公开(公告)号：US20180315545A1

公开(公告)日：2018-11-01

申请号：US15940301

申请日：2018-03-29

Applicant: TDK CORPORATION

Inventor： Shohei KUSUMOTO ,  Noriaki OOTSUKA ,  Minoru ABE ,  Yoshinori SATO

IPC: H01F27/36 ,  H01F27/40 ,  H01F27/28 ,  H01G4/30 ,  H01G4/228

CPC classification number: H01F27/36 ,  H01F17/0013 ,  H01F27/28 ,  H01F27/292 ,  H01F27/362 ,  H01F27/40 ,  H01F2017/008 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H03H1/00

Abstract: A multilayer electronic component includes: a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; a plurality of terminals integrated with the multilayer stack; and a shield formed of a conductor and integrated with the multilayer stack. The multilayer stack has a top surface, a bottom surface, and four side surfaces connecting the top surface and the bottom surface. The plurality of terminals are provided on the bottom surface of the multilayer stack. The shield entirely covers the top surface and the four side surfaces of the multilayer stack. The shield includes a portion that is thicker than the other portions of the shield.

公开(公告)号：US20160352303A1

公开(公告)日：2016-12-01

申请号：US15082513

申请日：2016-03-28

Applicant: TDK CORPORATION

Inventor： Masanori TSUTSUMI ,  Kazuhiro TSUKAMOTO ,  Manabu KITAMI ,  Toshiyuki TAKAMI ,  Shohei KUSUMOTO ,  Noriyuki HIRABAYASHI

IPC: H03H7/42

CPC classification number: H03H7/42

Abstract: A multilayer electronic component includes a stack and a balun. The stack includes a plurality of stacked dielectric layers and conductor layers. The balun is formed using the stack. The balun includes an unbalanced transmission line and first to fourth balanced transmission lines. The unbalanced transmission line includes a first line portion and a second line portion connected in series. The first and second balanced transmission lines are configured to be electromagnetically coupled to the first line portion. The third and fourth balanced transmission lines are configured to be electromagnetically coupled to the second line portion.

Abstract translation: 多层电子部件包括堆叠和​​平衡 - 不平衡转换器。 堆叠包括多个堆叠的电介质层和导体层。 平衡 - 不平衡变换器使用堆叠形成。 平衡 - 不平衡转换器包括不平衡传输线和第一至第四平衡传输线。 不平衡传输线包括串联连接的第一线部分和第二线部分。 第一和第二平衡传输线被配置为与第一线路部分电磁耦合。 第三和第四平衡传输线被配置为与第二线路部分电磁耦合。