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公开(公告)号：US20200094216A1
公开(公告)日：2020-03-26
申请号：US16685185
申请日：2019-11-15
Inventor： Tung-Tsun CHEN , Yi-Shao LIU , Jui-Cheng HUANG , Chin-Hua WEN , Felix Ying-Kit TSUI , Yung-Chow PENG
IPC: B01J19/00
Abstract: An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing circuits. Each sensing circuit is between two adjacent rows of the rows of heating elements and between two adjacent columns of the columns of heating elements, in a same silicon layer as the rows of heating elements and the columns of heating elements, and configured to generate a bio-sensing signal and a temperature-sensing signal.
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公开(公告)号：US20200078761A1
公开(公告)日：2020-03-12
申请号：US16684811
申请日：2019-11-15
Inventor： Tung-Tsun CHEN , Yi-Shao LIU , Jui-Cheng HUANG , Chin-Hua WEN , Felix Ying-Kit TSUI , Yung-Chow PENG
IPC: B01J19/00
Abstract: An integrated circuit includes an interconnection structure, first and second sensing pixels over the interconnection structure, and an isolation layer over the first and second sensing pixels. Each of the first and second sensing pixels includes a bio-sensing device, a temperature-sensing device, one or more heating elements adjacent to the bio-sensing device and the temperature-sensing device, and a sensing film over the bio-sensing device. The isolation layer includes a first opening configured to expose the sensing film of the first sensing pixel without exposing the sensing film of the second sensing pixel and a second opening configured to expose the sensing film of the second sensing pixel without exposing the sensing film of the first sensing pixel.
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公开(公告)号：US20200078760A1
公开(公告)日：2020-03-12
申请号：US16684715
申请日：2019-11-15
Inventor： Tung-Tsun CHEN , Yi-Shao LIU , Jui-Cheng HUANG , Chin-Hua WEN , Felix Ying-Kit TSUI , Yung-Chow PENG
IPC: B01J19/00
Abstract: An integrated circuit includes a plurality of sensing pixels, each sensing pixel including a sensing film portion, a bio-sensing device configured to generate a first signal responsive to an electrical characteristic of the sensing film portion, a first switching device coupled between the bio-sensing device and a first signal path, a temperature-sensing device configured to generate a second signal responsive to a temperature of the sensing film portion, and a second switching device coupled between the temperature-sensing device and a second signal path.
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公开(公告)号：US20200094215A1
公开(公告)日：2020-03-26
申请号：US16685069
申请日：2019-11-15
Inventor： Tung-Tsun CHEN , Yi-Shao LIU , Jui-Cheng HUANG , Chin-Hua WEN , Felix Ying-Kit TSUI , Yung-Chow PENG
IPC: B01J19/00
Abstract: An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing areas. Each sensing area is between two adjacent rows of the rows of heating elements and between two adjacent columns of the columns of heating elements and includes a bio-sensing device and a temperature-sensing device.
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公开(公告)号：US20170059515A1
公开(公告)日：2017-03-02
申请号：US15350399
申请日：2016-11-14
Inventor： Yi-Shao LIU , Fei-Lung LAI , Chun-Ren CHENG , Chun-Wen CHENG
IPC: G01N27/414 , G01N27/327 , B01L9/00 , G01N33/543 , B01L3/00
CPC classification number: G01N27/4145 , B01L3/502707 , B01L9/527 , B01L2200/025 , B01L2200/027 , B01L2200/10 , B01L2200/143 , B01L2300/0645 , G01N21/75 , G01N27/3271 , G01N27/3275 , G01N33/5438 , Y10T29/49
Abstract: A method for testing a partially fabricated bio-sensor device wafer includes aligning the partially fabricated bio-sensor device wafer on a wafer stage of a wafer-level bio-sensor processing tool. The method further includes mounting an integrated electro-microfluidic probe card to a device area on the partially fabricated bio-sensor device wafer, wherein the electro-microfluidic probe card has a first major surface. The method further includes electrically connecting one or more electronic probe tips disposed on the first major surface of the integrated electro-microfluidic probe card to conductive areas of the device area. The method further includes flowing a test fluid from a fluid supply to the integrated electro-microfluidic probe card. The method further includes electrically measuring via the one or more electronic probe tips a first electrical property of one or more bio-FETs of the device area based on the test fluid flow.
Abstract translation: 用于测试部分制造的生物传感器装置晶片的方法包括将部分制造的生物传感器装置晶片对准晶片级生物传感器处理工具的晶片台上。 该方法还包括将集成电微流体探针卡安装到部分制造的生物传感器装置晶片上的装置区域，其中电微流体探针卡具有第一主表面。 该方法还包括将设置在集成电微流体探针卡的第一主表面上的一个或多个电子探针尖端电连接到装置区域的导电区域。 该方法还包括将测试流体从流体供应流动到集成电微流体探针卡。 该方法还包括经由一个或多个电子探针尖端基于测试流体流量对装置区域的一个或多个生物FET进行电测量。
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Patent Agency Ranking
公开(公告)号：US20150024533A1
公开(公告)日：2015-01-22
申请号：US14508194
申请日：2014-10-07
Inventor： Yi-Hsien CHANG , Chun-Ren CHENG , Yi-Shao LIU , Allen Timothy CHANG , Ching-Ray CHEN , Yeh-Tseng LI , Wen-Hsiang LIN
IPC: B81C1/00
CPC classification number: B81C1/00349 , B81B2201/042 , B81C1/00111 , B81C1/00206 , B81C1/00214 , B82Y20/00 , G01N27/44791
Abstract: A method of forming a semiconductor device includes depositing a light reflecting layer over a substrate. The method also includes forming a protection layer over the light reflecting layer. The method further includes forming an anti-reflective coating (ARC) layer over the protection layer. The method additionally includes forming an opening in the ARC layer, the protection layer and the light reflecting layer exposing the substrate. The method also includes removing the ARC layer in a wet solution comprising H2O2, the ARC layer being exposed to the H2O2 at a flow rate greater than about 10 standard cubic centimeters per minute (sccm).
Abstract translation: 形成半导体器件的方法包括在衬底上沉积光反射层。 该方法还包括在光反射层上形成保护层。 该方法还包括在保护层上形成抗反射涂层（ARC）层。 该方法还包括在ARC层中形成开口，保护层和曝光衬底的光反射层。 该方法还包括在包含H 2 O 2的湿溶液中去除ARC层，ARC层以大于约10标准立方厘米每分钟（sccm）的流速暴露于H 2 O 2。
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公开(公告)号：US20220387959A1
公开(公告)日：2022-12-08
申请号：US17885204
申请日：2022-08-10
Inventor： Tung-Tsun CHEN , Yi-Shao LIU , Jui-Cheng HUANG , Chin-Hua WEN , Felix Ying-Kit TSUI , Yung-Chow PENG
IPC: B01J19/00
Abstract: A method of operating an integrated circuit includes using a first switching device to couple a bio-sensing device to a first signal path, generating, using the bio-sensing device, a bio-sensing signal on the first signal path in response to an electrical characteristic of a sensing film, using a second switching device to couple a temperature-sensing device to a second signal path, and generating, using the temperature-sensing device, a temperature-sensing signal on the second signal path in response to a temperature of the sensing film. The first and second switching devices, the bio-sensing device, the temperature-sensing device, and the sensing film are components of a sensing pixel of a plurality of sensing pixels of the integrated circuit.
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8.发明申请SURFACE MODIFICATION, FUNCTIONALIZATION AND INTEGRATION OF MICROFLUIDICS AND BIOSENSOR TO FORM A BIOCHIP 有权微生物和生物传感器的表面改性，功能化和整合形成生物技术公开(公告)号：US20140272719A1
公开(公告)日：2014-09-18
申请号：US13838905
申请日：2013-03-15
Inventor： Yi-Shao LIU , Chun-Wen CHENG , Chun-Ren CHENG
IPC: G03F7/20
CPC classification number: G01N27/4145 , B01L3/502707 , B01L3/502715 , B01L2200/12 , B01L2300/0636 , B01L2300/0645 , B01L2300/0819 , B01L2300/0887 , G01N33/54373 , G03F7/0035 , G03F7/20
Abstract: The present disclosure provides methods of fabricating a biochip. The biochip includes a fluidic part, having through-substrate holes as inlets and outlets, and a sensing part bonded together using a bonding material. One or both of the parts has microfluidic channel patterns and one or more patterned surface modification layers formed using different methods to provide surface property for binding bioreceptors and for flowing analytes. The patterning includes lithography, etching, washing, selective depositing using printing or self-assembly of surface chemistry.
Abstract translation: 本公开提供了制造生物芯片的方法。 生物芯片包括具有通孔作为入口和出口的流体部分，以及使用接合材料粘合在一起的感测部件。 一个或两个部件具有微流体通道图案和使用不同方法形成的一个或多个图案化表面改性层，以提供用于结合生物受体和流动分析物的表面性质。 图案化包括光刻，蚀刻，洗涤，使用印刷或表面化学自组装的选择性沉积。
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公开(公告)号：US20230375501A1
公开(公告)日：2023-11-23
申请号：US18362954
申请日：2023-07-31
Inventor： Yi-Shao LIU , Chun-Ren CHENG , Chun-Wen CHENG
IPC: G01N27/414 , G03F7/20 , G03F7/00 , B01L3/00 , G01N33/543
CPC classification number: G01N27/4145 , G03F7/20 , G03F7/0035 , B01L3/502715 , G01N33/54373 , B01L3/502707 , B01L2200/12 , B01L2300/0636 , B01L2300/0645 , B01L2300/0819 , B01L2300/0887
Abstract: A method of making a biochip includes forming an opening extending completely through a fluidic substrate. Forming the opening includes defining a plurality of sidewalls on the fluidic substrate, wherein the plurality of sidewalls defines a channel in fluid communication with the opening, and each of the plurality of sidewalls comprises polydimethylsiloxane (PDMS). The method further includes coating a surface of the fluidic substrate with a silicon oxide coating wherein, the silicon oxide coating is between adjacent sidewalls of the plurality of sidewalls. The method further includes bonding the fluidic substrate to a detection substrate.
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公开(公告)号：US20200025713A1
公开(公告)日：2020-01-23
申请号：US16588088
申请日：2019-09-30
Inventor： Yi-Shao LIU , Fei-Lung LAI , Chun-Ren CHENG , Chun-Wen CHENG
IPC: G01N27/414 , G01N21/75 , G01N33/543 , B01L3/00 , B01L9/00 , G01N27/327
Abstract: A method includes mounting an integrated electro-microfluidic probe card to a device area on a bio-sensor device wafer, wherein the electro-microfluidic probe card has a first major surface and a second major surface opposite the first major surface. The method further includes electrically connecting at least one electronic probe tip extending from the first major surface to a corresponding conductive area of the device area. The method further includes stamping a test fluid onto the device area. The method further includes measuring via the at least one electronic probe tip a first electrical property of one or more bio-FETs of the device area based on the test fluid.
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