公开(公告)号：US20180315545A1

公开(公告)日：2018-11-01

申请号：US15940301

申请日：2018-03-29

Applicant: TDK CORPORATION

Inventor： Shohei KUSUMOTO ,  Noriaki OOTSUKA ,  Minoru ABE ,  Yoshinori SATO

IPC: H01F27/36 ,  H01F27/40 ,  H01F27/28 ,  H01G4/30 ,  H01G4/228

CPC classification number: H01F27/36 ,  H01F17/0013 ,  H01F27/28 ,  H01F27/292 ,  H01F27/362 ,  H01F27/40 ,  H01F2017/008 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H03H1/00

Abstract: A multilayer electronic component includes: a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; a plurality of terminals integrated with the multilayer stack; and a shield formed of a conductor and integrated with the multilayer stack. The multilayer stack has a top surface, a bottom surface, and four side surfaces connecting the top surface and the bottom surface. The plurality of terminals are provided on the bottom surface of the multilayer stack. The shield entirely covers the top surface and the four side surfaces of the multilayer stack. The shield includes a portion that is thicker than the other portions of the shield.