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公开(公告)号：US12125754B2
公开(公告)日：2024-10-22
申请号：US17894584
申请日：2022-08-24
Applicant: TDK CORPORATION
Inventor： Kazutoshi Tsuyutani , Yoshihiro Suzuki , Akira Motohashi
CPC classification number: H01L23/13 , G01H3/00 , G01K13/02 , G01L9/0041 , G01N33/0027 , H01L23/5389 , H01L25/18
Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.
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公开(公告)号：US11462447B2
公开(公告)日：2022-10-04
申请号：US16550995
申请日：2019-08-26
Applicant: TDK CORPORATION
Inventor： Kazutoshi Tsuyutani , Yoshihiro Suzuki , Akira Motohashi
IPC: H01L23/13 , H01L25/18 , H01L23/538 , G01L9/00 , G01H3/00 , G01K13/02 , G01N33/00 , G01K13/024
Abstract: A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.
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