公开(公告)号：US20210375862A1

公开(公告)日：2021-12-02

申请号：US17403732

申请日：2021-08-16

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chia-Chung CHEN ,  Chi-Feng HUANG ,  Victor Chiang LIANG ,  Fu-Huan TSAI ,  Hsieh-Hung HSIEH ,  Tzu-Jin YEH ,  Han-Min TSAI ,  Hong-Lin CHU

IPC: H01L27/088 ,  H01L21/8234 ,  H01L29/167 ,  H01L29/10 ,  H01L29/423 ,  H01L29/417 ,  H03D7/14 ,  H01L29/66 ,  H01L29/78

Abstract: A method for manufacturing a semiconductor device includes forming one or more fins extending in a first direction over a substrate. The one or more fins include a first region along the first direction and second regions on both sides of the first region along the first direction. A dopant is implanted in the first region of the fins but not in the second regions. A gate structure overlies the first region of the fins and source/drains are formed on the second regions of the fins.

公开(公告)号：US20210167728A1

公开(公告)日：2021-06-03

申请号：US17173743

申请日：2021-02-11

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chi-Hsien LIN ,  Ho-Hsiang CHEN ,  Hsien-Yuan LIAO ,  Tzu-Jin YEH ,  Ying-Ta LU

IPC: H03B5/12

Abstract: A band-pass filter (BPF) includes a pair of coupled transformers including first through fourth conductive structures. The first conductive structure includes a first terminal and two first extending portions extending from the first terminal and configured as primary windings. The second conductive structure includes a second terminal and two second extending portions extending from the second terminal. A first via connects the third conductive structure to a first one of the two second extending portions, the third conductive structure and the first one of the two second extending portions thereby being configured as a first secondary winding. A second via connects the fourth conductive structure to a second one of the two second extending portions, the fourth conductive structure and the second one of the two second extending portions thereby being configured as a second secondary winding.

公开(公告)号：US20190103354A1

公开(公告)日：2019-04-04

申请号：US16207041

申请日：2018-11-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chiao-Han LEE ,  Hsien-Yuan LIAO ,  Ying-Ta LU ,  Chi-Hsien LIN ,  Ho-Hsiang CHEN ,  Tzu-Jin YEH

IPC: H01L23/522 ,  H01L23/528 ,  H01L23/00 ,  H01L49/02 ,  H01L23/58 ,  H01L23/64

Abstract: An integrated circuit includes an inductor over a substrate and a guard ring surrounding the inductor. The guard ring includes a first staggered line, a first metal line extending in a first direction and a second metal line extending in a second direction different from the first direction. The first staggered line has a first end coupled to the first metal line, and a second end coupled to the second metal line. The first staggered line includes a first set of vias, a first set of metal lines in a first metal layer and a second set of metal lines in a second metal layer different from the first metal layer. The first set of vias coupling the first set of metal lines with the second of second metal lines.

公开(公告)号：US20150364417A1

公开(公告)日：2015-12-17

申请号：US14303206

申请日：2014-06-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chiao-Han LEE ,  Hsien-Yuan LIAO ,  Ying-Ta LU ,  Chi-Hsien LIN ,  Ho-Hsiang CHEN ,  Tzu-Jin YEH

IPC: H01L23/522 ,  H01L23/64 ,  H01L23/58 ,  H01L49/02

CPC classification number: H01L23/5227 ,  H01L23/528 ,  H01L23/5286 ,  H01L23/562 ,  H01L23/585 ,  H01L23/645 ,  H01L28/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit comprises an inductor over a substrate and a guard ring surrounding the inductor. The guard ring comprises a plurality of first metal lines extending in a first direction and a plurality of second metal lines extending in a second direction. The second metal lines of the plurality of second metal lines are each coupled with at least one first metal line of the plurality of first metal lines. The guard ring also comprises a staggered line comprising a connected subset of at least one first metal line of the plurality of first metal lines and at least one second metal line of the plurality of second metal lines. The first metal lines of the plurality of first metal lines outside of the connected subset, the second metal lines of the plurality of second metal lines outside of the connected subset, and the staggered line surround the inductor.

Abstract translation: 集成电路包括衬底上的电感器和围绕电感器的保护环。 保护环包括沿第一方向延伸的多个第一金属线和沿第二方向延伸的多个第二金属线。 多个第二金属线中的第二金属线分别与多个第一金属线中的至少一个第一金属线耦合。 保护环还包括交错线，其包括多个第一金属线中的至少一个第一金属线和多个第二金属线中的至少一个第二金属线的连接子集。 连接子集外部的多个第一金属线中的第一金属线，连接子集外部的多个第二金属线中的第二金属线，以及交错线围绕电感器。

公开(公告)号：US20230375614A1

公开(公告)日：2023-11-23

申请号：US18363143

申请日：2023-08-01

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Hsieh-Hung HSIEH ,  Yen-Jen CHEN ,  Tzu-Jin YEH

IPC: G01R31/28

CPC classification number: G01R31/2884 ,  G01R31/2879 ,  G01R31/2853

Abstract: An IC includes a device-under-test (DUT) configured to receive a first AC signal at a first node and output a second AC signal at a second node, the second AC signal being based on the first AC signal, and first and second detection circuits. Each of the first and second detection circuits includes a first gain stage coupled to a corresponding one of the first or second nodes through a first capacitive device, a second gain stage in a cascade arrangement with the first gain stage, and a low-pass filter configured to generate a DC signal based on an output signal of the second gain stage.

公开(公告)号：US20230160954A1

公开(公告)日：2023-05-25

申请号：US18151959

申请日：2023-01-09

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Hsieh-Hung HSIEH ,  Yen-Jen CHEN ,  Tzu-Jin YEH

IPC: G01R31/28

CPC classification number: G01R31/2884 ,  G01R31/2879 ,  G01R31/2853

Abstract: An IC includes a plurality of pads at a top surface of a semiconductor wafer, an amplifier configured to receive a first AC signal at an input terminal, and output a second AC signal at an output terminal, a first detection circuit coupled to the input terminal and configured to output a first DC voltage to a first pad of the plurality of pads responsive to the first AC signal, and a second detection circuit coupled to the output terminal and configured to output a second DC voltage to a second pad of the plurality of pads responsive to the second AC signal.

公开(公告)号：US20210341535A1

公开(公告)日：2021-11-04

申请号：US17376338

申请日：2021-07-15

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Hsieh-Hung HSIEH ,  Yen-Jen CHEN ,  Tzu-Jin YEH

IPC: G01R31/28

Abstract: A test circuit includes an oscillator configured to generate an oscillation signal, a device-under-test (DUT) configured to output an AC signal based on the oscillation signal, a first detection circuit configured to generate a first DC voltage having a first value based on the oscillation signal, and a second detection circuit configured to generate a second DC voltage having a second value based on the AC signal.

公开(公告)号：US20160248394A1

公开(公告)日：2016-08-25

申请号：US14630946

申请日：2015-02-25

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yen-Jen CHEN ,  Chi-Feng HUANG ,  Hsiao-Chun LEE ,  Hsieh-Hung HSIEH ,  Tzu-Jin YEH

IPC: H03H1/00 ,  H01L23/66 ,  H01L49/02 ,  H01L23/58 ,  H03H7/01 ,  H03H3/00

CPC classification number: H03H1/00 ,  H01L23/585 ,  H01L23/66 ,  H01L28/10 ,  H01L28/40 ,  H01L2223/6672 ,  H03H3/00 ,  H03H7/0115 ,  H03H2001/0064

Abstract: A semiconductor device comprises a guarded circuit. The semiconductor device also comprises a guard ring surrounding the guarded circuit. The semiconductor device further comprises a resonant circuit coupled with the guard ring. The resonant circuit comprises an input node coupled with the guard ring. The resonant circuit also comprises an inductor. The resonant circuit further comprises a capacitor coupled with the inductor. The resonant circuit additionally comprises a ground node configured to carry a ground voltage. The inductor and the capacitor are coupled between the input node and the ground node.

Abstract translation: 半导体器件包括保护电路。 半导体器件还包括环绕保护电路的保护环。 半导体器件还包括与保护环耦合的谐振电路。 谐振电路包括与保护环耦合的输入节点。 谐振电路还包括电感器。 谐振电路还包括与电感器耦合的电容器。 谐振电路还包括被配置为承载接地电压的接地节点。 电感器和电容器耦合在输入节点和接地节点之间。

公开(公告)号：US20240088027A1

公开(公告)日：2024-03-14

申请号：US18508766

申请日：2023-11-14

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chiao-Han LEE ,  Chi-Hsien LIN ,  Ho-Hsiang CHEN ,  Hsien-Yuan LIAO ,  Tzu-Jin YEH ,  Ying-Ta LU

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/528 ,  H01L23/58 ,  H01L23/64

CPC classification number: H01L23/5227 ,  H01L23/528 ,  H01L23/5286 ,  H01L23/562 ,  H01L23/585 ,  H01L23/645 ,  H01L28/10 ,  H01L2924/0002

Abstract: An integrated circuit includes an inductor that includes a first set of conductors in at least a first metal layer, and a guard ring enclosing the inductor. The guard ring includes a first conductor extending in a first direction, a second conductor extending in a second direction, and a first set of staggered conductors coupled to a first end of the first conductor and a first end of the second conductor. The first set of staggered conductors includes a second set of conductors in a second metal layer, a third set of conductors in a third metal layer and a first set of vias coupling the second set of conductors with the third set of conductors. The third metal layer is above the second metal layer. All metal lines in the second metal layer that are part of the guard ring extend in the first direction.

公开(公告)号：US20230378910A1

公开(公告)日：2023-11-23

申请号：US18362925

申请日：2023-07-31

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chi-Hsien LIN ,  Ho-Hsiang CHEN ,  Hsien-Yuan LIAO ,  Tzu-Jin YEH ,  Ying-Ta LU

IPC: H03B5/12 ,  H03B1/04 ,  H03H7/01

CPC classification number: H03B5/1228 ,  H03B5/1212 ,  H03B5/1296 ,  H03B5/1203 ,  H03B5/1243 ,  H03B1/04 ,  H03H7/0161 ,  H03B5/1206 ,  H03B2200/009

Abstract: A band-pass filter (BPF) includes first and second windings. The first winding includes first and second terminals, a first outer extending portion extending from the first terminal, a second outer extending portion extending from the second terminal, and a first conductive structure configured to electrically connect the first and second outer extending portions to each other at a location opposite the first and second terminals. The second winding includes third and fourth terminals positioned between the first and second terminals, and a second conductive structure electrically connected to the third and fourth terminals and extending between the first conductive structure and each of the first and second outer extending portions.