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公开(公告)号:US20230138154A1
公开(公告)日:2023-05-04
申请号:US17910612
申请日:2021-03-12
Applicant: TDK Corporation
Inventor: Kazuhiro YOSHIKAWA , Takeshi OOHASHI , Mitsuhiro TOMIKAWA , Futa GAKIYA , Akiyasu IIOKA , Kouichi TSUNODA , Kenichi YOSHIDA
IPC: H01L27/01
Abstract: An electronic component includes conductor layers and insulating resin layers which are alternately stacked on a substrate. One of the insulating resin layers positioned in the lowermost layer is smaller in thickness than the insulating resin layers, and the insulating resin layers are smaller in thermal expansion coefficient than the one of the insulating resin layers. Thus, an element that requires high processing accuracy, such as a capacitor, can be embedded in the insulating resin layer positioned in the lowermost layer and having a small thickness, and an element that requires a sufficient conductor thickness, such as an inductor, can be embedded in the insulating resin layers having a large thickness. In addition, since the insulating resin layers each have a small thermal expansion coefficient, the occurrence of warpage and peeling can be suppressed.
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公开(公告)号:US20210272757A1
公开(公告)日:2021-09-02
申请号:US17165339
申请日:2021-02-02
Applicant: TDK CORPORATION
Inventor: Yuuki ABURAKAWA , Tatsuo NAMIKAWA , Akiyasu IIOKA , Hitoshi SAITA , Kazuhiro YOSHIKAWA
IPC: H01G4/33 , H01G4/008 , H01L23/64 , H01L23/498 , H01G4/30
Abstract: Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.
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