公开(公告)号：US20240395582A1

公开(公告)日：2024-11-28

申请号：US18790236

申请日：2024-07-31

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Tzu-Yang LIN ,  Cheng-Han WU ,  Chen-Yu LIU ,  Kuo-Shu TSENG ,  Shang-Sheng LI ,  Chen Yi HSU ,  Yu-Cheng CHANG

IPC: H01L21/67

Abstract: A method of controlling a feedback control system of a semiconductor process chemical fluid in a storage tank includes performing a fluid quality measurement of fluid by a spectrum analyzer positioned adjacent to a dispensing port of the storage tank, and determining whether a variation in fluid quality measurement of the fluid is within an acceptable range. The method further includes in response to a variation in fluid quality measurement that is not within the acceptable range of variation in fluid quality measurement, automatically adjusting a configurable parameter of the semiconductor process chemical fluid in the storage tank to set the variation in fluid quality measurement of the fluid within the acceptable range.

公开(公告)号：US20240359194A1

公开(公告)日：2024-10-31

申请号：US18769077

申请日：2024-07-10

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Channing CHAN ,  Kuo-Shu TSENG ,  Chun-Chih LIN

IPC: B05B1/18 ,  B05B1/30 ,  B05B13/04 ,  B08B3/02 ,  B08B3/08 ,  B08B3/10 ,  H01L21/67

CPC classification number: B05B1/185 ,  B05B1/30 ,  B05B13/0431 ,  B08B3/024 ,  B08B3/08 ,  H01L21/67023 ,  H01L21/67051 ,  H01L21/6708 ,  B08B3/10

Abstract: A system for dispensing a liquid includes a conduit, the conduit being configured to convey the liquid; a dispensing tip fluidically coupled to the conduit; and a movable arm, the movable arm being configured to change a position of the dispensing tip relative to a workpiece to which the liquid is dispensed. The dispensing tip includes a first section having a liquid-containing wall and a septum, the septum divides the first section into at least a first liquid passage and a second liquid passage, and the septum is disposed to contact the liquid in each of the at least first liquid passage and second liquid passage during dispensing of the liquid to the workpiece.

公开(公告)号：US20230264208A1

公开(公告)日：2023-08-24

申请号：US18308157

申请日：2023-04-27

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Channing CHAN ,  Kuo-Shu TSENG ,  Chun-Chih LIN

IPC: B05B1/18 ,  H01L21/67 ,  B05B1/30 ,  B08B3/02 ,  B05B13/04 ,  B08B3/08

CPC classification number: B05B1/185 ,  H01L21/67023 ,  B05B1/30 ,  B08B3/024 ,  B05B13/0431 ,  B08B3/08 ,  H01L21/6708 ,  H01L21/67051 ,  B08B3/10

Abstract: A nozzle assembly for use in liquid-dispensing system, the nozzle assembly includes a pipe having lumens; a body, an end of the pipe being mounted to the body; the pipe having a wall and a septum, the wall enclosing a space, the septum dividing the space enclosed by the wall into the lumens; each of the lumens being correspondingly terminated in an orifice such that a liquid is escapable from each lumen through the corresponding orifice and is thereby dispensable from the nozzle assembly.

公开(公告)号：US20210086207A1

公开(公告)日：2021-03-25

申请号：US17115265

申请日：2020-12-08

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Channing CHAN ,  Kuo-Shu TSENG ,  Chun-Chih LIN

IPC: B05B1/18 ,  H01L21/67 ,  B05B1/30 ,  B08B3/02 ,  B05B13/04 ,  B08B3/08

Abstract: A nozzle assembly for use in liquid-dispensing system, the nozzle assembly including: a body configured to receive a pipe; and the pipe, an end of the pipe being mounted on the body. The pipe includes multiple lumens correspondingly terminated in multiple orifices such that a liquid is escapable from each lumen through the corresponding orifice and is thereby dispensable from the nozzle assembly. The pipe has a first flow-capacity to supply a first volume of the liquid at a first flow-rate and at a first pressure. Each orifice and corresponding lumen has a second flow-capacity to supply a second volume of the liquid at a second flow-rate and at a second pressure.

公开(公告)号：US20180369836A1

公开(公告)日：2018-12-27

申请号：US15904903

申请日：2018-02-26

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Channing CHAN ,  Chun-Chih LIN ,  Kuo-Shu TSENG

IPC: B05B1/18 ,  H01L21/67 ,  B05B1/30 ,  B08B3/08 ,  B08B3/02 ,  B05B13/04

Abstract: A nozzle assembly for use in liquid-dispensing system, the nozzle assembly including: a body configured to receive a pipe; and the pipe, an end of the pipe being mounted on the body. The pipe includes multiple lumens correspondingly terminated in multiple orifices such that a liquid is escapable from each lumen through the corresponding orifice and is thereby dispensable from the nozzle assembly. The pipe has a first flow-capacity to supply a first volume of the liquid at a first flow-rate and at a first pressure. Each orifice and corresponding lumen has a second flow-capacity to supply a second volume of the liquid at a second flow-rate and at a second pressure.

公开(公告)号：US20240371667A1

公开(公告)日：2024-11-07

申请号：US18775431

申请日：2024-07-17

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Kuo-Shu TSENG ,  Yao-Yuan SHANG ,  You-Feng CHEN

IPC: H01L21/67 ,  B08B1/00 ,  H01L21/02

Abstract: A wafer cleaning system is provided, including pins configured to support a wafer; a brush element including a brush holder movable relative to the wafer, and a brush head configured to rotate on the brush holder; a control device configured to control the brush element; an inspection device configured to inspect the backside of the wafer and generate an inspection signal; and a process module configured to generate a control signal according to the inspection signal, wherein the control signal includes movement information of the brush element according to coordinates of the contaminants obtained from the inspection signal, wherein control device is configured to control the brush element to clean the backside of the wafer along a first path according to the control signal when the wafer is disposed on the pins.

公开(公告)号：US20230360938A1

公开(公告)日：2023-11-09

申请号：US18351566

申请日：2023-07-13

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Kuo-Shu TSENG ,  Yao-Yuan SHANG ,  You-Feng CHEN

IPC: H01L21/67

CPC classification number: H01L21/67253 ,  H01L21/67046 ,  H01L21/0209

Abstract: A wafer cleaning method for cleaning contaminants on a wafer is provided, wherein the backside of the wafer has a clear area and an unclear area, and the contaminants are located in the unclear area. The wafer cleaning method includes inspecting the backside of the wafer and generating an inspection signal by an inspection device. The wafer cleaning method includes generating a control signal according to the inspection signal by a process module, wherein the control signal includes movement information of a brush element according to coordinates of the contaminants obtained from the inspection signal. The wafer cleaning method includes controlling the brush element to clean the contaminants on the backside of the wafer according to the control signal by a control device along a predetermined path.