公开(公告)号：US09984964B2

公开(公告)日：2018-05-29

申请号：US15681874

申请日：2017-08-21

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wei-Cheng Lin ,  Charles Chew-Yuen Young ,  Jiann-Tyng Tzeng ,  Praneeth Narayanasetti

IPC分类号： H01L23/52 ,  H01L21/4763 ,  H01L21/44 ,  H01L23/522 ,  H01L23/532 ,  H01L23/528 ,  H01L21/768 ,  H01L23/485

CPC分类号： H01L23/5226 ,  H01L21/76802 ,  H01L21/76879 ,  H01L21/76895 ,  H01L23/485 ,  H01L23/5222 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/5328 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit includes a first conductive line on a first metal level of the integrated circuit. The integrated circuit further includes a second conductive line on a second metal level of the integrated circuit. The integrated circuit further includes a slot via electrically connecting the first conductive line with the second conductive line. The slot via overlaps with the first conductive line and the second conductive line. The slot via extends beyond a periphery of at least one of the first conductive line or the second conductive line.

公开(公告)号：US09741654B2

公开(公告)日：2017-08-22

申请号：US15332605

申请日：2016-10-24

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wei-Cheng Lin ,  Jiann-Tyng Tzeng ,  Praneeth Narayanasetti ,  Charles Chew-Yuen Young

IPC分类号： H01L23/52 ,  H01L29/40 ,  H01L21/4763 ,  H01L21/44 ,  H01L23/522 ,  H01L21/768 ,  H01L23/485 ,  H01L23/528 ,  H01L23/532

CPC分类号： H01L23/5226 ,  H01L21/76802 ,  H01L21/76879 ,  H01L21/76895 ,  H01L23/485 ,  H01L23/5222 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/5328 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit includes a first conductive line on a first metal level of the integrated circuit. The integrated circuit further includes a second conductive line on a second metal level of the integrated circuit. The integrated circuit further includes a slot via electrically connecting the first conductive line with the second conductive line. The slot via overlaps with the first conductive line and the second conductive line. The slot via extends beyond a periphery of at least one of the first conductive line or the second conductive line.

公开(公告)号：US09478492B2

公开(公告)日：2016-10-25

申请号：US14600695

申请日：2015-01-20

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Wei-Cheng Lin ,  Jiann-Tyng Tzeng ,  Praneeth Narayanasetti ,  Charles Chew-Yuen Young

IPC分类号： H01L23/52 ,  H01L29/40 ,  H01L21/4763 ,  H01L21/44 ,  H01L23/522 ,  H01L21/768

CPC分类号： H01L23/5226 ,  H01L21/76802 ,  H01L21/76879 ,  H01L21/76895 ,  H01L23/485 ,  H01L23/5222 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/5328 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit includes a first conductive line on a first metal level of the integrated circuit. The integrated circuit further includes a second conductive line on a second metal level of the integrated circuit. The integrated circuit further includes a slot via electrically connecting the first conductive line with the second conductive line. The slot via overlaps with the first conductive line and the second conductive line. The slot via extends beyond a periphery of at least one of the first conductive line or the second conductive line.

摘要翻译： 集成电路包括集成电路的第一金属层上的第一导线。 集成电路还包括在集成电路的第二金属电平上的第二导线。 集成电路还包括通过电连接第一导线与第二导线的槽。 槽通道与第一导线和第二导线重叠。 狭槽通孔延伸超过第一导电线或第二导线中的至少一个的周边。