公开(公告)号：US20160248394A1

公开(公告)日：2016-08-25

申请号：US14630946

申请日：2015-02-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yen-Jen CHEN ,  Chi-Feng HUANG ,  Hsiao-Chun LEE ,  Hsieh-Hung HSIEH ,  Tzu-Jin YEH

IPC: H03H1/00 ,  H01L23/66 ,  H01L49/02 ,  H01L23/58 ,  H03H7/01 ,  H03H3/00

CPC classification number: H03H1/00 ,  H01L23/585 ,  H01L23/66 ,  H01L28/10 ,  H01L28/40 ,  H01L2223/6672 ,  H03H3/00 ,  H03H7/0115 ,  H03H2001/0064

Abstract: A semiconductor device comprises a guarded circuit. The semiconductor device also comprises a guard ring surrounding the guarded circuit. The semiconductor device further comprises a resonant circuit coupled with the guard ring. The resonant circuit comprises an input node coupled with the guard ring. The resonant circuit also comprises an inductor. The resonant circuit further comprises a capacitor coupled with the inductor. The resonant circuit additionally comprises a ground node configured to carry a ground voltage. The inductor and the capacitor are coupled between the input node and the ground node.

Abstract translation: 半导体器件包括保护电路。 半导体器件还包括环绕保护电路的保护环。 半导体器件还包括与保护环耦合的谐振电路。 谐振电路包括与保护环耦合的输入节点。 谐振电路还包括电感器。 谐振电路还包括与电感器耦合的电容器。 谐振电路还包括被配置为承载接地电压的接地节点。 电感器和电容器耦合在输入节点和接地节点之间。