Crystal device and method for manufacturing crystal device

    公开(公告)号:US11764756B2

    公开(公告)日:2023-09-19

    申请号:US17329788

    申请日:2021-05-25

    CPC classification number: H03H9/24 C09J9/02 H03H3/007

    Abstract: A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.

    CRYSTAL DEVICE AND METHOD FOR MANUFACTURING CRYSTAL DEVICE

    公开(公告)号:US20210384888A1

    公开(公告)日:2021-12-09

    申请号:US17329788

    申请日:2021-05-25

    Abstract: A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.

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