公开(公告)号：US20120320529A1

公开(公告)日：2012-12-20

申请号：US13601206

申请日：2012-08-31

申请人： Sy-Jenq Loong ,  Donald Lynn Smith

发明人： Sy-Jenq Loong ,  Donald Lynn Smith

IPC分类号： H05K7/20 ,  B23P15/26 ,  F28F7/00

CPC分类号： H05K7/20254 ,  H01L21/4878 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K7/20927 ,  H05K2201/09054 ,  Y10T29/49359 ,  H01L2924/00

摘要： The current invention comprises a base plate made of at least a first metal and a second metal clad together with a metallurgical bond, where the first and second metals are different metals. The base plate includes an enhanced surface that is entirely contained within the second meta where the enhanced surface comprises fins, pins, or other structures. The tip of the enhanced surface extends above the outer surface of the second metal, and the enhancements are monolithic with the second metal. The base plate can form one component of a cold plate for cooling electronics.

摘要翻译： 本发明包括由至少第一金属制成的基板和与冶金结合在一起的第二金属包层，其中第一和第二金属是不同的金属。 基板包括完全包含在第二间隔元件内的增强表面，其中增强表面包括翅片，销或其它结构。 增强表面的尖端延伸到第二金属的外表面上方，并且增强物与第二金属是整体的。 基板可以形成用于冷却电子设备的冷板的一个部件。

公开(公告)号：US09681580B2

公开(公告)日：2017-06-13

申请号：US13601206

申请日：2012-08-31

申请人： Sy-Jenq Loong ,  Donald Lynn Smith

发明人： Sy-Jenq Loong ,  Donald Lynn Smith

IPC分类号： H05K7/20 ,  H01L23/373 ,  H01L23/473 ,  H01L21/48 ,  H05K1/03 ,  H05K3/00

CPC分类号： H05K7/20254 ,  H01L21/4878 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K7/20927 ,  H05K2201/09054 ,  Y10T29/49359 ,  H01L2924/00

摘要： The current invention comprises a base plate made of at least a first metal and a second metal clad together with a metallurgical bond, where the first and second metals are different metals. The base plate includes an enhanced surface that is entirely contained within the second metal, where the enhanced surface comprises fins, pins, or other structures. The tip of the enhanced surface extends above the outer surface of the second metal, and the enhancements are monolithic with the second metal. The base plate can form one component of a cold plate for cooling electronics.

公开(公告)号：US20120026692A1

公开(公告)日：2012-02-02

申请号：US13191281

申请日：2011-07-26

申请人： Sy-Jenq Loong ,  Donald Lynn Smith

发明人： Sy-Jenq Loong ,  Donald Lynn Smith

IPC分类号： H05K7/20 ,  H05K3/00

CPC分类号： H05K13/00 ,  H01L21/4878 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K7/20254 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T83/0341 ,  H01L2924/00

摘要： A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enhanced surface includes either fins or pins. Electronic components can be connected to the substrate on a surface opposite the cooling metal layer.

摘要翻译： 电子部件用基板包括瓷砖和冷却金属层。 冷却金属层可以包括铜，铝，镍，金或其它金属。 冷却金属层具有背离瓷砖的增强表面，其中增强表面包括翅片或销。 电子部件可以在与冷却金属层相对的表面上连接到基板。

公开(公告)号：US06339047B1

公开(公告)日：2002-01-15

申请号：US09488740

申请日：2000-01-20

申请人： Craig J. Christopherson ,  David M. Olen ,  Deborah L. Ouellette ,  Thomas De Santos ,  Eric R. Podtburg ,  Sy-Jenq Loong

发明人： Craig J. Christopherson ,  David M. Olen ,  Deborah L. Ouellette ,  Thomas De Santos ,  Eric R. Podtburg ,  Sy-Jenq Loong

IPC分类号： B05D512

CPC分类号： H01L39/248 ,  Y10S505/728 ,  Y10S505/82

摘要： Methods of treating superconducting composites to enhance their wettability in solder, and composites having enhanced wettability. It has been found that wettability can be substantially enhanced by stripping a thin layer off the surface of the composite before incorporating it into a laminated component. This layer can be stripped, for example, by chemically etching the composite, for example in a solution of nitric acid and ammonium bifluoride.

摘要翻译： 处理超导复合材料以提高其在焊料中的润湿性的方法，以及具有增强的润湿性的复合材料。 已经发现，通过在将复合材料的表面并入层压部件之前从复合材料的表面剥离薄层，可以显着提高润湿性。 可以例如通过化学蚀刻复合物，例如在硝酸和二氟化铵溶液中来剥离该层。