： Sy-Jenq Loong , Donald Lynn Smith
IPC分类号： H05K7/20 , H01L23/373 , H01L23/473 , H01L21/48 , H05K1/03 , H05K3/00
CPC分类号： H05K7/20254 , H01L21/4878 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K7/20927 , H05K2201/09054 , Y10T29/49359 , H01L2924/00
摘要： The current invention comprises a base plate made of at least a first metal and a second metal clad together with a metallurgical bond, where the first and second metals are different metals. The base plate includes an enhanced surface that is entirely contained within the second metal, where the enhanced surface comprises fins, pins, or other structures. The tip of the enhanced surface extends above the outer surface of the second metal, and the enhancements are monolithic with the second metal. The base plate can form one component of a cold plate for cooling electronics.
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公开(公告)号：US20120026692A1
公开(公告)日：2012-02-02
申请号：US13191281
申请日：2011-07-26
申请人： Sy-Jenq Loong , Donald Lynn Smith
发明人： Sy-Jenq Loong , Donald Lynn Smith
CPC分类号： H05K13/00 , H01L21/4878 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K7/20254 , Y10T29/49002 , Y10T29/49124 , Y10T83/0341 , H01L2924/00
摘要： A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enhanced surface includes either fins or pins. Electronic components can be connected to the substrate on a surface opposite the cooling metal layer.
摘要翻译： 电子部件用基板包括瓷砖和冷却金属层。 冷却金属层可以包括铜，铝，镍，金或其它金属。 冷却金属层具有背离瓷砖的增强表面，其中增强表面包括翅片或销。 电子部件可以在与冷却金属层相对的表面上连接到基板。
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