公开(公告)号：US11594379B2

公开(公告)日：2023-02-28

申请号：US17494538

申请日：2021-10-05

Applicant: TDK CORPORATION

Inventor： Akihiro Masuda ,  Shinya Ito ,  Norihisa Ando ,  Tomoyuki Sasaki ,  Shinya Onodera

IPC: H01G4/38 ,  H01G4/224 ,  H01G4/30 ,  H01G2/08 ,  H01G2/06 ,  H01G4/12

Abstract: An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.

公开(公告)号：US11289271B2

公开(公告)日：2022-03-29

申请号：US16986588

申请日：2020-08-06

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Takehisa Tamura ,  Shinya Onodera ,  Ken Morita ,  Atsushi Takeda

IPC: H01G4/008 ,  H01G4/30 ,  H01G4/232

Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.

公开(公告)号：US10763042B2

公开(公告)日：2020-09-01

申请号：US16166493

申请日：2018-10-22

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Takehisa Tamura ,  Atsushi Takeda ,  Ken Morita

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30 ,  H01G4/252 ,  H01L41/047 ,  H01G2/06 ,  H01G4/12 ,  H01G4/248 ,  H01F27/29 ,  H01C7/00 ,  H01F17/00 ,  H01C7/18 ,  H01C1/148

Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. A first length of the element body in the first direction is different from a second length of the element body in the second direction. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces.

公开(公告)号：US12142438B2

公开(公告)日：2024-11-12

申请号：US18230222

申请日：2023-08-04

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Koki Ito ,  Hideki Kaneko

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

公开(公告)号：US11264172B2

公开(公告)日：2022-03-01

申请号：US16097175

申请日：2017-09-20

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Koki Ito ,  Hideki Kaneko

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

公开(公告)号：US11217391B2

公开(公告)日：2022-01-04

申请号：US16819779

申请日：2020-03-16

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Atsushi Takeda ,  Takehisa Tamura ,  Shinya Onodera

IPC: H01G4/005 ,  H01G4/30 ,  H01G4/12 ,  H05K3/34 ,  H01G4/232

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.

公开(公告)号：US10964479B2

公开(公告)日：2021-03-30

申请号：US16724441

申请日：2019-12-23

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Takehisa Tamura ,  Atsushi Takeda ,  Yuichi Nagai

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  H01G4/008 ,  H01G4/12

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer, a conductive resin layer disposed on the sintered metal layer, and a solder plating layer arranged to constitute an outermost layer of the external electrode. A space exists in the conductive resin layer or between the conductive resin layer and the sintered metal layer. A first maximum length of the space in a thickness direction of the conductive resin layer is shorter than a second maximum length of the space in a direction orthogonal to the thickness direction of the conductive resin layer.

公开(公告)号：US10755859B2

公开(公告)日：2020-08-25

申请号：US16189618

申请日：2018-11-13

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Takehisa Tamura ,  Ken Morita ,  Atsushi Takeda

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/008 ,  H01G4/005

Abstract: An element body of a rectangular parallelepiped shape includes a pair of principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed on an end portion of the element body in the third direction. When viewed from the third direction, a width of the element body in the second direction is the largest at a central position in the first direction, and gradually decreases from the central portion in the first direction. When viewed from the third direction, a position in which a length from one end to another end of the conductive resin layer in the second direction is the largest is located closer to the one principal surface than the central position.

公开(公告)号：US12249467B2

公开(公告)日：2025-03-11

申请号：US18733322

申请日：2024-06-04

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Akitoshi Yoshii ,  Kyohei Takata

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/232

Abstract: A plurality of external electrodes are disposed on both ends of an element body. Each of the plurality of external electrodes includes a pair of electrode portions disposed on a pair of side surfaces and including a conductive resin layer. For each of the two conductive resin layers located on the same side surface, one conductive resin layer includes an edge opposing another conductive resin layer. The conductive resin layer includes a first region and a second region. The first region included a plurality of metal particles of a first content and a resin. The second region includes a plurality of metal particles of a second content smaller than the first content and a resin. The second region is located closer to the edge of the conductive resin layer than the first region, and includes the edge of the conductive resin layer.

公开(公告)号：US11763996B2

公开(公告)日：2023-09-19

申请号：US17881204

申请日：2022-08-04

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Koki Ito ,  Hideki Kaneko

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1218

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.